Quality Control Engineer, ASQ Certified Six-Sigma Green Belt

Stuart L. Riley

**** ******** **.

McKinney, TX *5070-7455

Cell: 972-***-****

E-mail: ***********@*****.***

Overview

Quality (Yield) Engineer and Software Product Manager with over 15 years experience with Fortune 500 companies, and start-ups. Technical and management skills include Six-Sigma product improvement, organizational efficiency improvement, team leadership, consulting, and project management. Over 10 years experience managing projects with various teams of engineers, technicians and software developers.

Professional Summary

• Member American Society for Quality (ASQ)

• ASQ Certified Six-Sigma Green Belt

• Root cause analysis (RCA) and continuous improvement processes (CIP)

• Quality control consulting (semiconductor yield management)

• Statistics and statistical analysis

• Risk analysis and prioritization

• Software Product Management and technical sales for software products

• Programming languages: REXX, VBScript, VBA, Javascript and Java

• Other: XML/XSLT, HTML, WordPress, MySQL databases and SQL

Responsibilities and Achievements

2005 to 2009: Texas Instruments: Group Technical Staff, Quality (Yield Enhancement)

Responsibilities

• Quality Engineer responsible for product defect reduction

• Monitored product defect levels, set thresholds for action, and set priorities

• Performed root-cause analysis to identify sources of defects

• Led teams of Process Engineers to fix defect issues

• Led teams of Technicians on special projects

• Assessed risk of defects to customer

Achievements

• Drove methodology improvements within the organization, and created analysis applications to find sources of defects and drive to fix, resulting in improved product quality, reliability, and significant reductions in customer returns.

• Led team of Technicians to develop an expert database to document learning, which kept focus on the correct issues, significantly reducing time to source / fix issues.

1999 to 2005: HPL, Inc.: Technical Sales, Software Product Manager

Responsibilities

• Product Manager for software in semiconductor yield management and design

• Conducted market research and drove market penetration strategies

• Created product roadmaps and marketing collateral

• Responded to request for quotes (RFQ), and requests for information (RFI)

• Created technical sales documentation to describe use-case scenarios

• Created internal training documents for sales and development teams

• Created software product prototypes for the development teams

Achievements

• Moved sales and development teams beyond technical roadblocks that threatened market position, resulting in successful sales over the competition.

• Explained proper application of several industry methodologies to the management team, and how software products would work for the customer.

• Created software prototypes of key methodologies to demonstrate to management and developers how they can be made commercially viable.

• Worked with corporate lawyer to develop patent guidelines for developers. This resulted in more patent submissions by the development team.

1997 to 1999: KLA-Tencor: Quality (Yield Management) Senior Consultant

Responsibilities

• Consulting quality (yield management) engineer

• Applied my experience to train customers in quality (yield improvement) methods

• Demonstrated how to quantify product yield loss due to defects measured in line

• Demonstrated defect source analysis techniques (partitioning / root cause analysis)

• Provided feedback to sales and marketing to identify sales opportunities.

Achievements

• Identified a significant problem resulting in a 5 to 10% yield improvement for one customer within 3 weeks of engagement.

• Initiated and executed several new consulting offerings for the consulting team.

• Identified organizational and operational roadblocks at customer sites that hindered engagement success, and assisted customers in resolving those roadblocks.

Other Achievements While at IBM and LPA Software:

• Established OEM partnership for software product with a major semiconductor inspection supplier. Resulting in market penetration into Korea generating revenues in excess of $250,000

• Spearheaded effort to establish Japanese distributorship generating revenues in excess of $250,000.

• Created a statistically sound method for sampling defects on semiconductor wafers. This method has been applied commercially by major inspection companies as “die-based” sampling.

Education

B.S. in Physics, Illinois State University, Normal, Illinois

University of Vermont: Graduate courses in Physics and Electrical Engineering

Publications

• “A Simplified Approach to Die-Based Yield Analysis”, Semiconductor International, August, 2007, (pp. 47-51).

• “Applying a Defect Spatial Signature Analysis in a Production Fab”, Semiconductor International Web Exclusive, June 2005,

http://www.semiconductor.net/article/CA604355.html

• “The Use of Simulation Techniques to Analyze Defect Sampling and Yield Estimation Methodologies”, IEEE Conference on Yield Optimization and Test, Atlantic City, N.J.,

October, 2000.

• “Estimating the Impact of Defects on Yield from In-Line Defect Measurement Data”, Semiconductor International Web Exclusive, December 1999,

http://www.semiconductor.net/article/CA159964.html

• “Limitations to Estimating Yield Based on In-Line Defect Measurements”, Proceedings IEEE International Workshop on VLSI Systems, 1999 (pp. 46-54).

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