Engineer Project

T B AYYAPPAN

Email ID ****.**@*****.***, ************@*****.**.** Mob. Ph +919*********

Experience Summary:

• 8+ years of experience in PCB design and I have designed PCB’s for Aerospace, Telecom, Industrial and Military domain.

• 4+ years of experience in Footprint creation and verification

• Designed High speed high density Layouts up to 24 layers using blind/buried via technology.

• Designed high power application boards.

• Have good understanding of customer’s requirements, product technology and work practices.

• Experience in layout constraints settings.

• Experience in DFM, DFA and DFT Analysis.

• Experience in Rigid, Rigid flex & Flex PCB designs.

• Good knowledge of stack-up design.

• Gerber generation and checking using CAM350 Tool.

• Experience in documentation like PCB Guidelines, Processes, Checklists and Training materials.

Skill Set:

• Cadence Allegro 16.3

• C.I.D from IPC

• Mentor PADS Layout 2007

• Altium 6.9

• Cadence Orcad Layout

• Zuken Cadstar

• Mentor Expedition

• Cadence Orcad Capture

• CAM 350

Strengths:

• Self learning capability.

• Commitment & Hardworking.

• Excellent team handling capabilities to adhere to project schedules.

Education:

• Passed Diploma in Electronics and Communication Engineering with First Class (82%), April 2000, Directorate of Technical Education, Chennai.

• Passed in SSLC with First Class (68%), April 1994, State board of Tamil Nadu

Work Experience and Responsibilities:

iGATE PATNI - As a Technical lead Layout From October 2010 to Till Date

Project : Library Management activities

EDA tool used: Expedition 2005, CAM 350,PADS2007

This project gives me good experience to create complex footprint for automotive industry like CAP Carrier, Assembly module with complaint pins. I was involved in various activities through-out this 10 months duration of this project.

As an Onsite Coordinator-

• Requirement Analysis. – Understanding the requirements in right direction by applying the knowledge gained during previous releases

• Effort estimation and planning.

• Resolving the hardware dependency issues during the project by interacting with the customer and relevant technical Engineers.

• Interacting with the mechanical team for assembly and mounting requirement.

• Offshore interaction through conference calls, emails and Net Meeting.

As a Team Lead-

• Monitored and executed the project with the team of 10 Engineers.

• Preparing checklist and guidelines defined by Customer & Internal.

• Create and reviewed most of critical footprints

• Development of various technical standards and ensuring the implementation of the same.

• Interacting with the layout engineer and mechanical team for assembly and mounting requirement

• Ensuring that the quality of the delivered footprint is meeting the Customers standards

HCL TECHNOLOGIES LTD - From January 2006 to October 19, 2010

Role: Lead Engineer

Responsibilities include:

• Lead the project for 5 members team

• Board design for abroad customer requirement.

• Handled 24Layers on routing, which includes all SMD’s components like BGA and fine pitch component etc.,

• More than 150 Components are created as per Client Standards (Physical Symbol) in the Library development.

• Interacted with the customer through Tele-conferences and Mails

Tools Used:

Allegro, PADS, Altium, CAM 350

ENVENTURE TECHNOLOGIES, BANGALORE- July’04 to December’05.

Role: PCB Design Engineer

Responsibilities include:

• Board design as per customer requirement and footprint creation.

• Handled up to 12 Layers on routing, which includes all SMD’s components like BGA and fine pitch component etc.,

• Designed PCB’s for Automobile applications dedicatedly to KIMBALL ELECTRONICS, USA.

• Interacted with the US customer through Tele-conferences.

• Searched the datasheets on the Internet.

• Created more than 300 components (both Symbol and footprint) in the Library development.

• Prepared schematics for the projects based on the customer requirements.

• Prepared Bill of Material (BOM) for Electrical and Electronics components used on the projects.

Fields of Achievements:

I have done up to 12 layer concerned with Digital, Analog, high-speed design board. I have designed the board, with matching the length for about 120 CLOCK signal tracks, and its also consisting 3 BGAs. I have routed some critical signal. It also consists of 50 differential pairs.

Tools Used

• Orcad, Allegro, PADS, CAM 350, Protel 99SE

MULITECH SYSTEMS, BANGALORE - MAY’00 – JUNE’04

Role: PCB Design Engineer

Responsibilities include:

• Taken care of various aspects of board design, like Layer stack selection for Fabrication, DFM as per ISAC / LEOS / QCD standards.

• Solved the problems during the design phase, by co-ordination with the ISRO engineers.

• I have worked and interacted with different fields of companies both private and government, like telecommunication, instrumentation, space applications, defense, etc

• Designing of Single, Double & Multi layer PCB`s. Designed PCB`s for Power, Digital, Analog & High Frequency applications meeting all the required Specifications, Drawing schematics for all type of electronic circuit diagram and I have been experienced in the following areas also,

1. Schematic capture

2. Double sided PCB designs

3. Multi layer PCB designs from 4 to 10 layers.

4. Power plane designs

5. Split Power plane designs

6. High frequency designs

7. High Current designs

8. Design verification with all design constraints

9. SMD, ASIC, FPGA, BGA based designs

10. Post process outputs

11. NC drill creation and verification

12. Double side component-mounting designs etc.

13. Creating & Checking the Gerber & Plot files.

Tools Used

Orcad, Cadstar, CAM 350, VIEW2001

Fields of Achievements:

• I am responsible for the designing of high speed, extremely dense multi layer PCBs with numerous constraints for various customers. PCB Layout Design, Layer stack selection for Fabrication, DFM, Component library development for layout & Schematic. Train new design engineers, Quality control, Created components (Library) Including BGA, ASIC’s as per MIL standards.

• During this period I have designed around 200 PCBs as per MIL Standard Specifications, almost 90% of them were 4 to 10 layers MLB’s.

Some of the Representative Projects:

1. Project Name LIBRARY SYMBOL CREATION (Aero Space & Tele Communication)

Description Implantable drug delivery system programmable through an external control unit.

Key Challenges Project involves verification of schematic symbols and CAD footprints

Responsibilities Lead the team and comparing schematic symbols, attributes with Datasheets and Design Guide lines using orcad-capture.

Comparing CAD foot prints with specifications using Allegro Expert

Tools Used Cadence-Allegro 15.5.1, PADS2005, ALTIUM V6.7

2. Project Name SET TOP BOX

Description RF and Digital mixed PCB, to support multichannel Receivers

Key Challenges RF and Digital in single board of 10 layers. Board size 13.5 X 8.9 Sq. Inches. We have used standard material for Digital and Roger material in RF side. Challenges in using the Micro Tuner and Broad Logic Chips and their design concept by retaining. PCB consists of Digital and RF interface, DDR and DDR2 and RF side up converter, down converter, splitter, PI filters and couplers

Responsibilities Netlist import, Placement, Constraint driven Routing & Gerber release.

Tools Used Cadence-Allegro 15.2

3. Project Name Remote Electric Power Unit

Description The REPU is the main part of the Solid State Electrical Plant Management System for an aircraft. The scope of this unit in the system is to implement a secondary power distribution; This unit distributes electrical power to all final users in the aircraft and protects wiring from over current or other faults. Moreover, the REPU coupled with a Display is able to manage the basic plants of the aircraft.

Key Challenges CPU Power Module with Remote Control Circuit Breaker, CPU & Communication Module, DC Backplane

Responsibilities Lead the team and netlist import, Placement, Constraint driven Routing, 100% Test coverage & Gerber release.

Tools Used ALTIUM V6.9

4. Project Name OMAP Board

Description Its mixed technology impedance controlled 24 layer board. DDR and Ethernet interface used. This board is a part of media equipment.

Key Challenges High speed and HDI (High density interconnect) PCB Layout design,and define the layer stack up and impedance controlled with hardware engineer

Responsibilities Lead the team and comparing schematic symbols, attributes with Datasheets and Design Guide lines using orcad-capture.

Comparing CAD foot prints with specifications using Allegro.

Interaction with PCB FAB House and PCB assembly House.

Interaction with various teams like SI (signal integrity), PI (Power integrity) Mechanical Engineers and Thermal team.

DFX (Design for manufacturing, Design for Assembly and Design for Test) compliant updated in the PCB design.

PCB GERBER CAM checks

Tools Used Cadence-Allegro 16.2`

5. Project Name Liquid Flow Controller

Description The liquid flow controller (LFC) has the capability to provide high accuracy, low flow rate and high repeatability of liquid flow control. The hardware system of the LFC generates very precise control signal to excite an ultra sound sensor and detect the received ultra sound signal. The LFC hardware system also quickly processes the received signal to determine the time delay difference between two directional ultra sound signals, hence the flow speed of liquid.

Key Challenges TMS320C6414 -5E0 DSP routing, FPGA and Jitter signal

Responsibilities Netlist import, Placement, Constraint driven routing & Gerber release

Tools Used Cadence-Allegro 15.2

6. Project Name Raptor - SDS

Description Its mixed technology impedance controlled 6 layer board. DAA modem and Ethernet interface used. This board is a part of medical equipment.

Key Challenges It is a low cost 6-layer compact design.

Responsibilities Netlist import, Placement, Constraint driven Routing & Gerber release.

Tools Used Cadence-Allegro 15.2

7. Project Name THERMAL CONTROLLER

Description It’s a mixed technology 12 layer PCB with impedance control. Hi Speed USB interface is used. Special care taken to route sensitive analog signals.

Key Challenges Sensitive analog signals

Responsibilities Netlist import, Placement, Constraint driven Routing & Gerber release.

Tools Used Zuken Cadstar

Personal Details:

Date of Birth : 06-07-1979

Sex : Male

Marital Status : Married

Languages Known : English, Tamil, Kannada, Sourashtra,

Current Location : Thane - Mumbai

Willingness to Relocate : Yes.

Passport No : F2082895

I here by that the information furnished above are true to best of my knowledge.

T.B.Ayyappan

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