Engineer Electrical
Resume:
Brian Koenig
*** ********** *****, ***. ***
Bolingbrook, IL 60440
***********@*******.***
SUMMARY:
Highly accomplished Senior Electrical Engineer with over 20 years of experience successfully developing projects incorporating a wide range of semiconductor technologies. Keen knowledge of testing electrical and mechanical sensors for reliability and performance. High aptitude working in electronics labs, assembling and disassembling pc boards, test chambers, vacuum components. Proven resourcefulness, creatively problem-solves with a strong aptitude to analyze and resolve technology issues. High interests in digital logic and microcontroller design, verification, and test.
PROFESSIONAL PROFILE:
- Senior-level electrical engineer with significant experience in the semiconductor arena.
- Strong background in silicon device physics and semiconductor process flows for DRAM and flash NAND.
- Tested infrared sensors, magnetic flow sensors, and oxygen sensors at the semiconductor level for functionality and performance
- Knowledgeable of electrical parametric testing and the relations to semiconductor processing.
- Resourceful, creative problem-solver with proven aptitude to analyze and resolve technology issues, provide for system enhancements, define, design, develop and implement highly successful automated solutions.
- Effective team player. Successful integrating with multiple engineering groups such as process sections, process integration, yield analysis, quality assurance, modeling, device layout, and probe.
- Strong interpersonal, written and verbal communicator, who can deliver effective presentations, generate quality engineering reports, consult on technology projects, and maintain collaborative relationships.
- Exceptional leadership abilities. Able to manage a team to focus on specific tasks and goals.
TECHNICAL EXPERTISE:
- Programmed various pieces of test equipment using visual basic and assembly code
- Wrote major time-saving Excel macros using Visual Basic for data analysis tables and graphs
- Analyzed statistical data using JMP and RS1 ANOVAs, scatter plots, and cumulative probability plots
- Able to write BASIC microcontroller code for prototype design using servos and sensors
- Soldered printed circuit boards. Wire bonded microchip samples.
- Repaired faulty electronic equipment for breaks and shorts
- Built unique test fixtures for testing research samples under high temperature low vacuum conditions
- Characterized silicon parametric test structures on automatic and bench probe stations
- Expert at operating electronics lab test equipment such as parametric analyzers, spectrum analyzers, vector network analyzers, and oscilloscopes, and digital multi-meters
- Designed, tested, and modeled silicon RF test structures for S-parameters
- Verified CAD designs using SUN Cadence DF2 and K2View
- Experienced using mechanical and turbo vacuum pumps for cryogenic testing of thin film samples
- Performed reliability checks on sensors
- Associate level LABVIEW code developer for instrumentation programming
- Coursework design and simulations with VHDL and Verilog
PROFESSIONAL EXPERIENCE:
EPIR TECHNOLOGIES, INC. - Bolingbrook, IL 2010-2011
PV Test Engineer
• Measured and analyzed parametric data for shortwave, midwave, and longwave MerCadTel infrared detectors under cryogenic test conditions
• Wire bonded gold wire to substrate samples mounted onto gold lead packages. Also performed indium bonding.
• Maintained cryogenic test chambers for Janis bench system and IRLabs and SE-IR liquid nitrogen dewars.
• Assisted in training and support for lab equipment and addressed technical questions regarding cryogenic testing.
• Soldered and wired printed circuit boards. Replaced faulty parts on boards.
• Wrote purchase requests for all test lab equipment, parts, and repairs.
AGRI-INJECT, INC.- Yuma, CO 2009
Agriculture Instrumentation Engineering Consultant
• Verified the functionality and performance of magnetic flow sensors for pulsed flow chemical injection pumps
• Set up measurements and collected data to compare factory tolerances between mag flow meters
• Presented a detailed report on the data and analysis and recommendation for pulsed flow mag meters
Brian Koenig page 2
MICRON TECHNOLOGY- Boise, ID 1991-2007
R & D Device Characterization Engineer
• Performed requested electrical measurements for wafer parametric structures on the bench. This included organizing and analyzing the data and presenting the results in detailed reports.
• Developed and maintained parametric test programs for testing flash and DRAM parts at final wafer probe.
• Assisted in training and support for lab equipment and addressed technical questions regarding parametric testing on the bench.
• Delivered classroom presentations for training and documentation.
• Debugged and correlated new parametric test structures using electrical testing and layout resources.
R & D Advanced Materials Device Engineer
• Measured experimental chalcogenide memory devices for functionality on the bench.
• Wrote detailed reports for the analysis of measured data.
Production Flash Process Integration Engineer
• Assisted in the design and development of adjusting process parameters to optimize device characteristics or yield for flash part types in the fab. This included working closely with process engineers and assisting them with data analysis.
• Monitored and analyzed process conversions in the fab and presented data for management decisions for full conversions.
• Monitored probe and parametric trending for devices for any possible process deviations brought about by machine problems in the fab or by a process conversion.
Production Parametric Engineer
• Developed and maintained Visual Basic test programs for testing inline parametric structures on an automatic tester.
• Designed new subroutines for parametric tests at inline probe.
• Assigned disposition of DRAM wafer product prior to assembly and quality control.
• Monitored parametric and yield issues at inline and probe
• Trouble-shooted causes of yield and parametric deviations due to deviations in process
Dry Etch Process Engineer
• Maintained and cleaned plasma dry etch equipment.
• Assisted in the design of experiments for process changes for oxide etch.
UNIVERSITY OF COLORADO, Colorado Springs, CO. 1989 – 1991
Research Assistant
• Designed and built a hot temperature furnace apparatus for galvanic cell measurements on ferroelectric materials. The apparatus could be used for determining oxygen vacancy transport.
• Developed Rocky Mountain basic code for taking automatic measurements on Keithley test instruments.
• Assisted in the fabrication process for building silicon samples for measurements.
• Hands on experience in a small fab using dry and wet etch, evaporation of films, diffusion, and photo patterning.
• Worked with SUPREM and PISCES process and device simulation packages.
UNISYS CORPORATION, Pueblo, CO. 1986 – 1988
Material Quality Engineer
• Reviewed defective incoming IC material.
• Generated new or enhanced existing electrical test specs for incoming SRAM and DRAM products needed for Unisys’ Defense systems.
• Developed assembly test code for screening SRAM and DRAM against electrical specs.
EDUCATION:
• Master of Science in Electrical Engineering, University of Colorado, Colorado Springs, CO., 1991
- Course work emphasizing VLSI processing and semiconductor device physics
- Device physics course in GaAs
• Bachelor of Science in Electrical Engineering, Colorado State University, Fort Collins, CO., 1986
• Labview Basics I and II courses by National Instruments 2008
• Introduction to Microcontrollers online course at the University of California Irvine 2009
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