Senior PCB Designer

Sathish Kumar Devarajan

**********@*****.*** 949-***-**** (Cell)

408-***-**** (Home)

Objective

To excel in high speed PCB design technology. Design challenging and demanding projects adapting cutting edge requirements.

Summary

 Started my career as PCB design engineer in GDA Technologies and designed many complex PCBs on various applications for 3 years that include Mother boards, Network server boards, PCI-X ,PCI-E, AMC , ATX form factor designs using Cadence Allegro and Pads PowerPCB.

 Promoted to Project Lead in GDA Technologies spearheading an engineering team of 12 to 14 engineers for around 3 years 4 months.

 Transferred to GDA Technologies, Inc. USA Irvine Design center as Project Lead for 2 years 11 months. My main role and responsibility was to design and manage all PCB design activities for various locations of INTEL including Irvine, Southern California and Hillsboro, Oregon. Managed and designed on many complex PCB projects with various INTEL groups.

 Joined Arira Design, Inc. as Senior PCB Designer in November2008 and working till now (1 year 11 months).

 Having a total number of PCB Design experience for 11 years 2 months.

Skill Set

 Good knowledge in High speed PCB designs.

 Good knowledge in utilizing latest EDA tools complex Constraints techniques.

 Good knowledge of using complex rules like Spacing, Physical, Electrical length constraints, Relative propagation delay lengths in latest Allegro version 16.2.

 Good knowledge and experience on High Density Interconnect (HDI) technology using Blind /Buried vias and detailed concepts in latest emerging PCB techniques.

 Designed very complex constraints designs up to 30+ layers stackup design.

 Designed Printed Circuit Design Boards (PCBs) for various multi applications like PCI-Express, DDR, SDRAM, RDRAM, QDRAM, HT, Infini-band, Gigabit Ethernet, FSB, FBD etc.

 Good understanding of Hardware design and fundamentals.

 Good knowledge in Signal Integrity simulation guidelines.

 Good knowledge in EMI /EMC guidelines on PCB design.

 Good knowledge in Power plane and Power supply requirements.

 Good in Project estimation and cost control techniques.

 Good in Project management techniques.

 Very good with Communication skills and Customer Interactions.

 Good knowledge and understanding of ISO standards and documentation.

 Working knowledge on Low Temperature Co-fired Ceramics (LTCC) designs.

PCB Design tools expertise

Cadence Allegro V16.2

Cadence Allegro V15.7

Cadence Allegro V15.0 – Allegro experience more than 10 yrs

Mentor Pads PCB – PowerPCB experience more than 10 yrs

Cadence Spectra Auto router

Mentor Pads PCB Blaze Auto router

Cadence Concept HDL

Cadence Capture CIS

CAM 350 Viewers

Operating System

Windows 2000, Windows NT, Windows XP, Windows Vista

Software packages

MS-Office

Employment History

Designation: Senior PCB Design Engineer

Company: Arira Design, Inc, Sunnyvale, California, USA

Work period: 21st Nov-2008 to till now [1 year 11 months]

Description: Job responsibilities include designing complex PCB Layouts, Project management, Customer interactions for Arira Design, Inc. USA

Designation: Senior Member Technical staff \ Project Lead

Company: GDA Technologies, Inc, Irvine, Southern California, USA

Work period: 6th Jan-2006 to 11th Oct-2008 [2 years 11 months]

Description: Job responsibilities include designing complex PCB Layouts, Project management, Customer interactions, heading a team of 10-12 engineers working for different key customers.

My main role and responsibilities were to lead all PCB Layout designs and manage all the PCB design activities for Intel Irvine -Southern California and Intel - Hillsboro, Oregon.

Designation: Project Lead-PCB Design

Company: GDA Technologies Ltd

Work period: 18th Aug-2002 to 05th Jan-2006 [3 years 4 months]

Description: Job responsibilities include designing complex PCB Layouts, Project management, spearheading a team of 12 to 14 engineers working for different key customers.

Providing technical guidance to the team and improving knowledge on latest EDA design tools and Auto routing techniques.

Designation: PCB Design Engineer

Company: GDA Technologies Ltd

Work period: 18th Aug-1999 to 17th Aug-2002 [3 years]

Description: Job responsibilities include designing complex PCB Layouts on various applications include Mother boards, Network server boards, PCI-X ,PCI-E, AMC , ATX form factor designs using Pads PowerPCB and Cadence Allegro.

Total Years of Experience: 11 years 2 months.

Education

 Bachelor in Computer Applications (BCA)

From Indira Gandhi National Open University (IGNOU), New Delhi, India

With First class grade

 Diploma in Electronics & Communication Engineering (DECE)

From CNPT, Chennai, India with First class with Honors

Major: Micro Electronics, Power Electronics &Communication Engineering

Employment visa status

Working in H1-B visa

Few key projects

1. i.MX27 Freescale Reference Board

Description : i.MX27 development platform is based on the Freescale i.MX27 processor and custom solutions which supports to mobile computing community. This board provide all features like Freescale Atlas chip for power management, DDR SDRAM, Flash, MicroSD, Wireless Ethernet, USB OTG port, Built in Microphone and Speaker with stereo output jack,

Features:

 128MB DDR SDRAM

 128MB FLASH

 Micro Secure Digital (MicroSD) flash memory

 1200mAh Lithium Ion Battery

 Wireless Ethernet

 USB OTG port

 Resistive or Capacitive Touch screen

 Built in Microphone and Speaker with stereo output jack

 10/100 Ethernet

2. Cannon Beach Board for Intel

Description : Board is targeted as a High performance Server validation board. The board is based on four Tigerton processor connecting to one Clarksboro North Bridge and other FBD memory interfaces. The board also provides features like FBD, FSB, PCI-X, PCI-E, SATA etc.

Features:

 Four 1066 MT/s FSB channels

 Four 4 GT \ s FBD channels to memory interface

 PCI-E X8, 4 GB\s channels

 PCI-E X4, 2 GB\s channels

 PCI-X 133 MT\s -1GB\s

 Six SerialATA interfaces

 Eight USB ports

3. Quad Opteron Compute Brick

Description : Board is targeted as a High performance 1U server brick. The board is based on four AMD Opteron processor with two 16 bit hyper-transport and one

Infini-Band connectivity to a back plane. The board also provides features like Fast Ethernet, VGA, USB, IDE etc.

Features:

 Two 16 bit Hyper Transport links to a back plane

 One 8x InfiniBand interface to the back plane

 On board PCI Express link

 Four DDR400 DDR SDRAM DIMMs for each Opteron

 Two USB ports

 One Fast Ethernet Interface

 IDE Interface

 Two Serial Ports

4. Controller card for Thermal Printer ( Continuum Integrated controller)

Description : Board is targeted as the main controller card in a high speed thermal printer (Print speed 24IPS) used for industrial applications like printing Barcodes on labels and for loading ID to RFID chips on label.

Features:

 IEEE 1284 ECP Parallel Port

 Full function RS232 Serial Port

 USB

 Fast Ethernet

 Interface for Barcode Validator

 Interface for RFID module.

 Interface for auxiliary printer interface

 Card bus with a Wireless Lan PC CARD for remote printing

 Interface for 11 sensors and 5 motor controllers

5. New Generation IO (NGIO) Validation board

Description : Board is targeted for validating high speed IO cores like. PCI Express, Hyper Transport, Serial and Parallel Rapid IO, PCIX, Gigabit Ethernet and PIPE interface between PCI Express MAC and PHY.

Features:

 PCI-E x8 edge and slot connectors

 HT connectors as per the HT consortium specifications

 Rapid IO slot connector as per the HIP specifications

 PCI-X Edge and slot connectors

 Gigabit Ethernet Port

 Gigabit/Fast Ethernet port for management

 Serial port through DB9 connector

6. Virtual fabric Engine main board

Description : The Board is targeted as a segment in an enterprise network ring to provide connectivity between a 12 port Gigabit Ethernet switch and a Fiber optic back bone.

Features:

 Interface for Broadcom gigabit Ethernet switch through a Fujitsu high speed connector.

 Support for Four DDR SDRAM DIMM modules

 Network Interface, Forward Error correction and Optical interface circuits

 MSA300 pin connector for plugging a Serdes board/OC192 transponder

 SFP connector

 Support for a PMC processor module.

 FPGA configuration scheme using CPLD and Flash

7. BCM1125H Based PCI card

Description : The board is based on 64 bit network processor BCM1125H from Broadcom in a full sized PCI add-on card form factor with two Giga bit Ethernet ports. The board can function as a standalone CPU module and as a PCI add-on card. The board is targeted for high end networking applications and network security applications. It can also be used as a computing engine.

Features:

 BCM1125H CPU with hyper transport

 32 Bit PCI edge connector

 256MB onboard DDR SDRAM with ECC @133MHz

 Flash for BIOS and OS

 Hyper transport connectors as per HT consortium specs.

 2 Giga bit Ethernet Ports.

 RTC, Serial ports

8. PCI Express Validation Board

Description : Board is targeted for validating PCI Express and PCI-X IP core and the bridging between these cores.

Features:

 PCI-E x8 edge and slot connectors

 PCI-X Edge and slot connectors

 Gigabit/Fast Ethernet port for management

 Serial port through DB9 connector

 Support for MPC8245 based CPU module board through high speed Samtec connectors

9. SXP1 FPGA Validation board

Description : This board is Targeted for the validating a network processor core IP

Features:

 Three PCI slot connectors and one PCI-X slot

 TDM chip interface

 Support for DDR SDRAM DIMM module

 Flash and SRAM

 2 Giga bit Ethernet ports

 Serial, IrDA, RTC and EEPROM

10. BCM1250 Based FPGA PCI Card

Description : The board is targeted for networking applications like TCP/IP packet analysis based on Xilinx Virtex II FPGAs

Features:

 Network processor BCM1250 from Broadcom

 Onboard DDR SDRAM and flash

 Support for RLDRAM interfaced to FPGA

 2 gigabit Ethernet ports using PM3386 dual gigabit Ethernet controller

 One PCI edge connector and one PCI slot for expansion.

11. Hyper transport Validation Board

Description: The board is targeted for the validation of HT (formerly LDT) VLSI core. The board can be used for validating Hypertransport, Cave, Tunnel, bridge and switch cores.

Features:

 Three HT links with 3 sets of connectors

 Support for HT connector less probes.

 On board MPC8245 Processor

 128MB onboard SDRAM and total of 16MB Flash

 PCI Giga bit Ethernet controller 82544

References available upon request

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