Project Manager Engineer

RAJESH SUR

***********@*****.*** & ******@*******.***

Telephone: 604-***-**** or 604-***-**** (Surrey, British Columbia)

SUMMARY

A highly skilled and innovative engineer with a proven track record of achievement in project/product management, electrical engineering, testing, semiconductor processing, statistical process control, financial management, risk assessment, new-product launch, market share growth, as well as strategic planning. Ensures the completion of objectives within established time frames. Has a solid commitment to excellence, and facilitates the lasting success and profitability of an organization.

A product engineering manager and a Product line manager heading product’s in a portfolio of products with an annualized sales of more than $1.2 Billion per year.

EXPERIENCE

Freescale Semiconductor 2010- Present

Product Engineering Manager, Microcontroller Divison

Currently I am a Product Engineering manager and a Product Line Manager for the microcontroller divison. A $1.2 Billion turn over portfolio of microcontroller products used in 50, 000,000 cars manufactured worldwide . Managing a team of 20 product engineers and project managers with direct report to me.

Involved in a fab transfer of multiple product’s with an annualized saving to the company more than $60,000,000 dollars on a yearly basis. Responsible for delivery of quality automobile chips to the top automobile customers in the world. Safety standards of exemplary standard of less than 0.25 ppm ( less than 0.25 parts per failure of million products produced) a world standard in terms of safety standard.

Also heading the project of converting Au wire to Copper wire as a first level interconnect for the Automobile chips. Current project is in advanced stage and will save the company more than $20,000,000 on a yearly basis on completion with a upside potential saving of $60,000,000 on an annualized basis in the next 5 years. One of the very few groups in the world involved in the change of Au wire to Cu wire.

Project Manager ( Role in Freesemiconductor)

Track 25 projects on a daily basis which are currently been offloaded from Sendai to Chandler.

Project management reflecting mainly on risk mitigation, deliverables to the customers, budgetary limits

Bi weekly presentation to the high level executive team in US with respect to progress of the projects.

Extensive use of templates, Microsoft project to ensure projects are on schedule

To address and mentor the team who directly report to me and also also to organization who support us to ensure

deliverables are met.

Project management for Au to Copper wire conversion is currently been managed by me. Team spanning over 2 countries and a joint team of more than 50 engineers currently working in the team. I am the project champion for the overall project and the single point reference across the organization with regards to the status and execution of the project.

TEXAS INSTRUMENTS INC.

Project Manager, Dallas, Texas 2000-2010

Held responsibility for projects, schedule execution, risk management and release of products into market. Managed handover of project to production site in Taiwan. Released more than 30 devices to market within past ten years with combined revenue greater than $10,000,000.

• Contributed as product engineer, package engineer and test engineer for devices.

• Served as project manager for ADS8411, ADS8412, ADS8380, ADS8382, ADS8370, ADS8372, ADS7886, ADS7887, ADS7888, ADS7883, ADS7884 and ADS7885.

• Interacted with groups outside team for production, testing and logistics support within U.S. as well as additional production and test sites in India, Taiwan, Philippines, Malaysia and Germany.

• Executed project on time with details outlining project clearly between team members with common objectives to release product early to market to obtain market share.

• Possessed demonstrated ability to take risks, pressure and timeline management to move project over finish line.

Product Engineer 2000-2010 concurrent

Performed characterization of devices, full-die, device and package-level qualification. Completed reliability testing of process-like life test, package-level qualification like thermal shock, temperature cycling, HTOL and autoclave. Held responsibility for capability and correlation of devices, setting in test limits of devices. Contributed to statistical data analysis of multiple lots to figure yield variations. Improved yields. Coordinated with various logistic functions for fabrications of wafer, enabling packaging and assembly of wafers, testing and releasing of product into market. Released product to market, handing off to sustaining team, including setting up test boards and correlation units.

• Contributed to returns and debugging issues, including higher leakage currents and dies failing electrostatic-discharge test.

• Worked on different testers, including Teradyne A580, Teradyne Catalyst and LTX fusion testers. Complete package testing for characterization and customer samples.

• Partnered on probe-level testing of bare dies for medical chip devices using Teradyne testers and probers such as electroglass probers. Generated wafer map of good dies and sent to customer for final build.

• Characterized semiconductor integrated circuit chips, data analysis and test limits for testing devices.

• Qualified devices performing qual test, including thermal shock, temp cycling, autoclave, HAST, storage life, ESD and latch-up.

• Held responsibility for qualifying dies as well as electronic passages, including BGA, flip chip on leadframe, QFN package and TQFP package.

ADDITIONAL EXPERIENCE

UNIVERSITY OF ARKANSAS, Fayetteville, Arkansas, Graduate Research Assistant, 1998-2000. Completed thesis work on low-cost flip chip technology funded by Department of Defense. Developed low-cost flip chip technology. Finished process engineering work to optimize low-cost flip chip technology, including sputtering, photoresist, BCB curing, Argon plasma etching, PECVD as well as electroplating of Pb and Sn to generate Pb/Sn bumps. Worked in class of 1,000 and class 100-fabrication process.

EDUCATION

UNIVERSITY OF ARKANSAS, Fayetteville, Arkansas, M.S., Electrical Engineering, 2000

MANGALORE UNIVERSITY, Manipal, India, B.S., Engineering, Electronics, Telecom, 1997

PROFESSIONAL DEVELOPMENT

TestWare LBE Training, Make OPS Department, 2010

Confidential Information Protection - General Audience, 2009

TE-LTX-301 X-Series Mixed Signal Applications, LTX Fusion Tester Training, 2009

Packaging Technology Symposium 2008, 2008

2008 TI Symposium on TEST, 2008

Intro to Electronic Release to Product and Device Dashboard, 2008

Packaging Technology Symposium 2007 Day 1 and Day 2, 2007

Compressed Gas/Cryogenic Safety Training, 2007

What is Your Corporate Image?, 2007

5S Overview Total Quality Environment, 2007

MAKETEST, 5S Make Test 5S Training for Test Floor Users, 2007

Compressed Gas/Cryogenic Safety Training, 2007

HPA High Performance Development Workshop, 2006

DM5 Planning Customer Care Request (PCCR) User Training, 2006

Cross Culture Communication, Asia Culture, 2006

SUCCESS Stressed for Success, 2005

2004 TI Symposium on TEST, 2004

Ethics, What Would You Do?, 2003

Managing Accelerated Projects Workshop, 2002

Intro to Product and Test Engineering, 2001

TI Campus Recruiter Training 2001, 2001

Behavioral Interviewing, 2001

SPC I Statistical Process Control I, 2001

MSP Teradyne Catalyst Programming, 2001

Product Management, SCTD, 2000

Datapower Statistical Tool Analysis, 2000

Product Management, 2000

MSP A/D Converter Testing, 2000

AFFILIATIONS:Institute of Electrical and Electronics Engineers, 2000-2010, IMAPS, MEPTEC

COMPUTER SKILLS

Microsoft Office Suite, Project, Unix, C, Fortran, DataPower Statistical Tools, QuickSim, QuickHDL, QuickPath, Microsoft Excel, Microsoft PowerPoint, Microsoft Access, DataPower, Spotfire, C++, Statistical tool - RAFT, AutoCAD, VeriBest, Mentor Graphics

SPECIAL MACHINES

SEM, AFM, EDX, Photoresist Spinners, XM_8 Sputtering Machine, RIE Systems, Electroplating, Thermal Evaporators, PECVD, Fabrication of solar cell, Electroscopy, Flip chip bonders, Teradyne A580 testers, Teradyne Catalyst testers, LTX fusion testers, Electroglass probers, TSK probers.

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