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Process Integration Engineer

Location:
Austin, TX, 78727
Posted:
October 12, 2009

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Resume:

Stenly Tukunang

**** ***** **** **.

Austin, TX 78727

********@*****.***

512-***-****

OBJECTIVE

Process integration engineer with 9-year experience in the semiconductor industry, specifically in yield enhancement, transistor performance optimization, process development, scrap reduction, and new product introduction (NPI). Excellent problem-solving skills, quick learner, results-oriented, detail-oriented, and excellent interpersonal skills. Currently seeking a challenging technical position in any industry.

Education

01/99-08/00

University of Texas at Austin

Master of Science in Chemical Engineering (GPA: 3.9/4.0)

Thesis: Using Second Harmonic Generation (SHG) technique to characterize the dopant concentration profile of bipolar-junction transistor made of silicon and silicon-germanium alloy.

Coursework: VLSI Fabrication Techniques, Semiconductor Device Physics, Synthesis/Growth/ Analysis of Electronic Materials, Polymer Science and Technology, Advanced Analysis for Chemical Engineers

09/95-12/98

University of Wisconsin at Madison

Bachelor of Science in Chemical Engineering (GPA: 3.9/4.0)

EXPERIENCE

08/08 – 09/09

Samsung Austin Semiconductor – Austin, TX

Process Integration & Yield Enhancement Engineer

0.1-micron DRAM Manufacturing

•Improved baseline yield through DOE experiments, failure analysis, and teamwork with process engineering.

•Investigated excursion events, discovered root cause, and provided containment/permanent solutions.

•Collaborated with product and quality engineering in disposition of excursion materials.

08/00-08/08

Freescale Semiconductor, Inc. - Austin, TX

Process Integration Engineer

0.13-micron CMOS Device Manufacturing

•Participated in qualification and transfer of 0.13-micron CMOS technology from research to manufacturing.

•Improved baseline yield through DOE experiments, failure analysis, and teamwork with process engineering.

•Investigated excursion events, discovered root cause, and provided containment/permanent solutions.

•Successfully improved transistor performance in order to meet rigorous speed requirement.

•Contributed heavily in development of contact module and backend copper dual damascene integration.

•Reduced cost through leadership in factory scrap reduction team.

•New product introduction (NPI) and supported product engineering for automotive and networking products. Worked together to understand product requirement/issues and provide the best solutions.

06/99-08/99

Department of Chemical Engineering – University of Texas at Austin

Teaching Assistant

•Taught thermodynamics course for chemical engineering students. Held discussion section and graded quizzes and exams.

•Developed communication skills by interacting with students.

01/98-12/98

Department of Chemical Engineering – University of Wisconsin at Madison

Undergraduate Researcher

•Designed and built a halide vapor phase epitaxy reactor to grow gallium antimonide (GaSb) thin film on a semiconductor substrate.

•Characterized the electrical properties of gallium arsenide (GaAs) semiconductor by using variable temperature Hall Effect measurer.

•Developed teamwork skills by working with colleagues.

SKILLS

JMP, Spotfire, MS Office, dataPower, SPC, Six Sigma Training, Lean Manufacturing, FMEA



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