Engineer Electrical
Resume:
Kyu-Pyung (Gabriel) Hwang
Office
Qualcomm Inc.
San Diego, CA 92121-1714
Phone: 858-***-****
Home
San Diego, CA 92126
Phone: 617-***-****
E-mail: l2g83w@r.postjobfree.com
Education
• University of Illinois at Urbana-Champaign
Department of Electrical and Computer Engineering Urbana, IL
Thesis advisor: Prof. Andreas C. Cangellaris
Ph.D thesis title: Numerical boundary conditions for the high-order accurate FDTD solution of Maxwell’s equations
Ph.D. Degree in Electrical Engineering 2002
• Ohio State University, Columbus
Department of Electrical Engineering Columbus, OH
Thesis advisor: Prof. Roberto G. Rojas
M.S. thesis title: A study on the characteristic-based finite volume time domain (FVTD) method
M.S. Degree in Electrical Engineering, 1996
• Seoul National University
Department of Electronic Engineering Seoul, Korea
B.S. Degree in Electronic Engineering, 1993
Experience
• Staff Engineer, Qualcomm Inc., Qualcomm CDMA Technologies, San Diego, CA, Jan. 2011-present
o Carrying out pacakge level power delivery network (PDN) design and analysis for digital cores (AP & BB) in Qulacomm products.
• Sr. Engineer, Samsung Electro-Mechanics Co. Corporate Technology Operation, Suwon, Korea, Sept. 2007- Jan. 2011
o Worked as a technical lead for a package electrical design and test group.
o Managed research projects on RF power amp & DC-DC converter modules development.
o participated in an automotive component development project, in charge of EMC testing and modeling.
• Sr. Component Design Engineer, Intel Corporation, Mobility Group/UMG
Folsom, CA Dec. 2005-July 2007
o Worked on platform/system level signal/power integrity analysis & design for Intel low power mobile products.
o Involved in on-chip core power delivery modeling flow development for low power mobile design environment.
• Sr. Package Electrical Engineer, Intel Corporation,
Components Research Chandler, AZ Aug. 2002-Nov. 2005
o Carried out power delivery network modeling and analysis for Intel CPU packages and test vehicles.
o Carried out electromagnetic modeling/simulations for signal integrity analysis of high speed I/O paths in Intel CPU/non-CPU packages, optical test vehicles, and novel interconnects structures.
o Designed and characterized package-embedded RF baluns for Bluetooth/WLAN applications.
o Managed an Intel funded university project on package-embedded magnetic inductors at Stanford University.
• Research Assistant, Center for Computational Electromagnetics
University of Illinois at Urbana-Champaign Urbana, IL 1997--2002
o Conducted researches on novel finite-difference time-domain methods,
o Carried out various industry projects. Projects include signal integrity analysis of novel chip/board level packaging and interconnects, electromagnetic analysis and characterization of electric probes for chip/board level EMI/EMC applications, design of coplanar waveguides for electro-optic modulators, mathematical analysis of power/ground planes in electrical packaging, and analysis of automotive antennas.
o Ph.D. Thesis is on the development of a fourth-order accurate FDTD scheme for efficient time-domain electromagnetic simulations of electrically very long waveguide structures.
• Research Assistant, ElectroScience Laboratory
Ohio State University Columbus, OH 1994--1996
o Conducted researches on finite-difference/finite-volume time-domain methods for electromagnetic simulations.
Skills
• Simulation Tools: Ansoft HFSS, Ansoft Q3D, Agilent ADS, Apache Sentinel PSI, Sigrity PowerSI/Speed2k, HSPICE, CST, Sonnet, NEC, XFDTD
• Programming Languages: Fortran 77/90, C, Matlab, Maple
Systems: Unix, MS-Windows, Linux
Professional Activities
• Senior Member of IEEE
• Served as a reviewer for IEEE Trans. Microwave Theory Tech., IEEE Trans. Antennas Propagat., IEEE Microwave and Wireless Components Letters and Journal of Electromagnetic Waves and Applications
• Served as a session chair for 2005 International Symposium on Antennas and Propagation held in Seoul, Korea.
Publications
• Journal Articles
1. K.-P. Hwang and J.-M. Jin, "A total variation diminishing finite difference scheme for the transient response of a lossless transmission line," IEEE Trans. Microwave Theory Tech., vol. 46, no. 8, pp. 1193-1196, Aug. 1998.
2. K.-P. Hwang and J.-M. Jin, "Application of a hyperbolic grid generation technieque to a conformal PML implementation," IEEE Microwave Guided Wave Lett., vol. 9, no. 4, pp. 137-139, April 1999.
3. K.-P. Hwang and A. C. Cangellaris, "Effective permittivities for second-order accurate FDTD equations at dielectric interfaces," IEEE Microwave Guided Wave Lett. , vol. 11, no. 4, pp. 158-160, April 2001.
4. F. L. Teixeira, K.-P. Hwang, W. C. Chew and J.-M. Jin, "Conformal PML-FDTD schemes for electromagnetic field simulations: a dynamic stability study," IEEE Trans. Antennas Propagat., vol. 49, no. 6, pp. 902-907, June 2001.
5. K.-P. Hwang and A. C. Cangellaris, "Computational efficiency of Fang’s fourth-order FDTD methods," Electromagnetics, vol. 23, pp. 89-102, Feb. 2003.
6. K.-P. Hwang, "A fourth-order accurate FDTD scheme with long-time stability," IEEE Microwave and Wireless Components Letters, vol. 15, no. 4, pp.271-273, April 2005.
7. T. Kamgaing, K. Ichikawa, X. Y. Zeng, K.-P. Hwang, Y. Min, and J. Kubota, "Future package technologies for wireless communication systems," Intel Technology Journal, vol. 9, no.4, pp.353-364, Nov. 2005.
8. K.-P. Hwang and J.-Y. Ihm, "A stable fourth-order FDTD method for modeling electrically long dielectric waveguides," IEEE Journal of Lightwave Technology, vol. 24, no. 2, pp.1048-1056, February 2006.
9. L. Li, S. X. Wang, K.-P. Hwang, Y. Min, M. Mao, T. Schneider, and R. Bubber, "Package-compatibility and substrate dependence of granular soft magnetic material CoFeHfO developed by reactive sputtering," Journal of Applied Physics, vol. 99, no. 8, p. 08M301-1 to 3, April 2006.
10. J.-Y. Ihm and K.-P. Hwang, "RF balun embedded in multilayer organic substrate," Microwave and Optical Technology Letters, vol. 49, no. 2, pp.473-475, February 2007.
11. L. Li, S. X. Wang, K.-P. Hwang, Y. Min, M. Mao, T. Schneider, and R. Bubber, "Tensor nature of permeability and its effects in the simulation of inductive magnetic devices," IEEE Tran. Magnetics, vol. 43, no. 6, pp.2373-2375, June 2007.
12. L. Li, D. W. Lee, M. Mao, T. Schneider, R. Bubber, K.-P. Hwang, Y. Min, and S. X. Wang, "High-frequency responses of granular CoFeHfO and amorphous CoZrTa magnetic materials," Journal of Applied Physics vol. 101, p.123912, June 2007.
13. D. W. Lee, K.-P. Hwang, and S. X. Wang, "Fabrication and analysis of high-performance integrated solenoid inductor with magnetic core," IEEE Tran. Magnetics, vol. 44, no. 11, pp.4089-4095, Nov. 2008.
14. L. Li, D. W. Lee, K.-P. Hwang, Y. Min, T. Hizume, M. Tanaka, M. Mao, T.
Schneider, R. Bubber, and S. X. Wang, "Small-resistance and high-quality-factor magnetic integrated inductors on PCB," IEEE Tran. Advanced Packaging, vol.32, no.4, Nov. 2009.
15. K.-P. Hwang, "A fourth-order accurate numerical boundary scheme for the planar dielectric interface: a 2-D TM case," Journal of the Korean Institute of Electromagnetic Engineering and Science, vol. 11, no. 1, pp.11-15, March 2011.
• Conference Presentations
1. F. L. Teixeira, K.-P. Hwang, W. C. Chew and J.-M. Jin, "On dynamic stability of conformal PML-FDTD for electromagnetic field computations," 1999 SBMO/IEEE MTT-S AP-S and LEOS International Microwave and Optoelectronics Conference,vol.2, pp. 396-399, Rio de Janeiro, Brazil, Aug. 9-12, 1999.
2. F. L. Teixeira, K.-P. Hwang, W. C. Chew and J.-M. Jin, "Conformal perfectly matched layer in the time-domain dynamic stability analysis," Proceedings of PIERS 2000, Progress in Electromagnetic Research Symposium, pp. 195, Cambridge, Massachusetts, July 5-14, 2000.
3. M. J. Choi, K.-P. Hwang and A. C. Cangellaris, "Direct generation of SPICE-compatible passive reduced-order models of ground/power planes," Proceedings of 50th Electronic Components & Technology Conference, pp. 775-780, Las Vegas, NV, May 21-24, 2000.
4. K.-P. Hwang and A. C. Cangellaris, "Numerical boundary conditions at material interfaces for high-order FDTD schemes," Proceedings of 17th Annual Review of Progress in Applied Computational Electromagnetics, pp. 8-15,Monterey, CA, March 19-23, 2001.
5. K.-P. Hwang and A. C. Cangellaris, "Numerical boundary conditions at material interfaces for high-order FDTD schemes," 2001 IEEE AP-S International Symposium and USNC/URSI National Radio Science Meeting, URSI Digest, pp. 251, Boston, MA, July 8-13, 2001.
6. H. Braunisch, K.-P. Hwang, and R. D. Emery, "High-speed performance of compliant die-package interconnects," Proceedings of PIERS 2003, Progress in Electromagnetic Research Symposium, pp. 406, Honolulu, Hawaii, Oct. 13-16, 2003.
7. H. Braunisch, K.-P. Hwang, and R. D. Emery, "Compliant die-package interconnects at high frequencies," Proceedings of 54th Electronic Components & Technology Conference, pp. 1237-1243, Las Vegas, NV, June 1-4, 2004.
8. K.-P. Hwang,"A fourth-order FDTD scheme with long-time stability," 2004 IEEE AP-S International Symposium and URSI Meeting, Monterey, CA, June 20-25, 2004.
9. T. Kamgaing, C. H. Lee, K.-P. Hwang, X. Y. Zeng, J. He, R. Hsu, Y. Min, and J.-Y. Ihm, "Integration of RF inductors and baluns in multilayer organic substrates," Proceedings of IPACK’05, San Francisco, CA, July 17-22, 2005.
10. J.-Y. Ihm, and K.-P. Hwang, "Stability and dispersion analysis of a fourth-order FDTD scheme," Proceedings of 2005 International Symposium on Antennas and Propagation, vol. 1, pp. 173-176, Seoul, Korea, Aug. 2-5, 2005.
11. L. Li, S. X. Wang, K.-P. Hwang, Y. Min, M. Mao, T. Schneider, and R. Bubber ,"Granular soft magnetic material CoFeHfO fabricated by high deposition-rate pulsed reactive sputtering for system-in-package applications," Proceedings of 50th Magnetism and Magnetic Materials Conference, San Jose, CA, Oct. 30-Nov. 3, 2005.
12. L. Li, D. W. Lee, Shan X. Wang, M. Mao, T. Schneider, R. Bubber, K.-P. Hwang, and Y. Min, "High frequency responses of granular magnetic material CoFeHfO and amorphous material CoZrTa," Proceedings of 2006 IEEE International Magnetics Conference, San Diego, CA, May 8-12, 2006.
13. L. Li, S. X. Wang, K.-P. Hwang, Y. Min, M. Mao, T. Schneider, and R. Bubber, "Tensor nature of permeability and its effects in the simulation of inductive magnetic devices," Proceedings of the 10th Joint MMM/Intermag Conference, Baltimore, MD, Jan. 7-11, 2007.
14. D. W. Lee, K.-P. Hwang, and S. X. Wang, "Fabrication and analysis of high-performance integrated solenoid inductor with magnetic core," Proceedings of 2008 IEEE International Magnetics Conference, Madrid, Spain, May 4-8, 2008.
15. D. W. Lee, K.-P. Hwang, and S. X. Wang, "Fabrication and analysis of on-chip magnetic inductors with various design concepts," Proceedings of the 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008.
16. L. Li, D. W. Lee, K.-P. Hwang, Yongki Min, and S. X. Wang, "On-package magnetic materials for embedded inductor applications," Proceedings of 2009 International Conference on Electronic Packaging Technology and High Density Packaging, Beijing, China, Aug. 10-13, 2009.
17. B. M. Kim, K.-P. Hwang, Y. K. Cho, "Investigation of a planar bow-tie antenna fed by a flanged rectangular waveguide," 2011 IEEE AP-S International Symposium and URSI Meeting, Spokane, WA, July 3-8, 2011.
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