Engineer Process

Ahsan Rizvi

*** *** ******

Albany, NY *****

Email: **************@*****.***

Cell: 518-***-****

Education

M.S: Nanoscale Science December, 2009

College of Nanoscale Science and Engineering, State University of New York, Albany, NY

Professional Experience

Semiconductor Process Engineer, IBM Watson Research Center, Yorktown heights, NY January 2011 – Present

• Develop and characterize thin film (Ta, TaN, Cu, Ti, TiN, Al, Silicide, HfO2, Al2O3, and W) deposition processes in support of many research projects in areas ranging from ex-treme scaling of CMOS, Photovoltaic and other exploratory/next generation devices.

• Operation and maintenance of 200 mm production-scale thin film deposition tools in a research/pilot fabrication facility.

• Optimize and drive improvements for processes and recipes to meet quality, reliability, yield, process stability, and productivity requirements.

• Engineering analysis by applying principles of DOE and SPC to film processes.

• Hands-on experience using Applied Materials Endura PVD systems, Novellus CVD sys-tem and Cambridge Nanotech Fiji ALD system for thin film process development and deposition.

• PECVD processes for SiN and Oxide using Applied Materials Centrua systems.

• Manage tools qualification and perform target change/qualification in thin film deposition tools. Responsible for WIP (Work in Progress) in thin film deposition sector.

• Reactive Ion Etching (RIE) processes using end-point systems in AMAT Etch Centura ICP/DPS.

• Calibrate etch rate of various chemicals. Perform oxide and Cu etching to requested thickness before metal deposition using different chemistries.

• Metrology and analysis using SEM, 4-point probe and Ellipsometry measurement. Per-form FM check on chambers in thin film deposition tools.

• Train new engineers on thin film deposition tools and various FEOL/BEOL platforms.

Semiconductor/Nanotechnology Skills

• Physical Vapor Deposition (PVD), Chemical Vapor Deposition(CVD), Atomic Layer Deposition (ALD), Spin-on Coating, PECVD, LPCVD, Electron Beam Lithography & Optical Lithography, PDMS Replica Molding

Analytical Techniques

• Rutherford Backscattering Spectroscopy (RBS), Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), Auger Electron Spectroscopy (AES), Ellipsometry

• X-ray Photoelectron Spectroscopy (XPS), Profilometery, 4-Point Probe, Fourier Trans-form Infrared (FTIR) Spectroscopy, Optical Microscopy

IT Skills

• C/C++, Java, Visual Basic, Microsoft Office (Word, PowerPoint, Excel, Access, Visio)

• Unix, Linux and Windows Operating Systems

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