William R. Mooney
Newtown PA. ***40
*******@*******.***
Objective
To secure a position as a P.C. Designer with the opportunity for growth and advancement in the field of Engineering.
Software Experience
• Altium Designer Summer 09 • PCAD 2006
• PADS V9.4 • Mentor Graphics Board Station
• Mentor Graphics Design Architect • Mentor Graphics Test Layout
• Mentor Graphics HyperLynx GHZ
• AutoCad 2010 • Cadcam 350
• Spectra Autorouter • Microsoft Project, Word, Excel, Access 2010
Work Experience
11/10 to Senior Design Engineer, Flexible Circuits Inc., Warrington, PA
Present
• Design high density multi-layer Rigid/FLEX Printed Circuit Boards using PADS V9.4 and Altium software, up to 35 layers. These boards have double sided surface mount components with multiple fine line BGA’s and blind vias.
• Analyze Rigid and Rigid Flex boards for signal integrity issues using Mentor Graphic HyperLynx software. This includes crosstalk analysis and power distribution issues.
• Used multiple standards for designing P.C. Boards including IPC-610 and Mil standards per customer requirements. Many of our customers are large military companies with specific company requirements.
• Created material stackups for Rigid/FLEX Printed Circuit Boards, includes boards with up to 50 sets of differential pairs, high current and high speed signals up to 15 GHZ.
• Interface with customers in product design cycle to help define rigid/Flex boards that meet customers electrical and manufacturing requirements. This includes traveling to customer sites and working with their engineering groups.
• Responsible for creating documentation including fabrication drawings, assembly drawings, schematics and Bill of Materials using AutoCad, CircuitCAM and EXCEL software.
• Define differential and character impedance traces using Polar software to define trace size, spacing and material spacing to achieve correct impedance.
• Analyze Rigid FLEX board failures using Phoenix X-RAY machine along with microsectioning to understand failures and change processes to achieve higher board yields.
11/99 to Senior PCB Designer, Ulticom, Inc., Mount Laurel, NJ
11/10
• Designed high density multi-layer Printed Circuit Boards using PCAD and Altium software. These boards have double sided surface mount components with multiple fine line BGA’s and blind vias.
• Supervised PCB Designers and documentation personnel (included assigning tasks, creating schedules and writing reviews).
• Trained on and used Spectra Autorouter to help route a variety of Printed Circuit Boards.
• Conducted necessary research in order to ensure all components in product line met European directive 2002/95/EC(RoHS) and found substitute components if not compliant. For auditing purposes gathered and maintained documentation for RoHS compliant components.
• Develop and maintain TL9000 procedures pertaining to documentation and design.
• Responsible for acquiring and incorporating IPC Specifications.
• Trained on Inventory and Bill of Material modules in Oracle system in order to set up and maintain an inventory of part numbers.
• Used Autocad software to design and maintain front panel bracket for PCI, PCI express and other telecom standard boards.
9/98 to Senior PCB Designer, Paradigm Computer Systems, Chalfont, PA
11/99
• Designed a variety of Printed Circuit Boards, which included double sided components, multi-layer surface mount boards with BGA’s up to 16 layers using Pads-PCB software.
• Designed, implemented and maintained a numbering system to track all components related to product development.
• Created and maintained a library for Pads-PCB software based on IPC standards.
6/94 to Senior PCB Designer, Interdigital Communications Corp., King of Prussia, PA
9/98
• Using Mentor Graphics Board Station on a UNIX based system and Pads-Pcb software, designed high density multi-layer Printed Circuit Boards.
• Designed a variety of high frequency, impedance controlled RF Printed Circuit Boards for wireless telecom applications.
• Trained on and used Cooper and Chayn autorouter software on a variety of Printed Circuit Boards, which included differential pairs and split planes.
• Responsible for acquiring and incorporating IPC specifications and procedures.
• Trained on and used Mentor Graphics Design Architect schematic software.
• Trained on and used Mentor Graphics Test Layout software for installation of test nodes used for ICT testing.
7/90 to Senior Designer, DA-TECH Corporation, Ivyland, PA
6/94
• Using Pads-PCB software designed a variety of Printed Circuit Boards, which included double sided components, multi-layer surface mount boards up to 16 layers.
• Involved in estimating and quoting jobs (included calculating engineering, testing and manufacturing costs).
2/83 to Designer, EG&G Princeton Applied Research, Princeton, NJ
7/90
• Designed a variety of Printed Circuit Boards using Racal-Redac and Pads-Pcb software. Also designed multi-layer flex circuit boards.
• Created schematics using CALOS schematic software.
• Created and maintained a library for Pads-Pcb and CALOS schematic software.
• Responsible for training co-workers on Pads-Pcb software and CALOS schematic software.
• Trained on and used Cadkey mechanical software.
Education
Trenton State College, Trenton, New Jersey. January 1989 to May 1991.
Earned 21 Credits in the area of Computer Science.
Bucks County Community College, Newtown, Pennsylvania. July 1984 to December 1988.
Earned 71 Credits in the areas of Computer Science and Engineering.
Lincoln Technical Institute, Pennsauken, New Jersey. December 1981 to December 1982.
Earned certificate in Drafting.
References
Available upon request.