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Senior Mechanical Engineer (FEA/MEMS)

Redmond, Washington, 98052, United States
March 21, 2011

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Yunfei Ma

***** ** **** **.

Redmond, WA *****

206-***-**** (M)


• Innovative Senior Engineer with over three (3+) years of MEMS product development experience in a public high-tech company

• Self-motivated, goal-oriented and adaptive individual who has an excellent sense of business and teamwork


• Ten (10) years of experience in finite element modeling and analysis (mechanical, thermal, magnetic, including dynamics, nonlinearities, buckling and other effects) on various kinds of mechanical structures from heavy equipments to silicon MEMS product

• Over three (3+) years of hands-on experience with reliability testing/analysis for MEMS product

• Over ten (10+) publications in structural analysis, material modeling and MEMS design on prominent scientific journals (APL, Acta Materialia, IJMS, SPIE proceedings) with two (2) U.S. patents


July 2007 – Jan 2011 MicroVision Inc., Redmond, WA

Senior MEMS design engineer

• Designed and analyzed electromagnetic MEMS scanner for imaging display applications using FEA tools (ANSYS, Ansoft/Maxwell) from concept to production

• Developed lumped parameter model to analyze the mechanical/thermal/optical nonlinear behavior of the MEMS scanner using Matlab/Simulink

• Conducted mechanical/thermal FEA on MEMS packaging stress to improve the MEMS package design and cost reduction

• Designed and analyzed the piezoresistive strain sensor for MEMS optical scanners using ANSYS/Multiphysics and improved the sensitivity gauge factor by 100%

• Created the DOE (design of experiments) and HTALT (high temperature accelerated life test) plan for design failure mode and effect analysis (DFMEA) with hands on experience in the lab and clean room

• Worked closely with process engineers and manufacturing partners to design the EVT (Engineering Validation Test) plan and review the test data to determine the specifications and requirements

Jan 2006 – July 2007 University of Washington, WA

Graduate Research Assistant, Department of Mechanical Engineering

• Researched the mechanical and magnetic behavior of ferromagnetic shape memory materials by proposed novel twin variant structure analysis method

• Proposed a constrained theory to study the magnetic field induced strain in ferromagnetic shape memory actuators

• Developed a simulation method to visualize the 3D domain switching in the microstructure of magnetostrictive materials

• Supported lab instruction, grading, and office hours for several undergraduate/graduate courses (Mechanical Vibration, Automatic Control, Adhesion Mechanics)

Aug 2003 – Dec 2005 University of Nebraska-Lincoln, NE

Graduate Research Assistant, Department of Engineering Mechanics

• Researched mechanical and magnetic behavior of ferromagnetic thin films, exchange spring magnets and magnetostrictive materials

Nov 2002 – Aug 2003 SANY Heavy Industry Co Ltd, China

Project Engineer, R&D Department

• Performed stress analysis and fracture assessment on the hydraulic drilling rig machine prototype using FEA tools (ANSYS, MSC/Nastran)

• Worked with application engineers from CAE vendors (MSC, ANSYS) to provide solutions for the simulation and reliability evaluation on drilling rig machines

Aug 2001 – Nov 2002 City University of Hong Kong

Staff Research Assistant, Department of Building and Construction

• Researched on thin-walled shell structure safety and stability under self-weight and wind load

• Performed FEA on the vibration attenuation device aiming at alleviating the extent of vibration of lamp posts at Tsing Ma Bridge

• Supported undergraduate final year project instructing and tutoring


• Ph.D., Mechanical Engineering, University of Washington, WA, Dec 2007

o Dissertation: Micromagnetic study of magnetoelastic materials

• MS, Engineering Mechanics, Huazhong University of Science and Technology, China, June 2001

• BS, Mechanical Engineering, Huazhong University of Science and Technology, China, June 1999


• FEA software: ANSYS (10 years), MSC Patran/Nastran (2 years)

• CAD software: SolidWorks (5 years), Pro/E (2 years), AutoCAD (5 years)

• Mathematical software: Matlab (10 years), Mathematica (10 years)

• Statistical analysis: Minitab (3 years)

• Program languages: C/C++, Fortran


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