Summary of Qualifications
• Five years experience as Assistant Product Engineer in Memory Chip Wafer Probing Industry
• Five years experience as Assistant Equipment Engineer in Semiconductor Industry (Front-End IC
Assembly, Wirebond Section)
• Actual knowledge on memory tester/prober operation and trouble shooting
• Well experience in device characterization, program buy-off and yield analysis for newly startup
devices
• Wide experience in Laser and program trouble shooting
• Profound knowledge on IC Assembly process, machine operation and trouble shooting