**** ****** **** *****

Apt. No. ***C

Twinsburg

Ohio-44087

USA

omwkg4@r.postjobfree.com

Phone: +1-330-***-**** (Hand Phone)

+1-330-***-**** (Landline)

http://www.linkedin.com/in/saswatiroy

Ms. Saswati Roy

OBJECTIVE:

To excel in whatever I undertake and to do the job in hand with utmost sincerity.

WORK EXPERIENCE:

Working in the PCB Industry for more than seven years with experience spanning in the following areas:

1st October 2008 – Till Date

Network Technologies Incorporate (Ohio, USA) as a PCB CAD Engineer.

The current role involves but is not limited to:

a) Multilayer, high speed PCB designing for boards mainly used for Video and KVM interfaces. Multiplexer boards for Environment sensing are also included in the product line. The layouts are optimized for resolving ESD, EMI/EMC issues

b) Interfacing with Compliance Engineer for appropriate design methodologies for CE/UL certifications.

b) Library Management (both component creation and maintenance)

c) Manufacturing output considering DFM requirements (Artwork and Stencil creation and verification) which includes interaction with various vendors

d) Tools handled: Mentor Graphics DxDesigner-Expedition Suite and Altium PCAD & Altium Designer Summer ‘09, CAM 350 and CAMTASTIC for Manufacturing output.

18th October 2004 – 29th August 2008

Honeywell Technology Solution (Bangalore, India) as an ECAD Team Lead for the Sensing and Control New Product Design team.

The role involved apart from managing day to day activities and quality assurance for a team of five people:

a) Multilayer PCB Designing (Rigid & Flexible) using schematic capture and layout tools from Mentor Graphics (Board station and Expedition and ) and Fablink & Gerb tool for manufacturing output/compatibility while keeping in mind the EMI/EMC compliance in Printed Circuit Boards.

b) Design Validation and Functionality testing of circuits using simulations and Lab experiments (Breadboard testing et al)

c) Conducting Environmental testing of Prototypes built out from Bangalore which also involved coordinating with external agency for facilitating the tests at their centers.

d) Creating customized test plans as per customer specs.

e) Documentation of products including creating Bill of Materials, Drawings.

f) Use of PDM System for design changes (ECR/ECO) and documentation and maintaining legacy design data.

g) Interaction with PCB fabricators both in India and overseas suppliers and resolving DFM issues.

h) Overlooking the PCB assembly process which included performing DOEs to reach the optimum process.

i) Using Six Sigma methodologies to create robust optimal designs and minimizing rework.

The above mentioned roles also involved the following common responsibilities:

Initiation and successful migration of library components from Mentor Graphics Boardstation to Mentor Graphics Expedition library format, similarly from Mentor Graphics Expedition to Altium Designer along with schematic and layout migration.

Board stackup creation and impedance calculation

Streamlining design rules and validation checks were successfully implemented for the standardizing company documentation with respect to evolving layout methodologies. IPC design standards were stringently incorporated.

Complete documentation responsibility which included BOM generation, Fabrication and Assembly documentation, Netlist generation, Stencil and pick and place file creation.

Interfacing with mechanical designers for housing/case form fit validation.

Using AutoCAD for mechanical verification and for gerber generation for non electrical designs (eg. contact resistance designs)

Migration of designs to be RoHS compliant

The roles also involved active interaction with PCB Fabrication and Assembly (local and international) vendors for process streamlining for proto and production builds.

4th May 2004 - 15th October 2004

Mentor Graphics (Hyderabad, India) as a CAE Supporting Expedition Tool with a global team of Technical Support Engineers, supporting world wide customers on both tool and design related queries.

7th July 2003 – 30th April 2004

CAD Engineer at Agilent Technologies International (Gurgaon,India)

Building and maintaining component libraries.

Creating geometries and symbols for various PCB Design Sites at Agilent Technologies.

Leading Lean Projects that effectively increase productivity and improve quality.

Process Engineering Change Requests (ECRs) and Engineering Change Orders (ECOs) using Matrix One.

Running QA process that checks symbols for Schematic rules and geometries for Layout rules.

Interacting with user groups for process improvement and quality standards.

Responsible for process document creation and maintenance.

Assist in training of new team members.

Identify key customers and participate actively in annual customer satisfaction survey.

Play a key role in the library clean-up process.

1st May 2003 – 5th July 2003

Trident Techlabs (New Delhi,India) as a Trainee Application Engineer.

TOOLS HANDLED:

Mentor Graphics: DxDesigner-Expedition Suite (Databook and CES) & Design Architect- Board Station

Altium: PCAD (both schematic & layout interface); Altium Designer Summer’09

CAM: Fablink; GerbTool (WISE software); CAM350 (Downstream Technologies);

Exposure: AutoCAD; NI’s Electronic Work Bench (Multisim to Ultiboard); Pspice;

Platforms: Windows & exposure to Linux

Adept in handling MS Office and Open Office

Worked on several Industrial, Commercial, AOB (Automotive on Board) layouts including backplanes and interface boards for various lines of business right from schematic capture to final artwork generation. Taking it to the final product release state by creating the appropriate ECAD drawings and releasing into the PDM system. Successful completion of Green Belt Certification.

WORKSHOPS ATTENDED:

Attended a Three day workshop conducted by SAMEER (Society for Applied Microwave Electronics Engineering and Research)- Chennai, India on Electromagnetic Compatibility.

AWARDS RECEIVED:

Spot Award- For performance exhibited in Sarasota, while working on a new testing Fixture and taking initiative in completing the full testing cycle for Slip head program

Spot Award- For diligently working on the experiments for reflow soldering in a systematic way and delivering functional samples.

Individual Excellence Award-For dedicated contribution in fulfilling the needs for C&N Combi Sensor Demo Board

Individual Excellence Award-For demonstrating exemplary performance while taking up a cross Domain project and exhibiting great mentoring attitude.

Team Achievement Award- For a cross Domain support on speedy creation of Library Components

EDUCATION:

1995 St.Anthony‘s Senior Secondary School, New Delhi, India

Secondary School Examination

1997 St.Anthony‘s Senior Secondary School, New Delhi, India

Senior Secondary School Examination

1997- 2000 University of Delhi, Delhi, India

B.Sc. (Hons) Physics

2000-2002 University of Delhi, Delhi, India

M.Sc. Physics (Specialization-Electronics)

August 2002 -March 2003

Advanced Post Graduate Diploma in VLSI Designing conducted by SEMICONDUCTOR COMPLEX LTD., A Ministry of Information Technology, Govt. of India enterprise.

PERSONAL DETAILS:

Date of Birth: 8th September, 1979; Nationality : Indian

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