SUMMARY (US Permanent Resident)
Address:
Oak Ridge, Tennessee 37830 U.S.A. E-mail: fpyg5f@r.postjobfree.com
Cell: 612/483-0012
Home: ***/***-****
A senior device process engineer, scientist on semiconductor chip manufacturing. Near ten years of industry manufacturing experiences, on top of ten years of university and institute research experiences. Excellent hands-on fabricate and laboratory skills. A professional specialist of creativity, scientifically knowing how, and a great team worker.
WORKING EXPERIENCES
July, 2006 to June, 2010 ORTEC at AMETEK, Oak Ridge, Tennessee
Manufacturing process Engineer on Silicon & Germanium X-Ray and Gamma Ray Detector
Had been working as an only active device engineer on High Purity Germanium (HPGe) X-ray and Gamma Ray detector manufacturing for crystal machining, polishing, wet process, ion implantation, diffusion, annealing, surface passivation, ohm-contact, detector loading, and testing, etc., monitoring detector fabricate line, trouble shooting, data connecting & analyzing, facility maintaining, technician training and supervising, etc. ORTEC at AMETEK is a 100-million-dollar sales company, has the Word best HPGe and silicon X-ray and Gamma Ray detector fabricate technology for over four decades, and has her own clean rooms and facilities doing the entire detector process from material purifying and single crystal pulling.
Re-developed detector process-recipes for LEP series and Loax36 HPGe gamma ray detectors successfully, after company could not produce the detectors for years.
Solved detector process related noise problem for GMX detector manufacturing.
Played a very critical role in a multi-million-dollar project of new device manufacturing process.
Worked on a new crystal puller-developing project.
Optimized every step for the HPGe detector manufacturing process line. General detector process yield had been significantly improved.
Doubled, even tripled in some months, detector-manufacturing throughput with even less working force.
September 2004 to June 2006 MicroPho Corp, Mishawaka, Indiana
Senior Scientist on CdZnTe X-Ray and Gamma Ray Detector fabrication
Developed CdZnTe single element, 3 3, 4 4, 16 16, and 32 32 X-ray and Gamma ray detector arrays. Fully developed crystal lapping and polishing, photolithograph processes, wet process, thin film deposition, lift off, and surface passivation etc techniques for CdZnTe device fabricate.
Developed CdZnTe crystal surface special treatment procedure for detector Ohm contact achievement.
March 2004 to Aug. 2004 Yinel Tech Inc., South Bend, Indiana
Senior Scientist on CdZnTe Crystal Growth Manufacturing
Worked in an R&D project of CdZnTe crystal annealing improvement.
Rearranged and improved the airflow configuration for lab clean room.
Worked in CdZnTe Vertical Bridgman crystal growth.
November 2002 to February 2004 Photonami Inc., Chicago, IL
Device clean room process engineer
Had been working in device process, developing III-V (InGaAsP/InP) 1310nm, 1550nm InGaAsP/InP surface emitting DFB Laser Diodes.
Mask fabricate for the photolithograph process. Performed wet processes, photolithograph, etching, deposition, lift-off, etc.
Wet process wafers after E-beam grating writing. Etching, AFM characterization.
November 2002 to February 2004 MicroPhysics Lab, Phys. Dep., University of Illinois at Chicago
Research Assistant Professor
Working as the only device specialist in the lab on special HgCdTe infrared detector development.
Did detector design, photolithograph mask design and fabricate for device process, photolithograph process, wet etching, deposition, dicing saw, detector loading, test, report, and conference presentations.
Did all the device work for two NASA projects.
May 2001 to October 2002 MicroPhysics Lab, Phys. Dep., University of Illinois at Chicago
Post Doctor Research Associate
Worked on detector design, mask design and fabricate for device process, photolithograph, wet etching, deposition, dicing saw,Loading, test, reporting, and conference presentations.
Set up a thermal evaporator system for ZnS and CdTe thin film deposition and made recipes for the operation.
Did the entire device related job for a NIH project.
June 1997 to May 2001 Province Thin Film Lab, Phys. Dep., Soochow University, P.R.China
Assistant, Associate Professor
Worked as assistant, associate professor, and principal investigators for many projects on semiconductor material research and semiconductor device development, supported by Chinese central government, province government, Chinese national laboratories, and University etc.
September 1994 to May 1997 #10 Laboratory, Shanghai Institute of Technology, P.R.China
Researcher
Had been working in one of the top Chinese national HgCdTe Infrared detector fabricator of over 10,000SF clean room doing, lapping, polishing, photolithograph, wet process, thin films, dry etching, sputtering, diffusion, annealing, dicing saw, wire bonding, and a lot more.
Earned PhD degree on new generational HgCdTe detector Surface Passivation development.
EDUCATION
Post Doctor on “Semiconductor Device” at University of Illinois at Chicago, 05/2001- 10/2002 HgCdTe Infrared Detector
Ph.D. on “Semiconductor Physics and Semiconductor Device Physics” at Chinese Academy of Sciences, 09/1994 – 06/ 1997 HgCdTe Infrared Detector
Master degree on “Solid State Physics” at Chinese Academy of Sciences, 09/1991 –06/1994 Luminescent Porous Silicon Research
University on “Physics” at Nanjing Normal University, P.R. China, 09/1983-06/1987
Some Hand-on Clean Room Skills
Wet process, Photolithograph related hand on
Mask Design, CAD Drawing and Data Conversion for Pattern Generate: GCA MANN Model 3600F Pattern Generator experience
Mask Fabrication: both chromium & iron oxide mask fabricate experiences
Photolithograph: Karl Suss MJB3, MA6, etc. Mask aligner experiences. Lots of experiences on both positive & negative Photoresists, such as AZ 1811 (positive), AZ 1818 (positive), AZ 4400 (positive), AZ 5214 (positive & negative), etc.
Special Photolithograph technique: for 10 micron thick metal film lift off
Nomarski Microscope and Surface Profile etc. for process monitoring: Optical profilometer and Mechanical profilometer experience, such as Veeco Wyko NT 3300 Surface Optical Profilometer, Tencor P-1 Long Scan Surface Profiler, etc. experiences.
AFM for E-beam pattern transfer characterization: Contact mode and Tapping mode. Nanoscope III AFM/STM system experiences
Thin Film Clean Room Hand-on Skills
Electron beam: CdT, ZnS, Ti, Cr, Ni, In, Pt, and Au etc. experiences
Sputtering: a-Si, a-Ge, SiN, BaTiO4, Al, Ti, Pt, Au, and Ni etc. experiences
Large area ion beam sputtering: CdT, ZnS, Cr, Pt, and Au etc. experiences
Thermal evaporation deposition: CdT, ZnS, In, Pd, Au, Ni, and Li etc. experiences
PECVD: SiO2 experience
MBE growth: Riber Opus 45 system experience for CdTe on Silicon wafer
Some Other Hand-on Clean Room Skills
Surface Precise Polishing Technique: Lapping, Mechanical, Chemo-mechanical polishing
Crystal wafer precise cutting: Wire Saw & Dicing Saw
Plasma Device Crystal Surface Cleaning for residue of the resist
Vacuum technique: Mechanical pump, Diffusion pump, Turbo pump, Sublimation pump, Ion pump and Cryopump experiences
Hand on Spectra Test Techniques: FTIR absorption spectrum, Raman spectrum, X-ray Photoelectron Spectroscope, etc. experiences
Etching: both dry (Wide ion beam, RIE and Plasma Surface Clean and Etching) and wet Etching
Wire Bonding: Ball, Wedge bonding, manual cool and thermal micro soldering
Annealing: HgCdTe p-type activation, CdZnTe crystallography improving, thin film property improvement, Rear earth luminescent center activation, N-type Germanium Li diffusion etc.
Device Test: I-V, C-V, D*(Detectivity), R (Responsivity), N (Noise), R0A, γ-Ray resolution spectrum related etc.
And More: SEM, TEM, Chemical Wet process Techniques, Photo-Luminescence Spectrum Techniques, R-ray diffraction, Detector loading, Ohm Contact, Packaging
Publication Summary: Published 40 first-authored papers in various kind of reputable journals
Presentation Summary: presented in 10s of international conferences, 6 invited presentations
Awards as Principal Investigator: Received and successfully fulfilled 9 scientific research grants from Chinese government on optoelectronics materials and devices innovation
Grants as Co-Principal Investigator or Investigator: more than 10 other grants, such as 2 NASA projects and 1 projector from USA Army Research Laboratory, on clean room materials and devices innovation R&D
Computer related
JMP, Auto CAD, Microsoft Word, PowerPoint, Excel, GammaVision, Maestro, PDF, Fortran, Basic, Origin, etc.
AFFILIATION
Member of SPIE
References
Available upon request.