Resume submission: Regional Sales Medical
Resume:
Christopher W. Lee
Summary: Technology focused, business professional with a proven track record in business
development, product marketing and sales engineering. Strong industry and international experience in
materials and capital equipment serving the semiconductor, electronics and structural markets. High
energy, results oriented individual with strong product management and technology marketing skills at
Start-up and Fortune 1000 companies.
Product Marketing and Management New Product Introductions
New Business Development Launch Strategies
Commercializing New Technologies Value Based Pricing
EXPERIENCE AND ACCOMPLISHMENTS
QLP INC., Wilmington MA………………………..………….…………………………………. 2005 - Present
VC funded, Start-up Company specializing in high performance materials and enabling technologies for
the semiconductor, structural, and automotive markets
Director of Technical Marketing and Business Development
Responsible for all aspects of marketing and sales in a start-up organization reporting to the CEO
• Implemented go-to-market strategy and new product introduction leading to over 20 customer
evaluations.
• Established value based pricing strategies driven by greater product reliability, improved performance
and increased yields. Negotiated NRE and unit pricing
• Directed the development and qualification of a structural material at a leading electric vehicle
manufacturer creating sales potential of $500K
• Defined new product specifications and performance requirements, successfully gained qualification
at a leading military and space electronics company
• Developed company website content and layout, leading to web-based leads and increasing inquiries
by 3x. Created company sales tools, technical presentations and product data sheets
• Co-wrote, published and presented technical papers at key industry conferences creating company
and product awareness
DOW CORNING CORPORATION, Midland, MI…………………………………………..……2003 – 2005
Electronics and Advanced Technologies Division, A $3 Billion dollar global company providing silicone
and silicone-based products, technologies and solutions
Global Market Manager, Semiconductor Assembly
Responsible for leading the Semiconductor Assembly External Market and driving product technologies:
Thermal Materials and Adhesives. Duties include:
• Identified key market drivers, trends and performance requirements for next generation product
development and technology roadmaps
• Developed and executed product launch strategies, product positioning and pricing strategies
• Identified and assessed business opportunities for best strategic fit, involving market studies, market
segmentation, resources and financial assessment
• Successfully launched high performance thermal grease targeting the high-end CPU market
segment. Gained qualification at leading OEM’s and penetrated the CPU-System Integrator value
chain displacing the market incumbent. Achieved $10MM revenue in 3 yr period
• Successfully launched a mid-range thermal interface material targeting the graphic market segment.
Gained evaluations at leading GPU customers and qualification at an OEM for the game console
market, leading to 3 yr revenue goal of $4MM.
• Hosted a global, invitation only Webinar co-presented with a leading OEM customer: “Thermal
Solutions for CPU platforms”
COOKSON ELECTRONICS……………………………………………..……………………….….1991 – 2003
A global supplier of specialty materials and capital equipment for electronic and semiconductor assembly
Christopher W. Lee
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Speedline Technologies, Franklin MA
A subsidiary of Cookson Electronics (sold to ITC 2006) and global manufacturer of capital equipment
for electronic and semiconductor assembly
2002 – 2003 Business Development Manager, Semiconductor Products Division
Responsible for identifying new product and process opportunities in the semiconductor market,
developing strategic product plans, defining new product requirements, and spearheading product
development across the equipment sector.
• Generated business cases using financial models, market analysis and forecasts to justify new
product development. Identified wafer bumping market opportunities and justified the development of
a process solution, bundling equipment and electronic materials.
• Developed key partnerships with industry leading customers to collaborate and share technology
product plans.
• Integrated cross sector material and equipment sales team offering a complete process solution to
the customer.
1999 – 2002 Global Product Manager, Camalot Division, Automated Dispensing
Product business team leader of a cross-functional team, managing a $15 million dollar product line;
Responsible for marketing strategy, product positioning, roadmaps, product specifications, and sales
tools; Duties include pricing strategy, competitive analysis, forecasting, inventory and managing complete
product life cycle from product launch to obsolescence.
• Grew revenue from $1 million to $7 million in 18 months for a high performance product, Xyflex, by
re-defining product position and market promotion, and stabilizing product performance. Achieved
the SMT magazine Vision Award, an industry recognized award for innovation, in 2001.
• Successfully launched and promoted a next generation, mid-range product, designed to reduce
inventory, streamline production, and reduce lead time by 50% and costs by 15%.
• Created and maintained sales tools for existing and new products, including product specifications,
product data sheets and product line sales presentations. Conducted sales associate training
seminars on new and existing products.
• Assisted sales on domestic & international (Europe & Asia) customer visits/trade shows
Alpha Metals Inc., Hong Kong, SAR China, Asia Pacific Headquarters
A subsidiary of Cookson Electronics and global manufacturer of electronic materials for electronic and
semiconductor assembly
1996-1999 Business Development Manager, Semiconductor Products Division, Asia Pacific Region
Promoted and transferred to Hong Kong, Asia Pacific regional headquarters, to champion business
development and establish a new business unit in the Asia Pacific Region. Responsibilities include
revenue growth, managing P&L, and forecasting.
• Hired, trained and managed four area sales engineers based in Taiwan, Singapore, Hong Kong and
Korea. Managed and supported key distributors in Japan and Thailand. Business unit sales exceeded
$1 million.
• Penetrated the semiconductor packaging market in the entire Asia Pacific Region. Identified market
opportunities and cultivated key business relationships at leading semiconductor packaging
foundries. Presented technical papers, coordinated seminars and called on multinationals customers.
• Successfully integrated the business unit into the parent company. Incorporated accounting, inventory
and a sales channel within each site: Taiwan, Singapore, Korea, China, and Hong Kong.
Alpha Metals Inc., Jersey City, NJ, US and Global Headquarters
A subsidiary of Cookson Electronics and global manufacturer of electronic materials for electronic
and semiconductor assembly
1994-1996 Key Account Sales Engineer, Semiconductor Products Division
Responsible for selling and promoting new epoxy materials to strategic accounts in the semiconductor
assembly market
Christopher W. Lee
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• Secured target beta sites successfully achieved product approval at 2 major multinational telecom
OEM sites, leading to over $1 Million worldwide sales in a 12 month period
• Established strategic partnership with an equipment supplier to develop a high throughput process for
SBGA assembly, resulting in material approval and the purchase of several tools exceeding $500,000
1991-1994 Applications Engineer, Semiconductor Products Division
Primary responsibilities include providing applications support and optimizing customer processes for
material approval; Conducted product characterization and material evaluations for customer
qualification; Developed an assembly process adapted by the disk drive industry
DEGUSSA CORPORATION, South Plainfield, New Jersey……………………………………..….1989-1991
A global manufacturer of electronic materials for electronic thick film and hybrid assembly
Process Development Engineer, Electronic Materials Division
Served as the technical liaison between R&D and Production, responsible for introducing new processes
to manufacturing and transferring R&D products to production scale
EDUCATION AND TRAINING:
• BS Materials Engineering, Rutgers University 1989
• Value-based Pricing, Strategic Pricing Group, April 2005
• The Executive MBA, 2000, Intelligent Resources Group
• Finance for Non-Financial Managers, 1998, The Financial Training Company, Asia Pacific
• Strategic Marketing, 1996, University of Michigan Business School, Executive Education Program
TECHNICAL ARTICLES AND PUBLICATIONS:
1. “New Structural Polymer for Metal Replacement Applications,” Paper approved for SPE ANTEC, June 2009,
coauthor: Dr. Mike Zimmerman, Chris Lee and Dan Ward, QLP Inc, Wilmington, MA; Eric Paszkowski, Rick
Boisjoly, Jim Elliott, Michael McGee, Nypro Inc, Clinton, MA
2. “High Frequency Packaging and RF Devices,” IMAPS Advanced Technology Workshop on RF and Microwave
Packaging, September 2008; coauthor: Dr. Mike Zimmerman, Chris Lee – Awarded Best Session Paper
3. “Novel Polymer for Metal Replacement in Automotive Applications,” SPE Automotive Engineering Plastics
Conference - AUTOEPCON, April 2008; coauthor: Dr. Mike Zimmerman, Chris Lee
4. “Plastic Air Cavity QFN with Ultrasonic Lid Seal Achieves True Hermetic Performance,” IMAPS International
Symposium on Microelectronics, November 2007; coauthor: Dr. M. Zimmerman, Cleo
5. “Low Stress Packaging Enables Memes Performance and Reliability,” MEPTEC, June 2006
6. “Thermally Conductive Grease Materials in High Performance Chips,” Advanced Packaging, July 2005 Issue, coauthored
by C.Lee, Dr. Z. Lin and G. Becker
7. Understanding and Optimizing Thermal Interface Materials for high Performance Flip Chip Devices,” IMAPs
International Conference on Device Packaging, March 2005, co-authored by C.Lee, Dr. Z. Lin and G. Becker
8. “Wafer Bumping via Ultrasonically Enhanced Printing,” 28th International Electronics Manufacturing Technology
Symposium, SEMICON West July 2003, co-author with C.Lee, F. Andres and Dr. G.P Van Diep.
9. “Advanced Process Control for BGA Encapsulation and Flip Chip Underfill,” Technical paper, SEMICON Taiwan
Proceedings, October 2001, co-author with B. Miquel.
10. “Ultra-High Speed Dispensing Enhances Production Throughput,” EP&P, August 2000 issue.
11. “Electronic Polymer Materials in Advanced Packaging,” Technical Speaker, Asian Electronic Engineer Seminar,
held in Singapore, Philippines and Thailand, January 1997.
12. “Flip Chip, The Ultimate Packaging Solution? How and Why It Will Succeed!” Technical Speaker, Globaltronics
Singapore, October 1996.
13. “Thermoplastic Adhesives – The Attachment Solution for Multichip Modules,” IEPS, September 1993, co-author
with S. Corbett.
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