BiGang Min, PhD, IEEE
682-***-**** / firstname.lastname@example.org
Engineer - Product / Reliability / Quality / Hardware
SUMMARY OF QUALIFICATIONS
Inventive, self-motivated and solution driven professional with proven
senior level experience in semiconductor quality / reliability engineering
and test equipment application. Disciplined and organized in planning and
executing work to ensure improvement of product quality, failure analysis
and reliability testing with solutions to meet demands of the marketplace.
Permanent residency (Green card holder), no H1B sponsor needed.
( Memory module reliability design for testing, DRAM qualification, failure
analysis, burn-in test system design/failure analysis.
( MOSFET wafer level device characterization, reliability testing, wire
bonding, and low frequency noise device modeling.
( Testing equipment/analog/digital circuit design, troubleshooting,
qualification, application, IGBT power electronics, PLC programming.
Electrical Engineering Manufacturing Engineering
Project Management Problem Solving
Customer Service Client Relations
PROFESSIONAL AND RESEARCH EXPERIENCE
EDGE Tech Corporation - Staff Engineer
. Charged with internal products' in-depth stress reliability burn-in
test, specifically on memory product yield and failure analysis,
focused on functional / parametric testing to make recommendations for
. Developed projects in collaboration with vendors and suppliers to
reduce manufacturing cost.
. Developed procedures to qualify memory product and testing system.
Identified corrective action as needed.
. Created sampling procedures and design forms for instructional
purposes. Maintained and revised quality standards, and established
procedures for product evaluating, quality reporting, and reliability
. Compiled and wrote training material. Conducted training sessions for
technicians on quality control activities.
. Responsible for product return for defective root cause investigation,
MTBF/FIT data analysis.
. Assisted ISO 9001 audit, supervised inspection of incoming memory
product to comply with JEDEC standard.
. Highlight: Reduced defective return losses of over 70%, from 3.5% - 4%
to below 1.5% in lead technical position for improving memory product
quality, resulting in savings of more than one million dollars per
NanoFab Center, University of Texas at Arlington - Research Assistant
. Semiconductor device reliability, TDDB testing, DC/CV measurement, low
frequency (1/f) noise modeling.
. High-k dielectric MOSFET device wafer packaging, wire bonding,
probing, and characterization.
. Highlights: Presented research work at Texas Instrument and
Semiconductor Research Corporation with high ranking.
. Seven research papers published in top tier journals and conferences
with high citation numbers.
Electrical Engineering Department, Alfred University, NY - Research
. Fuel processor system modification, Aspen data simulation and
. Highlights: Three US patents and one conference paper published.
Marconi Medical, Chengdu, China - Electrical Field Engineer
. Technical support, circuit / component level debug, and
troubleshooting for biomedical equipment.
. Highlights: Improved CT x-ray tube mechanical design to make it
workable on the 12,000 ft plateau.
. Won Best Engineer Award in 1998.
Chengdu Seamless Steel Pipe Plant, Chengdu, China - Electrical Design
. Design tested equipment for steel tube precise length and weight
measurement to reduce cost.
. Highlights: Developed new measurement methodology, leading to 80% cost
savings by achieving the designed measurement accuracy.
. Published two journal papers due to the new measurement methods.
University of Texas at Arlington, Arlington, TX - PhD. Electrical
Alfred University, Alfred, NY - M.S. Electrical Engineering
University of Electronic Science Technology of China - B.S. Electrical
Membership: IEEE Senior Member