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Engineer

Location:
United States
Posted:
September 09, 2009

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Resume:

ERIC R. FRANCHINO

**** ***** ***. ****.*********@****.***

Stow, OH 44224 *************@*****.***

330-***-****

____________________________________________________________________________________________________________

OBJECTIVE: Seeking an Engineering Leadership Position of Higher Stature & Challenging Opportunities

EDUCATION: The University of Akron, Akron, Ohio

M.S.E.E. Started in Spring 2006 G.P.A.: 4.0

LM Training Classes: Smart Negotiator, Systems Engineering (SDOE) Classes, Digital Design Assurance (DDA), Systems Engineering & Management, Creative Learning, Effective Collaborative Relationships.

The University of Akron, Akron, Ohio

B.S.E.E. Graduation: May of 2003 G.P.A.: 3.317

WORK EXPERIENCE:

5/12/06-Present Electronics Engineer @ Lockheed Martin, Akron, OH. Electronics/Systems Design on DDG 1000 CELS Sensor Suite IPT for the TV & IR Camera Electronics using Xilinx Virtex-4 & DDR2’s, optimizing the hardware/firmware in order to expedite design, Test & Integration, and performing other system-wide support tasks including Fiber Optics & Opto-Electronics. Brian Stamper, Sensor Suite IPT Lead, 330-***-****. Proactively working on the Capture Team with Business Development and meeting with partners & customers in order to establish new lines of business/products; as well as IRAD design and testing efforts. Participant in MS2’s Innovator Program. Denny Adams, Systems Engineer, 330-***-****.

5/19/03-5/12/06 Electrical Hardware Engineer @ Lockheed Martin, Akron, OH. Systems Integration/Design/Test on the F-35 JSF TD Cockpit IPT for the I/O System Hardware & Software, Panels Indicators & Lighting System, and Utility Systems Tier 8’s via actively communicating with vendors, working design issues with fellow engineers, I/O System Prototyping/Testing in order to expedite HSI, and performing other misc. tasks for Cockpit support. Rick Volkmann, Cockpit IPT Lead, 330-***-****.

1/8/01-9/12/02 E.E. Co-op @ Lockheed Martin, Akron, OH. Design of Multi-sensor Signal Processing Board, use of Xilinx Virtex-II & CPLD, created schematics, researched components, wrote software scripts, debugged & tested firmware. Terry Sebok, Senior Design Engineer IR&D, 330-***-****. Testing and re-designing of Low Voltage Power Supply with an Active Load. Conversion of PC power supply into bench supply with meters. Bill Castro, Power Supply Engineering Specialist IR&D, 330-***-****.

6/6/00-8/18/00 E.E. Co-op @ Aircraft Braking Systems Corp, Akron, OH. Performed testing and verification of Electronic Braking Control Units, troubleshooting hardware, reviewed software code, created circuit diagrams based upon my test procedures, refined functional block diagrams for Critical Design Review, participated in important group meetings, and wrote Engineering Product Change Notices. Jim Hill, Manager of Electronics & Software Design, 330-***-****.

4/99-8/01 Computer Networker @ Information Services, The University of Akron. Performed diagnostics on malfunctioning PC software/hardware, configured PC's to the WAN/LAN, data transfer, networked printers, changed TCP/IP addresses, assisted technicians on tougher assignments, setup, and worked with DOS, Microsoft Windows 3.x, 95, 98, Netscape, Hummingbird, PeopleSoft, Macintosh, IBM. Herb Matheny, Manager, 330-***-****.

SKILLS: Worked with Xilinx Virtex FPGA’s, Cadence P-Spice, LabVIEW, Matlab, Excel, Powerpoint, Word, Visio, Project, DOORS, C & VHDL Programming; Soldering & Wiring; Communicates Well with Vendors; Independent Worker, Team Contributor.

HONORS: Patent Pending for the Light-Weight Low-Power High-Definition Display for Airship 2009; LM Spot Award for 2008 Proposal Efforts; The University of Akron (UA) Honors Program & Engineering Scholarships Recipient; HKN E.E. Honor Society Member.

LEADERSHIP ROLES:

7/09-Present IR Camera Test Lead Engineer, for DDG 1000 CELS program.

8/07-3/08 Proposal Lead Engineer, for Goodyear Airship High-Definition Display (proposal analysis, writing, & design).

8/02-5/03 Team Leader, for Senior Design Project of eight (8) of my peers.

8/99-12/00 HKN President & IEEE Officer, of UA’s E.E. Honor Society (Eta Kappa Nu) & Secretary of IEEE.

ADDITIONAL INFORMATION:

Working many nights & weekends in order to meet critical deadlines on programs; Dedicated personal time educating others in LM S&T dpt. for lunch-n-learns; Team Leader for 2003 Future Energy Challenge---Fuel Cell Inverter Design (Senior Project); Enjoys working with others, Running, and Weightlifting; Self-motivated Stock & Real Estate Investor; Attending Church.



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