Mechanical Engineering
Resume:
Wei Zhao, Ph.D.
Port Jefferson Station, NY, 11776
Mobile:631-***-****
Email: ***.****.*@*****.***
OBJECTIVE
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Seeking a R&D position in Semiconductor Wafer Process, Metrology Measurements, Tribology/Contact Mechanics, Failure Analysis, Quality & Reliability to exercise my expertise in Mechanical Engineering or Materials Science.
EDUCATION
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@Ph.D, Mechanical Engineering, State Univ. of New York, Stony Brook (US) GPA: 3.67/4 (Top 1%) May 2010
Dessertation¡°Quantitative Measurement of Nanomechanical Properties in Composite Materials¡± Advisor, Chad.S. Korach
@M.E., Engineering Mechanics, Dalian University of Technology (China) GPA: 3.76/4 (Top 2%) July 2006
Thesis'Non-destructive Detection for Composite Delamination by Wavelets and Neural Networks', Advisor, Haoran Chen
@B.E., Engineering Mechanics, Dalian University of Technology (China) GPA: 3.73/4 (Top 5%) July 2003
SKILLS
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Tribology: CMP of Si wafer w/ Cu/low-K film, Silica and Polyurethane films, Characterization using AFM, AFAM, Profilometer, Nano-Indentation or Tribometer.
Materials Science: Composites, Polymer film, Characterization/Metrology using Micro-Raman, SEM, FTIR, XRD or Optical Microscopy,
Micro Fabrication: PVD, CVD, Photo lithography.
Mechanical Eng: Design (Pro/Engineer), FEA (ANSYS), Experimental Mechanics (MTS, TGA, DMA, Load Cell).
Software: Matlab, Fortran, C, Mathmatica, Maple, Origin-Lab, Sigma-Plot.
RESEARCH EXPERIENCE
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@Research Assistant, State University of New York, Stony Brook, USA Aug 2006 ¨C July 2010
**Chemical Mechanical Planarization and Characterization for Semiconductors:
>Wear mechanics analog on the Cu/Low-k film semiconductor wafer for in depth understanding of Chemical Mechanical Planarization (CMP) by diamond probe on AFM.
>CMP slurry particle analog on Polyurethane and Silica substrates at by silica probe on AFM/Nanotest.
>Profilometer and AFM measurements of Polyurethane polishing pad and Cu/Low-k film semiconductor surface.
>Modified SC1 organic contaminant removal cleaning for Glass, Semiconductors wafers before measurements.
>Surface properties measurements of semiconductor die regions with submicron length scale pattern by AFM/SEM.
>Adhesion measurements of the probe-sample interaction by AFM for different kinds of thin films.
>Membrane film biomedical sensors design and fabrication with micron size circuits by CVD/PVD/Etch.
>Nanomechanical properties quantitatively characterization for Cu/Low-k film by AFAM and AFM indentation.
>Failure analysis for applying contact mechanics and tribology principals in quantitative determination on AFM.
>Semiconductor/Metal surface chemical recognition by Energy Dispersive x-ray Spectroscopy (EDS) on SEM.
**Metrology/Characterizations for Tribology, Contact Mechanics and Surface Sciences:
>Ball-on-Disk Tribology measurements on thin film coated ceramics composite materials with different portions.
>Routine AFM probe geometry characterization (<20 nm radii) by SEM for quantitative determination.
Design of different contact probe profile on AFM for investigation of contact mechanics principle suitability.
>Thin polymers films chemical degradation quantification and investigation by Raman and FTIR.
>Root cause analyses for the reduction of repeatable errors and helps the design of experiments in research.
**Mechanical Design for Equipment Development and Surface Deposition for Sample Preparations:
>Nanotest liquid cell design and its application in different kinds of measurements in liquid environments.
>Physical and Chemical Vapor Deposition on silicon chip and other substrate for sample preparation purposes.
@Research Assistant, State Key Lab of Structural Analysis for Industrial Equipment, China Aug 2003 - July 2006
**FBG sensor strain and temperature fields monitored AGS laminates processing by soft-mold aided co-curing .
**Failure analysis and delamination prediction of composites filament wound vessel under different foreign impacts.
INDUSTRIAL EXPERIENCE
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@Consultant, Shanghai Pubang Mechanism and Electric Manufacture Co., Ltd, Shanghai, China 2009~2010
*Assisted in exhibitions, business relations and technical supports for the North America sales.
@Consultant,Dalian Copper Pipe Musical Instrument Co., Ltd, Dalian, China 2007~2009
Assisted in exhibitions, business relations and technical supports for the North America sales.
@Internship, Dalian Copper Pipe Musical Instrument Co., Ltd, Dalian, China Summer 2004~2006
**Materials selections and CAD drafting in musical instruments designs, and prepared materials for internal training.
**Assisted in the communications with the international sales forces and white papers internal reports.
HONORS & AWARDS
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Graduate Research Assistantship Award State Univ. of New York (NSF, US) 2006~2010
Presidential Fellowship Award State Univ. of New York 2006
Graduate Research Assistantship & Scholarship Award Dalian Univ. of Tech (NSFC, China) 2003~2006
AFFILIATION
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Member ASME, SEM, STLE, MRS
Team Leaders of Business Competition Plan Team (2003), Graduate School Soccer Team (2004)
Organizer of Engineering Mechanics Department Student Study Activities (1999~2003)
SELECTED PUBLICATIONS
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>Zhao W, Korach C.S., Quantitative Surface Characterization of the Nanomechanical Properties of semiconductor wafers with sub 100 nm features. (In Prepare)
>Zhao W, Korach C.S., Probe Geometry Affects to Atomic Force Acoustic Microscopy Quantitative Determination, Polymer Testing, (under review)
>Zhao W, Korach C.S., Nanomechanical Properties of Environmentally Degraded Carbon Fiber Epoxy Composite Interphases, Composites Science and Technology, (under review)
>Zhao W, C, Cao, Korach C.S., Measurement of Structural Variations in Enamel Nanomechanical Properties using Atomic Force Acoustic Microscopy,(under review)
>Zhao W, Singh R.P, Korach C.S., Effects of Environmental Degradation on Near-Fiber Nanomechanical Properties, Composites: Part A, 40:675-678 (2009).
>Zhao W, Chen H, Delamination Detection by Using Mode Frequency in Conjunction with Wavelet Analysis and Neural Networks. Acta Materiae Compositae Sinica, 22:99-102 (2005).
>Sun H, Wang Y, Zhao W, Liu C, Comparison of Theories for Stability of Truss Structures- Part 2: Computation of Critical Solution of Stability, Commun Nonlinear Sci Numer Simulat, 14: 1710-1720 (2009).
>Sun H, Wang Y, Zhao W, Comparison of Theories for Stability of Truss Structures- Part 1: Computation of Critical Load, Commun Nonlinear Sci Numer Simulat, 14: 1700-1710 (2009).
Chen H, Ren M, Zhao W, Review of Multi-Field Coupling Analysis for Composite Filament Wound Shell Structure During Manufacture and Service Periods. Advances in Mechanics Sinica, 37-2: 233-245 (2007).
>Zheng C, Ren M, Zhao W, Chen H, Delamination Prediction of Composite Filament Wound Vessel with Metal Liner Under Low Velocity Impact. Composite Structures. 75: 387-392 (2006).
>Zhao W, C. Cao, Korach C.S, Measurement of Structural Vibrations in Enamel Nanomechanical Properties using Quantitative Atomic Force Acoustic Microscopy, SEM Annual Conference and Exposition, June, 2010,Indianapolis, TN.
>Zhao W, Korach C.S, Measurement of Epoxy Stiffness by Atomic Force Acoustic Microscopy, ASME International Mechanical Engineering Congress & Exposition, Lake Buena Vista, FL,US. November, 2009.
>Zhao W, Korach C.S, Environmental Effects on Carbon Fiber Reinforced Epoxy Composites Measured by Atomic Force Acoustic Microscopy, ASME, IMECE, Lake Buena Vista, FL, US. November, 2009.
>Zhao W, Korach C.S, Measurement of Fiber Reinforced Composites Epoxy Stiffness by Atomic Force Acoustic Microscopy, SEM Annual Conference, Albuquerque, NM, US. June, 2009.
>Zhao W, Korach C.S., Singh P.R., Nanomechanical Response of the Fiber-Matrix Interphase Stiffness for Degraded Carbon Fiber Reinforced Composites, ASME, IMECE, Boston, MA, US. November, 2008.
>Zhao W, Korach C.S., Kumar J, Singh P.R., Environmental Degradation of the Fiber-Matrix Interphase in Carbon Fiber Reinforced Composites, SEM Annual Conference, Orlando, FL, US. June, 2008.
>Zhao W, Singh P.R., Korach C.S., Effects of Environmental Degradation on Near-Fiber Nanomechanical Properties, ASME, IMECE, Seattle, WA, US. November, 2007
>Zhao W, Singh P.R., Korach C.S. Degradation of Fiber-Matrix Interphase in CFRP Composites Subjected to Environmental Degradation, SEM Annual Conference, Springfield, MA, June, 2007.
>Korach C.S, O. Sha, Zhao W, The Effect of PH Levels and Exposure Times on Polyurethane Scratch Resistance, STLE, Lake Buena Vista, FL, US. May, 2009.
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