Engineer Customer Service

BiGang Min, PhD, IEEE

**** ****** *****, **********, ***** 75007

682-***-**** / *********@*****.***

Engineer - Product / Reliability / Quality / Hardware

SUMMARY OF QUALIFICATIONS

Inventive, self-motivated and solution driven professional with proven

senior level experience in semiconductor quality / reliability engineering

and test equipment application. Disciplined and organized in planning and

executing work to ensure improvement of product quality, failure analysis

and reliability testing with solutions to meet demands of the marketplace.

Permanent residency (Green card holder), no H1B sponsor needed.

Recognized expertise:

( Memory module reliability design for testing, DRAM qualification, failure

analysis, burn-in test system design/failure analysis.

( MOSFET wafer level device characterization, reliability testing, wire

bonding, and low frequency noise device modeling.

( Testing equipment/analog/digital circuit design, troubleshooting,

qualification, application, IGBT power electronics, PLC programming.

Key Strengths:

Electrical Engineering Manufacturing Engineering

Hardware Design

Project Management Problem Solving

Quality Control

Customer Service Client Relations

Self-Starter

PROFESSIONAL AND RESEARCH EXPERIENCE

EDGE Tech Corporation - Staff Engineer

2006-2012

. Charged with internal products' in-depth stress reliability burn-in

test, specifically on memory product yield and failure analysis,

focused on functional / parametric testing to make recommendations for

quality improvement.

. Developed projects in collaboration with vendors and suppliers to

reduce manufacturing cost.

. Developed procedures to qualify memory product and testing system.

Identified corrective action as needed.

. Created sampling procedures and design forms for instructional

purposes. Maintained and revised quality standards, and established

procedures for product evaluating, quality reporting, and reliability

data analysis.

. Compiled and wrote training material. Conducted training sessions for

technicians on quality control activities.

. Responsible for product return for defective root cause investigation,

MTBF/FIT data analysis.

. Assisted ISO 9001 audit, supervised inspection of incoming memory

product to comply with JEDEC standard.

. Highlight: Reduced defective return losses of over 70%, from 3.5% - 4%

to below 1.5% in lead technical position for improving memory product

quality, resulting in savings of more than one million dollars per

year.

NanoFab Center, University of Texas at Arlington - Research Assistant

2002-2005

. Semiconductor device reliability, TDDB testing, DC/CV measurement, low

frequency (1/f) noise modeling.

. High-k dielectric MOSFET device wafer packaging, wire bonding,

probing, and characterization.

. Highlights: Presented research work at Texas Instrument and

Semiconductor Research Corporation with high ranking.

. Seven research papers published in top tier journals and conferences

with high citation numbers.

Electrical Engineering Department, Alfred University, NY - Research

Assistant 2000-2002

. Fuel processor system modification, Aspen data simulation and

analysis.

. Highlights: Three US patents and one conference paper published.

Marconi Medical, Chengdu, China - Electrical Field Engineer

1996-2000

. Technical support, circuit / component level debug, and

troubleshooting for biomedical equipment.

. Highlights: Improved CT x-ray tube mechanical design to make it

workable on the 12,000 ft plateau.

. Won Best Engineer Award in 1998.

Chengdu Seamless Steel Pipe Plant, Chengdu, China - Electrical Design

Engineer 1990-1996

. Design tested equipment for steel tube precise length and weight

measurement to reduce cost.

. Highlights: Developed new measurement methodology, leading to 80% cost

savings by achieving the designed measurement accuracy.

. Published two journal papers due to the new measurement methods.

EDUCATION

University of Texas at Arlington, Arlington, TX - PhD. Electrical

Engineering 2005

Alfred University, Alfred, NY - M.S. Electrical Engineering

2002

University of Electronic Science Technology of China - B.S. Electrical

Engineering 1990

Membership: IEEE Senior Member

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