Joseph M. Felice

Address: *** ******** ***. - ******, ** 13850

Phone (Cell) 607-***-**** Email Address: j2cq7q@r.postjobfree.com

AREAS OF TECHNICAL SKILLS AND PROFICIENCES:

. On site Installation Mechanical Engineer for Nexgen prototype fly-off

and K-max pilotless vehicle.

. Responsible for solid models 3D and 2D drawings for Mechanical

installation Nexgen, APAS, K-Max..

. Relevant Skills:

- Experience in Tool, Test, Production, installation &

Applications design

- Product handling equipment design

- Solid Works 2011

- AutoCAD

- Catia v4 & v5

- CADAM

- Process oriented

- Self motivated and energetic

- Geometric Dimensioning & Tolerancing (GD&T)

- SAP Functional Representative

- ISO 9000 Functional Quality Representative & Auditor

- Word

- Excel

CARRIER HIGHLIGHTS:

. Mechanical Engineer for K-MAX Pilotless prototype helicopter. The

initial COTS hardware selections was no longer available. I researched

the initial parts using my IBM experience and the present replacements

parts for them to the system engineer. Developed the install,

component placement, required mechanical hardware, solid models and

drawings (including formalizing schematics from Visio) in Catia V4,

parts build, hardware acquisition. Onsite ME for install and delivered

aircraft for pre-fly off testing two days ahead of schedule and passed

all testing first time out.

. Implemented system to reduce stiffener stocking by funneling like

product into standard stiffeners. Increasing quantity of the

streamlined stiffeners reducing cost making hard tooling

feasible..First year we had to phase it in, but second year savings of

$4.1 million. I obtained buy in from Production Control,

Manufacturing, Engineering, and our vendor who supplies the

stiffeners.

. Investigated switch from Catia V4 to AutoCAD at IBM, learned AutoCAD

and developed process on my own time, pitched to my manager,

qualified, rolled out to other designers cutting the processing time

from 40 hours per package to 4 hours

. Reduced test head cost from 100k/per to 14k/per with new fixturing.

WORK EXPERIENCE:

MECHANICAL TOOL DESIGNER________________________ July2011 To

Oct2012

- Part of a team that designs, and maintains in plant tooling in

Solid Works 2011 at GE Skaneateles, NY (3D & 2D). also included

engineering test set-ups for evaluation and qualification

(requiring mech. Assembly, schematic generation, wire routing,

and soldiering). Evaluation testing and failure investigations

for the various product lines and tools.

Submitted proposals to Department of Defense (DOD) Small Business

Innovation Research (SBIR):

- N093-161 (Navy) Next Generation Helmet System. Down selected

but not awarded.

- N101-039 (Navy) innovative Quiet Unmanned Air Vehicle

Technologies. Not awarded.

MECHANICAL DEVELOPMENT DESIGNER / DESIGN ENGINEER, 2005 To

2009

. Member of the CSAR-X proposal team (researching components and

updating the prints, including schematics)

. Member of the VIS-X proposal team responsible for Bradley and Humvee

Mechanical Engineering.

. Part of the NEX-GEN inferred sensors team 3D models and 2D drawings

for installed sensors, fairings, heat sinks, wiring, racks, and pass

thru in pressurized compartments, onsite ME, delivered two weeks ahead

of schedule.

. Part of a team that designed (3D, 2D), tracked parts build and

installed APAS in MH-60 helicopter.

. Prepared JLTV (trucks) Engineering bills of materials on excel, prior

to inputting to SAP.

MECHANICAL DEVELOPMENT DESIGNER / DESIGN ENGINEER, 1994 To

2005

. Large and COB board Physical Designer in applications at EI.

. Increased customer response 40% by implementing Cadence in conjunction

with AutoCAD.

. Physical Designer for IFT (International Flex Technology) on flex

circuitry.

. Improved process for manufacturing the Laminate Chip Carrier (LCC) and

reduced the hole location tolerances by 50% and the cost by 18%.

. Key member of task force to improve the gold platting communing bar

system. and resulted in improved platting uniformity with no increase

in cost.

ADVANCED PANEL DESIGNER TEAM LEADER

1983 - 1994

. Co-inventor, developer and led product qualification for Lamination

Verification Site as a cost effective solution to verify proper

sequencing and tolerance adherence of product that contains a maximum

of 60 layers of copper circuits plains.

. Key team member of a Design for Manufacturing Team that researched,

designed, and manufactured the IBM ES9000, 3090, 3080, 4380 main

frames for production.

. Assessed vendor alternatives and redesigned, manufactured, and product

qualified the Internal Resistance Heads on Advanced Panels that

resulted in a 17-23 % reliability improvement with a cost reduction of

400%.

TEST EQUIPMENT DESIGNER

1980-1983

. Worked with a AP development team to design, build, and qualify test

equipment to make up 60,000 electronic contacts per printed circuit

board and test the contacts for shorts, opens, thermal opens, and

shorts, and high resistance shorts.

. Technical team lead for improve thru put of the Leakage tester, Low

Voltage Tester, Board Opens Assembly Tester, the Interchangeable Head

Tester and the SIFI Hi Pot Tester.

. Designed and built many fixtures, carts, in process racks, bath racks

and many small tools to facilitate manufacturing.

EDUCATION HISTORY:

AAS in Mechanical Engineering Tech. from Broome Community College,

Binghamton, NY

EMPLOYMENT HISTORY:

GE

Skaneateles, NY 2011 - Pressent

Lockheed Martin Owego, NY

2005 - 2009

EIT Corp. Endicott, NY

2002 - 2005

IBM Corp. Endicott, NY

1980 - 2002

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