benlih huang resume

BENLIH HUANG

**** ****** ******

Pleasanton, C.A. 94588

925-***-****(home)

jgp89z@r.postjobfree.com

SUMMARY

• Corporate Metallurgist and Research Team Leader to work with marketing, sales, and production departments on new business accounts:

• Worked on company-wide intellectual property issues, marketing and manufacturing issues and new technology developments. Conducted technical presentation and problem-solving workshops at customers’ sites for business marketing.

• Developed lead free low melting temperature and compliant solder materials for emerging low-k flip chip market.

• Developed pure indium for thermal interface material (TIM) application, which became a major business.

• Developed Cu-In-Ga alloys for sputtering targets of emerging thin film solar cell business.

• Over eleven years of technology and process development experiences and achievements on electronic assembly and semiconductor packaging applications:

• Patented lead free Sn-In and SAC-In low-k flip chip and compliant SAC-(Al, Ni) materials.

• Patented Sn-Pb and SAC anti-tombstoning solder alloys for ultra-small chip assembly application, which accounted for 30% of company’s revenue.

• Developed type 5, 6 ultrafine pitch paste technology for wafer bumping, flip chip attach, CSP and BGA applications for semiconductor packaging.

• Worked with customer to develop pure indium for thermal interface materials (TIM) for microprocessor, and which became a major business for the company.

• Developed flux technology and formulations for new alloys and pastes in semiconductor packaging applications.

• Utilized polymeric materials to complement the solder material for semiconductor packaging applications.

• Managerial (Deputy Manager ) experience with a fifteen personnel group on engineering, production, and personnel management issues.

PROFESSIONAL EXPERIENCES

Dec. 2007 – Mar. 2009, Staff Engineer, Formfactor, Inc., Livermore, CA

a. Provided advices on the development of next generation MEMS (Micro-electro-mechanical Systems ) probe card structure using low temperature high creep resistant solders to reduce the reflow temperature and cost, and further developed process for solder bumping and ultrafine pitch area array micro-spring structures.

b. Strengthened the creep performance of micro-springs on a MEMS wafer probe card with underfilling adhesive material and co-developed In-Pb solder/adhesive composite interconnects for a creep resistant next generation 300 mm BGA platform structure for wafer probing, which could withstand 150 oC burn-in temperature. In addition, I also developed the rework process for the manufacturing of this platform.

Jan. 1998 – Dec. 2007, Research Metallurgist, Indium Corporation of America, Clinton, N.Y.

a. Corporate Metallurgist of Indium Corporation, which supplied solder materials and fluxes for electronic assembly, semiconductor packaging and battery industries. Worked on company-wide issues of lead-free alloy strategy, patent infringements, new alloys, and solder powder production, and gave presentations on soldering technologies. Provided advices on processing, reliability, and failure analysis of interconnects for defense and commercial customers. Served as deputy manager of R&D department of 15 personnel on matters on product release, engineering and production orders, attendance, equipment management, technical management, and task assignments, .. etc., and represented the company in NEMI’s tin whisker task group.

b. Conducted workshop and presentations at semiconductor foundry and packaging manufacturers on lead free soldering developments and problem solving sessions. Worked with marketing and sales departments on new business accounts such as solar cell materials, thermal interface materials, and low k flip chip materials.

c. Adapted to the industry’s migration to the lead free solder, worked with the marketing and manufacturing departments to investigate the interactions between lead-free solders with fluxes. Particularly on the electrochemical corrosion phenomena between the solder powder and the flux chemistries and the paste shelf life issue. Based on this work, the R&D department developed the industry first leading high volume no-clean lead-free paste.

d. Developed ultra-fine type 5, 6 powder manufacturing technology for ultra-fine pitch printing and low voiding paste technology for semiconductor packaging application, particularly on the electrochemical compatibility between solder and flux systems. The breakthrough in technology of paste bumping for BGA, CSP, and wafer using stencil printing resulted in the “Best of Proceedings” paper of SMTA 2001, cited widely for solder bumping in electronic packaging. This technology has also resulted in five products.

e. Invented tin/lead and lead free anti-tombstoning alloys to support industry’s efforts in employing ultra small chips on electronic assembly, and was currently accounted for 30% of company’s paste products. U.S. patent 6,783,057 ( for tin-lead ) was granted, and U.S. PAP 2005/0100474 A1 and International publication number WO 2005/048303 A2 ( for lead free ) have been published.

f. Along with marketing and manufacturing departments, I worked with a major chip manufacturer to develop pure indium preform as thermal interface material (TIM 1) for flip chip in package application, and this business became a major business for Indium Corp. I also worked on diamond enhanced TIM1 technology and indium-based reactive solders for bonding bare silicon die.

g. Working with a major Asian packaging manufacturer, I lead a research group to develop a compliant and creep resistant Sn-Ag-Cu-(Al)Ni solder joints, particularly for the poor drop impact resistance problem by modifying the alloys with Al and Ni. Results published in ECTC 2007 and won the “Honorable Mentioned Award “of IPC in APEX 2008. The products were being pilot tested in customer’s sites.

h. In response to the need for a compliant alloy for emerging low k flip chip application, I worked with marketing and sales departments and lead a research group to invent low temperature compliant Sn-In-Rare earth and Sn-Ag-Cu-In solder alloys for next generation flip chip interconnects for low dielectric constant ( low k) semiconductor chips. Provisional and utility patents have been filed. The flux technology has been developed, and the paste is being pilot run in semiconductor packaging manufacturers.

i. Worked with marketing, sales, and production departments to develop Cu-In-Ga alloys for manufacturing sputtering targets for reactive sputtering semiconductor CuInGaSe2 solar cell application with efficiency exceeding 19%.

j. Worked with a Japanese manufacturer to develop lead free high temperature solder alloys to replace the high lead solders for semiconductor applications.

Sep. 1997 – Jan. 1998 Researcher, University of California, Irvine, CA

( supervisor: Professor Enrique Lavernia )

a. Conducted high velocity oxygen fuel (HVOF) thermal spray to form nanocrystalline coating

of cryomilled Cu-Al alloy.

b. Used transmission electron microscope (TEM) to investigate the grain growth mechanism of nanocrystalline 5083 and 7075 aluminum alloy after Hip’ping and extrusion.

Nov. 1995 - July. 1997 Materials Engineer, Smith MegaDiamond Inc. Provo, U.T.

a. Invented multi-layered polycrystalline diamond (PCD) and cubic boron nitride cutters.

b. Studied the fracture toughness of PCD with respect to the impact of particle size, WC-Co content and pressure and time on the liquid phase sintering of the PCD.

c. Developed sub-micron PCD products with 30% increase in fracture toughness.

Jan. 1994 - Nov. 1995 Assistant Specialist, University of California, Irvine, CA ( supervisor: Professor Enrique Lavernia )

a. Established a nanocrystalline materials laboratory and constructed the cryomilling facilities for UC-Irvine, and led a research group of 2 Ph.D and 3 M.S. students to study the synthesis and characterization of in-situ dispersion of nanoscale AlN particles in NiAl/AlN and Fe/AlN nanocomposites.

b. Studied the wear mechanisms in attritor milling that resulted in nanocrystals in metallic glass of Fe-13at.%B-7at.%Si.

Aug. 1988 - Jan. 1994 Research Assistant, Rutgers University, New Brunswick, N. J. (Work conducted at Exxon Corporate Research, Annandale, N. J.)

a. Designed and constructed a cryogenic X-ray sample holder to study the in-situ phase transformation in cryomilling.

b. Demonstrated that the nanoscale mixture transformed to intermetallic NiAl by a combustion-like reaction without forming a supersaturated solid solution as the intermediate phase during cryomilling at 77K.

c. Proved the disappearance of X-ray peaks of the constituent elements during mechanical alloying was due to the atomic scattering factor rather than the actual dissolution of the elements.

d. Obtained in-situ formation of nanoscale AlN particles during cryomilling to achieve thermal stability of nanocrystalline NiAl even at 1100 oC. This work demonstrated that cryomilling is so far the only viable method to produce bulk nanocrystalline materials with a thermally stable nanostructures.

Aug. 1986 – Aug. 1987 Metallurgical Engineer, Walsin Lihwa Electric Wire and Cable Co. Taipei, Taiwan.

a. Established the inductively coupled plasma spectrometer (ICPS) laboratory.

b. Developed the manufacturing technologies for superfine gold bonding wire for integrated circuit packaging.

July. 1982 – June. 1984 Ensign, Taiwan R.O.C. Navy

a. Managed communication between the managing commissioned officers and non-commissioned officers with sailors, and was responsible for the education and morale issues of the sailors and assisted personal affairs and grievances on a naval ship of four hundred personnel.

EDUCATION

Ph.D. in Materials Science Sep. 1987 - Jan. 1994

Rutgers University, New Brunswick, N.J. ( Advisors: Prof. T. Tsakalakos, Dr. Michael Luton/ Exxon Research and Engineering )

Thesis Title: Synthesis of NiAl by Cryogenic Mechanical Alloying (Cryomilling)

M.S. in Materials Science Sep. 1984 - Jun. 1986

Dartmouth College, Hanover, N.H. ( Advisor: Prof. Ian Baker )

Thesis Title: The Effect of Boron on Yield Strength, Recrystallization and Grain Growth of Ni3Al.

B. S. in Metallurgy Sep. 1978 - Jun. 1982

National Cheng Kung University, Taiwan

Thesis Title: Study on Metglas Fe-Co-Ni

VISA STATUS

U. S. Citizen. Naturalized in Rome, New York.

PATENTS

1. Benlih Huang and Ning-Cheng Lee, “ Anti-tombstoning solder alloys for surface mount technology”, U.S. Patent 6,783,057 B2.

2. Benlih Huang and Ning-Cheng Lee, “ Lead-free anti-tombstoning alloys for reflow soldering”, U.S. PAP 2005/0100474 A1.

3. G. Rai , Benlih Huang , Ronald Eyre, Nathan Anderson, “ Non-planar interfaces for cutting elements” filed and assigned USSN 60/033,239.

4. Benlih Huang, Hong-Sik Hwang, and Ning-Cheng Lee, “ Technique to increase the compliance of tin-indium solders“ Provisional patent filing USSN 60/712,175. Utility patent filing U.S. 11/360,812..

5. Benlih Huang, Hong-Sik Hwang, and Ning-Cheng Lee, “ Compliant low temperature Tin-Silver-Copper-Indium solders“ Provisional patent filing U.S. 60/720,039, Utility patent filing U.S. 11/422,782.

6. Benlih Huang, Hong-Sik Hwang, and Ning-Cheng Lee, “ Technique for increasing the compliance of lead free solders containing silver “, Provisional patent filing U.S. 60/729,245.

AWARDS

1. SMTA (Surface Mount Technology Association) “Best of Proceedings” award 2001

“Low Cost Solder Bumping via Paste Reflow” by Benlih Huang and Ning-Cheng Lee.

2. “ Highly Commended Award “ 2006, among the articles published by Soldering & Surface Mount Technology in 2005, by Emerald Publishing, “ Effect of SnAgCu composition on soldering performance “ Benlih Huang, A. Dasgupta and Ning-Cheng Lee, Soldering & Surface Mount Technology Vol. 37, No. 3, p. 9. 2005.

3. IPC in APEX 2008 “ Honorable Mentioned Paper “ award 2008, “ A compliant and Creep Resistant SAC-Al(Ni) Solder “ by Benlih Huang, Hong-Sik Hwang, and Ning-Cheng Lee.

BOOK CHAPTER AND REVIEW ARTICLES

1. Benlih Huang and Ning-Cheng Lee, “ Lead-free Solders and Flux in Reflow Soldering” Chapter 21, “Environment-Friendly Electronics: Lead-free Technology” edited by Jennie S. Hwang, Electrochemical Publication, P. 484, 2001.

2. Benlih Huang and E. J. Lavernia, “ Materials synthesis by mechanical alloying” Journal of Materials Synthesis and Processing, Vol. 3, No. 1, P. 1, 1995.

INVITED PRESENTATIONS

1. Taiwan UMC Packaging Group, speaker, “A compliant and creep resistant SAC-Al(Ni) Solder”, HsinChu, Taiwan, July 29, 2007.

2. SMTA-Chicago Chapter, speaker, “ Controlling lead free tombstoning “Lead free soldering conference, Chicago, IL, June 8, 2005.

3. IMAPS-Chicago-Milwaukee Chapter, speaker, “Conquering lead free tombstoning via composition” Lead free soldering symposium, Chicago, IL, April 20, 2005.

4. IMAPS-Optoelectronics Packaging workshop, speaker, “Compatibility of Lead-free Solders with Reflow Process” Bethleham, PA, Oct. 11, 2001.

5. IMAPS-Keystone Chapter, “ Prospect of Lead free Solders for Reflow Soldering “ speaker, Philadelphia, PA, March 23, 2000.

PROFESSIONAL ACTIVITIES

1. Reviewer, IEEE Transactions of electronics packaging and manufacturing.

2. ASE International, member.

3. TMS, The mineral, metals and materials society, member.

SELECTED PUBLICATIONS

1. Benlih Huang, Hong-Sik Hwang, and Ning-Cheng Lee, “ Compliant and creep resistant SAC-(Al)Ni Solder “, Proceedings of ECTC 2007, Reno, NV, p. 184.

2. Benlih Huang and Ning-Cheng Lee, “Lead-free: controlling tombstoning behavior “, SMT ( Surface Mount Technology) , July, p. 44, 2005.

3. Benlih Huang, A. Dasgupta and Ning-Cheng Lee, “ Effect of SnAgCu composition on soldering performance “ Soldering & Surface Mount Technology Vol. 37, No. 3, p. 9. 2005.

4. Benlih Huang and Ning-Cheng Lee, “ Low cost solder bumping via paste reflow”, Journal of Surface Mount Technology, Jan/Mar. vol. 15, issue 1, p. 16, 2002.

5. Benlih Huang and Ning-Cheng Lee, “ Low cost solder bumping for area array bumping”, Global SMT & Packaging Vol. 1, No. 2, . p. 28. Aug. 2001.

6. Benlih Huang and Ning-Cheng Lee, “ Compatibility of lead-free solders with reflow process “ Proceedings of IMAP Meeting, Nov. 1999.

7. B. Huang, H. G. Jiang, R. Perez, S. N. Nutt, and E. J. Lavernia, “ The effect of Ni on the cryogenic attritor milling of Metglass Fe78B13Si9”, Nanostructured Materials, Vol. 11, p. 1009, 1999.

8. Benlih Huang, R. J. Perez, H. Hu, and E. J. Lavernia, “ Grain growth of nanocrystalline Fe-Al alloys by cryomilling in liquid argon and liquid nitrogen” Materials Science and Engineering A, Vol. 255, p. 124, 1998.

9. B. L. Huang, C. Weis, Xian Yao, D. Belnap, and G. Rai, “Fracture toughness of sintered polycrystalline diamond” Proceedings of 5th International Conference on Advanced Particle Materials and Processes, April, 1997.

10. Benlih Huang, R. J. Perez, E. J. Lavernia, and M. J. Luton, “ Formation of supersaturated solid Solution by mechanical alloying” Nanostructured Materials, Vol. 7, Nos1/2, p. 67, 1996.

11. Benlih Huang, R. J. Perez, P. J. Crawford, A. A. Sharif, and E. J. Lavernia, “ Mechanical crystallization of metglas Fe78B13Si9 during cryogenic mechanical milling” Nanostructrued Materials, Vol. 7, Nos ½, p. 57, 1996.

12. Benlih Huang, J. Vallone, and M. J. Luton, “ The effect of nitrogen and oxygen on the synthesis of NiAl during cryomilling” Nanostructured Materials, vol. 5, No. 6, p. 631, 1995.

13. Benlih Huang, R. J. Perez, P. J. Crawford, A. A. Sharif, S. R. Nutt, and E. J. Lavernia, “ Mechanically induced crystallization of Metglas Fe78B13Si9 by cryogenic high energy ball milling” Nanostructured Materials, Vol. 5, p. 545, 1995.

14. Benlih Huang, J. Vallone, and M. J. Luton, “ Synthesis of nanocrystalline B2 NiAl through cryogenic mechanical alloying “, Nanostructured Materials, Vol. 5, No. 4, p. 411, 1995.

15. R. J. Perez, Benlih Huang, E. J. Lavernia, “ Thermal stability of nanocrystalline Fe-10wt.%Al produced by cryogenic mechanical alloying” Nanostructured Materials, Vol. 7, No. 5, p. 565, 1996.

16. Benlih Huang, J. Vallone, C. F. Klein, and M. J. Luton, “ Synthesis of B2 NiAl by cryomilling”, MRS Proceedings of Particulate Materials, Edited by R. Rhodes, p. 21, 1992.

17. I. Baker, Benlih Huang, and E. M. Schulson, “ The effect of boron on the lattice properties of Ni3Al” Acta Metallurgica, Vol. 35, p. 73, 1988.

REFERENCES

1. Dr. Ning-Cheng Lee, Vice President of R&D, Indium Corporation of America, Clinton, NY 13323, 315-***-**** (cell), jgp89z@r.postjobfree.com.

2. Dr. Weiping Liu, Research Metallurgist, Indium Corporation of America, Clinton, NY 13323, 315-***-**** (main), jgp89z@r.postjobfree.com.

3. Dr. David Xu, Staff Engineer, Palmaz Scientific Corp., Fremont, CA 94539, 925-***-**** (cell), jgp89z@r.postjobfree.com.

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