Engineer Design
Resume:
Joann Trader
Apple Valley, MN 55124
ml4z9j@r.postjobfree.com
Objective: Seeking a rewarding position in the Electronic Manufacturing
Field where my soldering skills and experience can be utilized.Quality conscience,
stressing the importance of quality in all operations.Team player building pc boards.Seeking a company which will embrace quality in their product.
Attended Dakota County Technical College (February 2010).Graduated and Certified Specialist in IPC610 soldering Class III.
Employment:
*CLASS II/CLASS III
-LOGIC CORP.(Eden Prairie) (March 2011-June 2011)
-Contract position
-Soldering PC Boards-phone cards
-Thru-Holes
-Attaching Components
-Computer Useage of prints and directions.
*CLASS III
-General Dynamics (Bloomington) (June 2010-October2010)
-Worked in the Automation Dept. which exclusively works on Goverment contracts.
_Received J Standard Certification
-Soldering and building pc boards for the goverment.
-Staking and Bonding of the pc boards
-Fine Pitch soldering usually 250 + leads
-Daily stringent computer documentation of process per operation project
-Experience on the Hakko removing components thru hot-air
-Underfilling components
-Schematics used
-Active Secret Clearance
-Microscope Useage
*CLASS III
-Alliant Technical Services (ATK) (April 2009-July 2009)
-ATK designs and builds for the government and NASA Defense Weapons.
-Worked as a Prototype Design Solderer.
-Received certification IPC Specialist(J-STD April 2009)
-Successfully completed the application specialist course of study on J-STD-001-soldered electrical and electronic assemblies.
-Wires and Terminals.
-Thru hold technology.
-Surface Mount Technology.
-Inspection.
-Worked with Engineers directly using schematics.
-Good communication a must.
-New weekly revisions.
-Dead-lines for meeting production schedules.
-Microscope Useage
-Techmar Consulting: 2007-2008
-Worked as primary solderer for a Design Engineer.
-Worked independently with minimal supervision.
-Microsope Useage
*CLASS II
-Starkey Laboratory (July 1991-July 2007)
-10+ years experience in Surface Mount.
-Soldering circuit boards.
-Extensive prototype soldering in developmental stage.
-Read blue prints or schematic drawings.
-Proficient with soldering,troubleshooting, and reworking components.
-Removing and adding components per specifications.
-Perform extensive operations using microscope and a variety of small tools.
-Inspection of boards for accuracy.
-Knowledge of soldering chip on chip (perpendicular).
-Soldering thru-holes.
-Fine-pitch soldering experience.
-Trained co-workers on soldering operations.
-Worked directly with engineers on prototype projects.
-Formerly IPC 610 Certified.
-Microscope Useage
Operations: Flex Positions Experience
-Experienced with programmable pick and place machine.
-Manually populate boards.
-Trained co-workers on pick and place machines.
-Populated chip on chip.
-Extensive experience on auto and manual wire bonders.
-Trained co-workers on auto and manual wire bonders.
-Troubleshoot programs,boards and machines on auto bonding.
-Experienced in underfilling and glob-top on surface mount.
-Underfilled all components to prevent delamination and secure components.
-Using an encapsulated material to protect components against damage.
-Inspected surface mount boards for components and orientation.
Education:
-High School Diploma
-Associate Degree from Hennipen Technical Center
-Formerly held Top Secret Clearance from D.I.S.C.O. (1991) as well as an active Secret Clearance (2009).
*CLASS III
-General Dynamics (Bloomington) (June 2010-October2010)
_Worked in the Automation Dept. which exclusively works on Goverment contracts.
_Received J Standard Certification
-Soldering and building pc boards for the goverment.
-Staking and Bonding of the pc boards
-Fine Pitch soldering usually 250 + leads
-Daily stringent computer documentation of process per operation project
-Experience on the Hakko removing components thru hot-air
-Underfilling components
-Schematics used
-Active Secret Clearance
-Microscope Useage
*CLASS III
-Alliant Technical Services (ATK) (April 2009-July 2009)
-ATK designs and builds for the government and NASA Defense Weapons.
-Worked as a Prototype Design Solderer.
-Received certification IPC Specialist(J-STD April 2009)
-Successfully completed the application specialist course of study on J-STD-001-soldered electrical and electronic assemblies.
-Wires and Terminals.
-Thru hold technology.
-Surface Mount Technology.
-Inspection.
-Worked with Engineers directly using schematics.
-Good communication a must.
-New weekly revisions.
-Dead-lines for meeting production schedules.
-Microscope Useage
-Techmar Consulting: 2007-2008
-Worked as primary solderer for a Design Engineer.
-Worked independently with minimal supervision.
-Microsope Useage
*CLASS II
-Starkey Laboratory (July 1991-July 2007)
-10+ years experience in Surface Mount.
-Soldering circuit boards.
-Extensive prototype soldering in developmental stage.
-Read blue prints or schematic drawings.
-Proficient with soldering,troubleshooting, and reworking components.
-Removing and adding components per specifications.
-Perform extensive operations using microscope and a variety of small tools.
-Inspection of boards for accuracy.
-Knowledge of soldering chip on chip (perpendicular).
-Soldering thru-holes.
-Fine-pitch soldering experience.
-Trained co-workers on soldering operations.
-Worked directly with engineers on prototype projects.
-Formerly IPC 610 Certified.
-Microscope Useage
Operations: Flex Positions Experience
-Experienced with programmable pick and place machine.
-Manually populate boards.
-Trained co-workers on pick and place machines.
-Populated chip on chip.
-Extensive experience on auto and manual wire bonders.
-Trained co-workers on auto and manual wire bonders.
-Troubleshoot programs,boards and machines on auto bonding.
-Experienced in underfilling and glob-top on surface mount.
-Underfilled all components to prevent delamination and secure components.
-Using an encapsulated material to protect components against damage.
-Inspected surface mount boards for components and orientation.
Education:
-High School Diploma
-Associate Degree from Hennipen Technical Center
-Formerly held Top Secret Clearance from D.I.S.C.O. (1991) as well as an active Secret Clearance (2009).
Contact this candidate