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Aerospace Stress Engineer

CA, 92683
November 19, 2009

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***** ********** ****** ***# ***, Westminster, CA 92683

Cell: 917-***-**** Work: 562-***-****

E-mail Address:

Gabriel C. Chan


To obtain a challenging position in the field of Aircraft Structural Engineering where my training and experience in development and design will be asset


Jan. 2003 – May 2005

San Jose State University

San Jose, CAMasters of Science, Mechanical Engineering

• • Member of Tau Beta Pi Engineering Society

• Top 5% of the school with a GPA of 3.9/4.0

• Emphasis on mechanical design

• Graduate project: Simulation and stress analysis on Micro-Electro-Mechanical Systems (MEMS) fabrication process using Finite Element Methods.

April. 2002 – July 2002

Silicon Valley College

San Jose, CAComputer Aided Design and Drafting Certificate

Aug. 1998 – May 2002

University of California at Berkeley

Berkeley, CABachelor of Science, Mechanical Engineering

Sept. 1996 – June 1998

University of Minnesota

Twin Cities, MNMechanical Engineering

• Made Dean’s List for Institute of Technology Spring and Fall 1997


October 2008 – Current The Boeing Company Long Beach, CA

Stress Analyst

• Part of a small team of analysts in charge of creating a new set of interior monuments (e.g. full height centerline closet, entrance enclosure, door 5 crewrest) for the upcoming 747-8 intercontinental aircraft. Specific tasks involve creating FEMs based on the designer’s preliminary design. Perform detail stress analysis (via Patran/Nastran and hand calculations) to determine whether design is feasible and provide recommendations when necessary. Generate and document the applied loading to interfacing structure using Patran/Nastran. Create technical document (e.g. stress notes) in an effort to support drawings / parts release.

• Executed complete analysis of 787 floor panels collaborating and coordinating closely with designers from the initial design stages to the final stress reports.

• Authored Excel VBA scripts that substantially raised team efficiency and analysis accuracy.

September 2007 – October 2008 Spirit AeroSystems Tulsa, OK

Stress Analyst

• Perform detail stress analysis on the wing box of a new wing structure. Critical failure modes (e.g web buckling, beam column, stability) were checked using Patran/Nastran and hand calculations.

• Generate and present technical document (e.g Stress Analysis Report) to FAA DER demonstrating structural adequacy and specific FAA regulatory and qualification were in compliance.

• Perform trade studies and review analysis assumptions in an effort to further optimize the wing box design (e.g. good design practice, weight reduction).

September 2005 – September 2007 The Boeing Company Everett, WA

Stress Analyst

• Detail stress analysis of aircraft interior monuments and furnishings using Patran/Nastran Finite Element Analysis (FEA) and hand calculations and recommending changes where necessary. Compiling stress reports for FAA DER approval.

• Review aircraft Supplier/Vendor technical documents (e.g. Stress Analysis or Test Reports) to ensure compliance with Boeing’s Approved Processes and Procedures.

• Investigate urgent technical problems (e.g. manufacturing or production defects) and recommending the corrective action in a timely manner.

• Extract and calculate the Interface Loads for all monuments using Boeing Internal Software (K-Ball, IAS, Section Analysis, FEM) to ensure structural integrity with the airplane structure.

October 2004 – September 2005 Boston Scientific San Jose, CA

Manufacture Engineer (Internship)

• Provide floor support to the Electrophysiology manufacturing facility.

• Improve efficiency and resolve ergonomic issues throughout the implementation of new process and the introduction of new tooling and fixtures.

• Perform extensive notebook studies and statistical analysis of new and existing processes to verify the continuous reoccurrence of positive results of processes.

• Conduct instructional training sessions for production operators.

June 2000 – June 2001

Solectron Inc.

San Jose, CAProcess Engineer

• Oversee end to end manufacturing process of printed circuit boards for a company manufacturing facility, with emphasis on supervision and program creation for Press Fit machines

• Manage, design, and create tooling and fixtures

• Hands on repair of delicate machinery

• Draft technical reports and perform inventory duties

• Along with another individual, aided in the launch of South Carolina branch office production facility, including initial setup of all machinery and training of staff with focus on product quality and throughput.

• Underwent Personal, Technical Skills and Training seminars at a Florida branch office


• Familiarity with: AutoCAD 2009; ProE; ProMechanica; ABAQUS 6.4; MATLAB; HP VEE; MS Office, Adobe Photoshop, Fortran 77; Windows Vista/XP/98/95/3.1; PDM; SAP; Patran/Nastran; Catia V4; Catia V5; Perl; Enovia

• Familiar Boeing softwares/ tools: BDMs, PSDS, Redars, IAS, SA, PDM

• Comfortable with PC configuration, installation, and troubleshooting

• Proficient in Excel Visual Basic

• Fluent in English, Cantonese, and Mandarin

• Excellent communication skills

• Detail oriented

• Work well independently and in a team

• Excellent interpersonal skills

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