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Engineer Test

Location:
Los Angeles, CA
Posted:
February 22, 2011

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Resume:

BRIAN TAHAMZADEH

***** *** ****** **

Mission Viejo, CA 92692

TEL: 949-***-****

Cell: 949-***-****

Email: ******@*********.***

OBJECTIVE: To secure a challenging H/W signal integrity, EMI test or validation Engineering position in the field of electronics or related area with a company that will offer growth and make effective use of my hands-on training.

EDUCATION:

University of Tehran Iran, BSEE Electronic Engineering. Conferral May1985.

Shiraz Institute of Technology: Shiraz, Iran. December 1981

Associate degree in Computer Science Programming.

Test Equipment: Oscilloscope, Frequency Counter, Network Analyzer, Spectrum Analyzer, PCIe and USB2.0 & 3.0, SATA/SAS Serial Bus Analyzer, Data and RF Generator, BERT and AWG Tester. TekExpress & SerialExpress MOI package (HP and Tektronix ). Full SATA6G and USB3.0 , USB-IF compliance testing.

Computer Knowledge: Programming in C & C++, Visual Basic and Labview10.0, Good Understanding of UNIX, LINUX, Windows XP, VISTA and Winodws7.

EMPLOYMENT HISTORY:

Western Digital Corp. Irvine, CA.

June 2007- January 2011.

Job Title: Sr. Principal Signal Integrity / EMI, Reliability Engineer.

Duties: Full Signal Integrity Analysis on, PATA, SATA & SAS 1.5/3.0 and 6Ghz drives, including USB3.0, 5Ghighspeed and SSD (Solid State Disk, Flash Base drives). Validating Rx & Tx signals for RT-Eye and full Jitter measurements (DJ, ISI & TJ). Measuring Return & Insertion Loss for Near and Far End sensitivity testing using Agilent VNA and DCA6100A test equipments. Working closely with PCB layout designers and EMC engineers to verify proper PCB layout. stack up trace routing on high speed differential pairs, including impedance matching, power planes to comply with EMC radiated and immunity testing. Working closely with(System Reliability Engineering) to complete all system level Temperature cycle & Shock/Vibration testing. Complete PCBA, BGA, Head Stack Assembly qualification using Temp shock, humidity chambers up to 3000 cycles (125C/-40C). Validate full signal integrity qualifications on different range of OEM Servers, Mass Storage system, DVR, Satellite Set Top boxes, Notebooks and desktop PC, using Tektronix TDS8000 and Agilent BERT scopes. Full FCC, CE class B, EMI/RFI, Radiation / Immunity compliance certification testing using inside 3M and outside 10M Chamber labs for up to 30Ghz. Labview test automation controlling Tek6804B Scope & HP8504E Spectrum Anlayzer to fully automate Signal Integrity testing of SATA & SAS drives.

Magtek Inc. Carson, CA.

June 2004- May 2007.

Job Title: Sr. EMC / Validation Test Engineer.

Duties: Take all new products to EMC Test Labs and debug all radiated and conducted emission issues for FCC part 15, CISPR 22, class B certifications. Fix any issues with USB and Ethernet interface ports. Build and setup Pre-Compliance kit using Agilent E7405 Spectrum Analyzer. Validate USB 1.1 & 2.0 (full speed and high speed ) using TDS7404 and USB2.0 software to measure eye diagram, chirp, J& K Tests, suspend, resume and current tests. Check jitter measurements on D+, D- , differential lines, plus rise and fall time. Using CATC, USB protocol Analyzer to debug transaction issues. Full PCB layout and Signal Integrity/ EMC simulation using CADENCE Allegro & EMSAT tools. ESD and Latch up testing. Board level and system level MTBF, MIL-217 & Bellcore reliability analysis using “items” software. Develope DVT, Reliability tests and validation procedures for each new product. Using labview 8.1 for test automation for product reliability tests...

Balboa Instruments Inc. Tustin, CA.

January 2003-July 2004, Contract Position, Full Time.

Job Title: Sr. Mfg Test Engineer.

Duties: Generate board level ICT test program and test fixture design on HP3070 ICT tester. Design functional test setup and develop test program using National Instrument PXI, and Labview 7.1 to generate functional test programs to test all Pool and SPA system control boards. Working closely with Mfg and quality engineers to improve board level and system level yield and product quality. Working with Design engineers from start to end of each design for full DFT & DFM related issue on new and existing products.

Irvine Sensors Corp. Costa Mesa, CA.

March 2002- January 2003: Consulting Position, Full Time Contract. Six Months

Job Title: Sr. H/W Validation Test Engineer.

Duties: Full ASIC Validation on Laser Guided Imaging Die, running at two 500MHz internal Clocks. Design Test Fixtures using ORCAD and PCAD for PCB Design and using Xilinx FPGA for implementing test logics into the test fixture. Generating test automation using National Instrument PCI DAQ and Labview 6.1 to test and validate all new Die’s using Micro probing technique and Chip on Board for Vth, Mux, full FIFO and End to End functional test.

STM Wireless Inc. Irvine CA.

November 2001 – Jun 2002.

Job Title: Sr. Mfg Test Engineer.

Duties: Support manufacturing floor for all board and system level test setup and configuration on C-Band, L-Band and Ku-Band satellite modems and network Hub’s. Writing production test / debug procedures, plus test automation tools using National Instrument Lab View 6.1 for Windows and RF Switches DC-18GHz. Working closely with H/W design team during design phase to design test fixtures using ORCAD to validate and debug Digital, Analog and RF boards for new design, complete DVT test procedures. Extensive knowledge of RF design, Phase noise, and spurious measurement. Using Spectrum Analyzer, Power Meter, Signal & RF Generator, BER Tester and Logic Analyzer. RF Test Equipments Calibration and Rental Scheduling. Supervise and train all Mfg Technicians. Contract Full Time Position. Six Months.

DSS Networks Inc. Irvine CA.

September 2000 – May 2006.

Job Title: Sr. H/W Design & Validation Engineer. Contract Part Time, Long Term.

Duties: Schematic Capture, using ORCAD & McCad for board level design and PCAD for layout. Test development, Troubleshooting, Debug and Signal Integrity on all new PCI, PCI-X, PMC and cPCI Gigabit Single/Dual Ports, Including Copper and Fiber boards up to 8 layers Network Cards using Intel PCI Bridge, National, Intel and Broadcom Gigabit MAC / PHY plus Marvell, Vittesse or Agilent SERDES. Complete FCC (Part 15), CE and UL Test certification using third party test labs. Contract Part time long term position.

Rainbow Technology, Inc. Irvine CA.

Sept 1999 - Nov 2001.

Job Title: Sr. H/W Test Engineer. Laid Off

Duties: Working closely with Sr. H/W Design Engineers to develop and troubleshoot all new PCI, CPCI and PMC Cryptographic SSL accelerator boards in Linux and Windows NT Platforms using Catalyst PCI Bus Analyzer. Evaluate test equipments and furniture’s to layout Hardware Engineering Lab. Complete DVT Test Procedures and reports for full characterization and validation of all new designs. Complete FCC (Part 15), CE and UL Test reports using third parties test labs. Complete full DVT and Compliance tests on Cryptographic SSL Network Proxy Accelerator server. Complete troubleshoot and debugging USB low and full speed iKey Tokens using USB Bus Analyzer, Tektronix USB Compliance test package. Full DVT and Environmental test reports, plus Compliance tests on USB ikey modules. Automate DVT Test procedures using National Instrument Lookout and Labview software interfacing Fieldpoint Analog I/O, Data Acquisition and Relay modules to control programmable power supply Test Chamber. Monitor and logging data for all electrical parameters like In-Rush Current, Voltage Droop and temperatures data. Test Equipments Calibration and Rental Scheduling.

Viking Components Inc., Rancho Santa Margarita CA.

Nov 1997, Sept 1999.

Job Title: Sr Test Engineer.

Duties: Design SDRAM, PC100, PC133, DDR and Rambus memory modules for PC’s and Servers. Schematic captures and board layout for test fixtures using ORCAD &ACCELL EDA. Develop test procedure to test all different type of high-speed memory modules using HP83000 F330I and Advantest Rambus ATE and GenRad in circuit tester. Develop DVT test procedures on all new memory modules for signal integrity and AC-DC characterization using Tektronix TDS694C Oscilloscope and HP 10674, logic analyzer. Troubleshoot and analyze all field failure returned modules from OEM and write corrective action reports for all failures and developing new test using ATE testers. Supervise & Train technicians.

Western Digital Corp. Irvine CA.

Sept 1996 To Nov 1997.

Job Title: Sr. Validation Engineer. Laid Off

Duties: Test and Validate R/W Channel Chip for Analog and Digital Blocks. Design the Test Bed to simulate hardware environment using ICE (In Circuit Emulator, Intel 8xc196 NU & NP) using NOHAUE Software for mapping memory Blocks of the Test Bed. Using Altera and Lattice FPGA (7000 & 8000) series to design logic’s and ORCAD tools for schematic capture. Writing and translating Sims in Verilog and using Visual C++ on UNIX to simulate and correlate the Sims against Test Bed. Troubleshoot and upgrade the test Bed according to the latest changes to the R/W Channel chip specification. Using Arbitrary Waveform Generator, HP and Tektronix Logic Analyzer (16550C & TLA 700), Lecroy 10G Sampling Scope and Microprobing for Validating the analog Blocks.

LATTICE CORPORATION, Hillsboro OR.

Oct 1994 To Sept 1996.

Job Title: Component Test Engineer. Moved to CA.

Duties: Test and debug devices for characterization and validation of all GAL, pLSI and PLD parts

Using Credence ATE, Semiconductor Analyzer, Pulse Generator Tek HFS 9003, Sampling Scope Tek 11801A,

Data Generator HP800A, DC Power Supply and DVM to analyze signals level for Tpd, Tco, Tsu, Fmax,

Input translator and Glitch. Write test programs for ATE. Collect and Graph data using MS Word and Excel.

INTEL CORPORATION. Hillsboro OR.

May 1992 - Oct 1994

Job Title: Hardware Engineer Assistant. Contract Long Term.

Duties: Build Prototype Board PCI Card for 486/Pentium base Processor, Fax /Data and DSVD Telephony internal board. Draw Schematics using ORCAD and CADANCE, Debug and troubleshoot the Prototype 1and 2, in order to pass FCC and LU Test. Build test station for Functional test and reliability test. SMT Soldering and repair the boards for Remote LAN Access network Server product. Build, Test and configured systems for LAN/WAN network using network and ISDN Cards. Build Test setup for the server to pass FCC and EMI Test. Using SPEED, MAX and EXCEL Spreadsheet for BOM and Data Collections. Contract Job.

Status: US Citizen

REFERENCES: Available upon request.



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