Sr. Component Engineer

BRIAN JENDRO

*** ****** ***** *: 256-***-****

Huntsville, AL 35811 *******@*****.*** C: 256-***-****

QUALIFICATION SUMMARY

Senior Component Engineer and Supplier Quality Management with 20 + years experience in the automotive, aerospace, and business machine industries. Background includes technical writing to develop component level specifications and extensive knowledge of electronic component failure analysis. Strengths include teamwork, troubleshooting, problem identification, and resolution. Excellent work and attendance record. Also skilled in SAP, Microsoft Office and have completed VDA 6.3 Auditor training with experience.

Selected accomplishments are as follows:

• Negotiated company agreements with suppliers for component qualification testing, quality, and reliability requirements, continuous improvement and product delivery.

• Implemented the electronic part PPAP system for Chrysler, including writing of the “PPAP Gold book” to help suppliers understand what requirements and documentation were required for submittal and approval of parts to be qualified for use in use in manufacturing.

• Nominated as a sustaining member of the Automotive Electronic Council (AEC) for over 10 years, with duties to update and maintain the Physics of Failure based Stress Tests “Q100” (IC’s), “Q101” (Discrete Semiconductors) and “Q200” (Passive) component level stress tests which are required by automotive and aerospace for qualification of electronic components.

• Organized and setup three separate annual technical “AEC Workshops”. Suppliers and guests from all over the world, including government and university personnel, presented technical papers and attended these events.

PROFESSIONAL EXPERIENCE

CONTINENTAL AUTOMOTIVE (SIEMENS VDO, CHRYSLER) – Huntsville, AL 01/1992–07/2009

Sr. Component Engineer & Supplier Quality Management

Wrote electronic component specifications and performed PPAP component qualifications. Analyzed components by performing failure analysis on failed components and completed teardown analysis of manufactured modules. Managed supplier failure analysis and drove PPM levels near zero with robust corrective actions to ensure the failure mechanism would not be repeated. Analysis tools used were X-ray, microscopes, XRF, lap tables and photographic/micrographic equipment.

ALLIED SIGNAL AEROSPACE CO., AIRESEARCH – Tucson, AZ 04/1989–02/1991

Component Engineer

Wrote standard and non-standard component specifications for use in Aerospace products. Responsible for MRB on all assigned components

Contract Component Engineer to Allied Signal 04/1989-11/1989

ITT (ALCATEL AND IDEA) COURIER – Tempe, AZ 06/1982–11/1988

Sr. Component Engineer

Wrote electronic component specifications, qualified components, supported Engineering, Purchasing, Quality and manufacturing for all assigned components for use in manufacturing.

EDUCATION

Naval Electronics School

Diploma, Hinckley High School – Hinckley, MN

MILITARY

Navy Veteran

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