Stress Engineer/Product Development Engineer/ Design Engineer

MURUGAN SUNDARAM RAMASAMY

*** * **** ** #*** Arlington, Tx-76010 Ph- 817-***-**** *******.*********@*****.***

SUMMARY

• 3 years Experience in Product development, Stress Engineering and optimization - Single tooth bevel gear fatigue test rig (India Piston Rings), Weed remover (Farming Equipment - Independent Client).

• Developed & studied the stress concentration factor for plate with dent (Master’s thesis).

• Certified Professional in CAD & Finite Element Analysis(structures & thermal)

• Industrial light and medium duty axial fan Design & Manufacturing support in Flakt Woods.

• Proficient user of CAE tools like Autocad, Catia, Ansys & Pro/e in academic as well as in industrial environment.

ACADEMIC DETAILS

• Masters in Aerospace Engineering, Dec 2011

Department of Aerospace Engineering

University of Texas at Arlington, TX GPA: 3.625/4

• Bachelors in Mechanical Engineering, May 2008

Department of Mechanical Engineering

Anna University, INDIA GPA: 3.5/4

• Professional in Mechanical CADD, March 2007

CADD Centre Training Services, India

WORK EXPERIENCE

Graduate Research Assistant, University of Texas at Arlington (August, 2009 - December,2011)

• Stress Analyst

• Development/ Experimental analysis of Sheet metal plates, Concrete filled steel tubes.

• Stress Concentration factor of Sheet metal plates with permanent plastic deformation-

Stress concentration Factor was found for plate with dents by creating a dent and comparing results and behavior of plate with previous studies. Implementation of static and dynamic FEA in Ansys APDL and Workbench 12.1. (Master’s Thesis)

Mechanical Design Engineer, CADD Center Services, India (June, 2007-August, 2008)

• Consultations for conceptual mechanical design of machinery.

• Certified training professional for manufacturing companies(Catia V5,Autocad, Pro/E,Ansys)

• Stress Analysis of new products

• Optimization of Farming equipment-weed remover

• Design Review and drawing support

Technical Trainee, Fläkt Woods, India, (June-August,2006)

• Trained in various techniques involved in sheet metal fabrication.

• Monitored measurement for quality control during sheet metal processing.

• Design of light and medium duty fans (axial flow)

• Gained knowledge in Acoustic and structural optimization of fan blades.

TECHNICAL SKILL SUMMARY

Drafting software : AutoCAD

Modeling software : Pro/ENGINEER, SolidWorks, CATIA(Certified)

Analysis software : ANSYS, ANSYS Workbench, Icepak, Abaqus,

Nastran/Patran

Programming Languages: MATLAB 7.1

Simulators : Simulink, Labview

Product Development & Fabrication PROJECTS:

• Optimization of Farming Equipment – Weed Remover, for farming sector resulting in 50% cost reduction. Extensive use of Catia V5 and design concepts. Customers Requirements was met to reduce weight and cost by 35% and 50% respectively.(SAE standards)

• Design, fabrication & testing of Subsonic wind tunnel (Crescent Engineering College, Aerodynamics lab equipment)

Study of aerodynamic concepts involved in wind tunnel. Various NACA and RAF aerofoil

Profiles were analyzed in the wind tunnel for calibration purpose.

Full practical use of the machine shop and testing equipment.

• Design of single tooth bending fatigue test rig for straight bevel gear:

Three different fatigue test rig for bevel gear was developed using previous work done and presented to “India Piston Rings, Pvt ltd”, extensive use of Hydraulic controls, CATIA V5, Autocad & ANSYS 10.0. Sound knowledge of jigs and fixtures.

Data analysis using Microsoft excel was done to compare the efficiencies.

ACADEMIC PROJECTS:

• Thermal Enhancement Of Stacked Dies Using Thermal Vias:

Proficient use of Pro/e, Fluent Icepak & IcePro in design and analysis of different stacked dies.

This project is a comparative study on the thermal transfer with and without the Thermal vias in various

Chip scale architectures.

Use of FEM concepts.

• One Dimensional Analysis of Thin Plate Composites- Formulated new technique to analyze composite plates in one dimension. Analysis of orthotropic material in 1D rather than 3D.

• Thermal efficiency of Heat dissipating techniques in electronic packaging- Data analysis of various thermal interface materials were found out and a structured model was created for application purpose in chip scale packaging in electronic components. Use of Ansys-Fluent-Icepak & ANSYS 11.0.

ACHIEVEMENTS

• Recipient of Masters Dean Fellowship 2008 to 2010 at UTA.

• Recipient of Texas Public Education Grant 2010 to 2011 at UTA.

• Member of “The Golden Key Honors Society”

• Participated in the first SAE Cart Baja held in India.

• Recipient of the title “Champion” in all South India aeromodelling competition in SAE India.

• Member of the organizing team of the SAE India Convention 2006.

• Member of the Anna university field hockey team 2005-2008.

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