Manufacturing Engineer

Objectives: Manufacturing Engineer

Skills:

Management: G.T. 15 years of direct project management experience in Semiconductor Packaging and PCB Technology sectors. Last 10 years specific to startup environments in the U.S.and Asia. I have the ability to create, motivate and extract optimal performance from teams, Knowledge of budgets, cost analysis, personnel development, organizational planning and development. Extensive experienced in developing and managing Intellectual Property both in the US and Internationally.

Concurrent/Manufacturing Engineering: Ability to conduct complex company vendor relationships at all levels, Strengths include the ability to locate, qualify, and select qualified suppliers of electrical and mechanical PCBAs, subsystems, subassemblies and components. Experience base enables the ability to quickly evaluate facilities, process flows, to assess technical capabilities of potential suppliers. Comfortable with technology transfer for new or product specific processes. At ease acting as liaison between employer company and vendor. Ability to provide on-site technical cognizance for both US or overseas contract manufacturing sites. Review and qualify vendors for capabilities in tooling, manufacturing, and enabling road map abilities.

Cost Reduction Programs; Ability work with contact manufacturers and vendors to reduce cost by adapting to existing capabilities or inventing new methods to help drive down cost and help compress development schedules. Developed and implemented outsourcing plans at Silicon Valley Startups High Connection Density Inc. , and Neoconix Inc.

Developmental/Manufacturing/Process Engineering: New Product Introduction, PCB manufacture and PCBA assembly, Product system assembly, integration and test processes. Contract manufacturing PCB and of PCBAs, subassemblies and systems per specification. Documentation and assembly process development. Managed facilities startup including both process and product development activities in U.S. and Asia. Development, sustaining and process engineering responsibilities.

Summary of Experience

8/2002-4/2010 Neoconix, Inc., Co-Founder and Inventor.

• Primary focus developing-inventing new packaging technology and processes based on a new novel widely patented PCB based interconnect. Included working closely with sales and marketing to rapidly adapt the technology to address customer specific needs. Efforts help lead to successful design wins at several key tier one & tier two customer accounts.

• Intimately involved with development of new process introductions and reliability qualification flows needed to address IPC, EIA364 and other customer specific interconnect reliability requirements for a new technology.

• Initiated and actively managed Patent portfolio yielding 53 granted patents both in the US and on the International Stage, 25 additional patents pending in the US and Internationally.

• Enabled US based proto-type facility to address both quick turn and mid level production capabilities to support and maintain new product introductions. Facility model also supported activity required to promptly develop new and novel manufacturing methods to produce advanced PC-Beam products.

• Help maintain control of budgeting expenses including capitol expenditures. Also responsible for driving technical and manufacturing timelines for both a proto-type and high volume facility in China. Directly involved with supplier partner interactions necessary to completed projects and the introductions of new products in a timely manner.

• Drove cost reduction and initial outsourcing of all major component sub-assemblies. Worked directly with US based & over sea suppliers and manufacturing partners to proliferate the technology.

5/1999-5/2002 High Connection Density, Director of Manufacturing, Vice President of Engineering.

• Managed manufacturing and engineering activities for both a module subsystem BU and Land Grid Array packaging interconnect BU. This included managing all phases of new product introduction from conceptual stage through design, prototyping and on to manufacturing. Worked closely with product marketing to develop and qualify new products for both business units.

• Develop new memory and interconnect subsystem solutions selected as reference design wins at both Intel and Cisco.

• Drove planning and development, qualification, reliability and startup activities for Land Grid Array US based pilot line for the Connector BU.

• Conducted similar activities for the Memory Subsystem BU at sister company located in Taiwan.

• Provided technical & manufacturing support for “Sister Company” manufacturing facility in Taipei Taiwan. This included equipment selection and installation of PCBA lines needed for the Rambus Memory and DDR PCBA’s

• Managed budgeting expenses including CAPEX expenditures. Also responsible for driving technical and manufacturing and supplier interactions needed to meet tight project timelines.

1987-1999 Advanced Micro Devices, Process & Project Engineer (Austin Texas-Sunnyvale CA.)

• Managed and maintained ASML steppers performance in flash wafer fabrication facility. Responsible implementing and improving layer to layer registration schemes for existing and new technologies.

• Aided the development of Hot Aluminum Damascene process, Supported and developed numerous thin film processes across AMD advanced PLD,CPU, and Memory product lines. Directly involved depositing first sputtered copper thin films with in AMD.

• Developed and characterized various processes in Plasma Etch, Thin Films and Photo areas.

• Introduction of new advanced resist system that enabled the facility to successfully migrate from .85 micron to .5 micron lines and spaces.

Education:

Attended UT @ Austin : Geo Sciences

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