Process Engineer

JAY PRAKASH GUPTA

****, ** ******* ****, #*** Cell: 302-***-**** begin_of_the_skype_highlighting              302-***-****      end_of_the_skype_highlighting

Goleta, Ca-93117 Email: *********@*****.***

WORK EXPERIENCE

Process Development Engineer, CREE SBTC, Goleta [March 2009- July 2010]

<<Process development, characterization for GAN LED at Cree>>

• To develop the new LED process, used characterization tools such as AFM, FTIR ,DekTak, Ellipsometer, SEM, EDAX for various material(Metals, Dielectrics), demonstared the feasiblity of the new LED product in the first quarter and developed a robust process by the end of 4th quarter.

• Used the extensive 4 year reasearch experience of processing/characterization of materials(GaN, Si, GaAs) to make the research processes compatible with the manufacturing process(Etching,depositions), which resulted in easy process transfer with no increased tool investment cost.

• Designed the experiments, using one or two variables at a time to reduced the turn around time for LED wafer fab from two months to one month, increasing the processed wafer yield to about 100%.

• Led a team of technicians, worked with a group of PhDs and process engineers for the process development of new LED product. Was able to achieve every quarterly goals(5),till date.

• Performed the characterization of complete LED wafers, analyzing the obtained data, finding possible leakage modes, and implementing changes in the fabrication process to address the leakage modes.

• Implemented failure analysis with SEM, FIB, Thermal imaging resulting in process changes that improved wafer yield, which in turn increased our overall throughput with improved quality.

Research Associate, Photonics and Electromagnetic Laboratory, University of Delaware [Feb 2007-Feb2009]

<<3D Lithography in Polymers for Photonic Crystal Applications at Telecommunication frequency>>

• Fabricated the largest 3D Woodpile structure in polymer (SU8) for photonic crystal applications.

• Developed a whole new fabrication process for 3D Photonic Crystals in polymer using multilayer lithography.

• Characterized 3D photonic structures via SEM and FTIR and explored application of 3D photonic structure at

telecommunication frequency (1.5μm).

<<Fabrication and Characterization of GaAs/AlGaAs Semiconductor Ring Laser Gyroscope>> <<Thesis Topic>>

• Worked on a whole new approach for GaAs/AlGaAs Semiconductor ring laser (SRL) Gyroscope designing,

fabrication and characterization.

• Developed all the processing steps for the GaAs/AlGaAs ring laser fabrication.

• Worked on thin film dielectrics deposition using PECVD and sputtering system.

• Characterized thin film dielectrics by SEM and thin film characterization software(Avasoft)

• Developed an Etching recipe(dry) using ICP for etching dielectric (Cyclotene)

• Developed a Metal contact deposition recipe to overcome planarization difficulties using Sputterer system

• Built a V-I and P-L characterization setup for SRL

• Developed a characterization method right from data acquisition (developed modules using Lab view) to

Optical Spectrum Analyzer(OSA) and Fabry Perot interferometer setup.

• Developed a test setup for Transverse Magneto Optic effect measurement in SRL

<<Exploring Conductive Polymers use for Commercial device Applications >>

• Worked with EO polymer patterning, polling and there use in photovoltaic applications.

• Developed patterning recipe for conductive polymer.

• Developed a characterization model for Conductive polymer using Ellipsometer.

Research Associate, Silicon Carbide Laboratories, University of South Carolina, Columbia, SC

<<Silicon Carbide Wafer Device Defect Characterization>>

• Worked on Silicon Carbide (SiC) wafer defect characterization and correlation

• Performed V-I characterization of Schottky diodes

• Defect characterized SiC wafer by wet KOH etching

• Delivered a report to sponsors on Defect analysis via Correlation of V-I and defect characterization

EDUCATION

University of Delaware, Newark, DE, USA [Graduated in December 2008]

Master of Science in Electrical Engineering (GPA: 3.84/4.0)

Thesis: Fabrication and characterization of GaAs-AlGaAs Semiconductor Ring Laser Gyroscope.

Thesis Advisor: Dr. Dennis Prather, Associate Professor, University of Delaware.

Coursework: Nano-Electronic Device Principles • Advance Engineering Electromagnetics •

Semi-conductor Opto-electronics • Advance Semi-conductor Materials • Electronic Materials Processing •

Theory and design of Diffractive Optics • Optics and Photonics

SGSITS, India [Graduated in May 2006]

B.E in Electronics & Tele-Communication Engineering (GPA: 3.70/4.0)

ACADEMIC PROJECTS

<<Building of Room Temperature Chemical Vapor Deposition system for Dielectrics Deposition>>

• Worked on building an Room Temperature Chemical Vapor Deposition (RTCVD) system for its use in

dielectrics deposition. For 3D Photonic Crystal Fabrication, SiO2 deposition as an insulation layer

between multiple Photo-Resists Layer was desired. RTCVD was built and tested.

<<Matlab simulation of 3D Photonic Crystals Transmission and Reflection Properties, verification of

there Compliance with FTIR measurements>>

• Simulated reflection and transmission characteristics of 3D Woodpile structure in Matlab and matched

them with experiment results .

<<Design SiC PVT Using Virtual Reactor to improve quality of SiC growth>>

• Designed SiC PVT growth insulation using Virtual Reactor simulation tool to improve growth rate, reduce

thermal stress and reduce the resulting defects.

PRESENTATIONS AND CONFERENCE PAPERS

• Co authered an optics express paper, “Fabrication of Uniform Large Area Polymer ‘Woodpile’ Photonic

Crystals Structures with Nanometer-Scale Features”.

• Conference Paper presented on the topic of ‘Large area Woodpile fabrication in polymers’ at SPIE Photonic

West 2009. (Jan 2009)

• Co-Authored the presented Conference Paper on ‘Low threshold SRL fabrication’ at SPIE Photonic

West2009. (Jan 2009)

• Attended CLEO 2007-2008.

Technical Proficiency

Process Tools:

Clean Room Experience:

Lithography: DOE, SPC

More than 3.5 Years

GCA Auto Stepper, Contact Lithography

Etching: Dry(ICP and RIE), Wet(KOH, Dielectric Etching, Metal)

Deposition:

Growth:

Oxidation and Heat Treatment:

Characterization Tools: Thin Film(PECVD, Si, Sputterer),Metal(E-Beam Evaporator, Sputterer),

MBE, PECVD

Wet and Dry Oxidation, Annealing(RTP, Furnace)

FIB, Thermal imaging, Thin Film(Avasoft, SEM, AFM), FTIR, Elipsometer, Profilometer

Device Testing Tools: V-I, P-L, Optical Spectrum Analyzer(OSA), Scanning Fabry-Perot Interferometer

COMPUTER SKILLS

Languages: C

Design and Modeling Tools: L-EDIT,

Characterization Tools: Digilab Resolution Pro, Avasoft Thin Film,

Operating Systems Windows 2000

Software Tools Jmp, Excel, Origin , Math CAD, Ms-Office, Microsof Project

HONORS, AWARDS AND MEMBERSHIPS

• Awarded a Research Assistantship at the Photonics and Electromagnetic Laboratory, University of Delaware.

• Received distinction at CBSE Std. 12th Exams scoring 89% in Physics, Chemistry and Mathematics as

Majors.

• Cultural Secretary of the Indian Graduate Association at University of Delaware.

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