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Mechanical Engineering Engineer

Location:
Westerville, OH, 43081
Posted:
September 20, 2012

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Resume:

Uppiliappan (Uppili) Sridharan

**** **** ***** *****

Westerville, OH - 43081

Phone: 614-***-****

email:***********.*@*****.***

PROFILE

Highly motivated hands-on individual with five years of experience in superabrasive [Diamond & Cubic Boron Nitride (CBN)] grinding and cutting tool engineering [Polycrystalline CBN & Diamond (PCD & PCBN)]. Experienced in application and product development support to customers and end users with a scientific approach to problem solving

• Intimate understanding and expertise in single layer [electroplated & brazed], vitrified, resin and metal bond, grinding and honing tools

• Hands on experience in operation of the following:

CNC grinding machines

Semi-automatic honing machine

Lapping machine

Surface polisher

Abrasive grit blasting machine

Handheld XRF

Optical, SEM microscopy

Barkhausen Noise Analysis (BNA)

Surface profilometers

• Proficient in technical presentations at conferences, customer/end user sites

PROFESSIONAL EXPERIENCE

Grinding Applications Development Engineer

Diamond Innovations, OH

Sep 2007 - Aug 2012

Identify, develop and implement new grinding technologies & applications with customers & end-users. Provide superabrasive grinding expertise by leading field tests and laboratory experiments. Help customers understand the benefits of proper grinding methods and product selection. Develop test methods and measurement systems to quantitatively assess product performance and competitive benchmarking. Translate customer & end-user feedback to development team to aid development of more customized product solutions. Deliver technical presentations for new product introductions (NPI) at customers & end-user sites to motivate testing

Key accomplishments:

• Consistently delivered over $250,000 of revenue to the business through new application development for past 4 years.

• Designed and implemented a DOE on metal bond honing tools for a key CBN customer in aid of their foray into a new application space

> Developed a process model for tool life, surface finish and cutting rates based on operating parameters

• Scoped application opportunity and defined key product attributes for profile gear grinding application

> Guided product development team in development of new electroplated CBN by designing a lab scale gear grinding simulation test method

• Responsible for acquisition and implementing the use of non destructive micro structural, BNA technique to detect grinding induced thermal damage

• Led multiple field tests at aerospace, automotive and transmission end user sites for troubleshooting and optimization of grinding processes

> Delivered economical value to end users by implementing good grinding practices with optimal product selection

• Led process improvement efforts for internal operations team in centerless grinding of PCBN and PCD tools

• Developed a novel image analysis technique for analysis of used metal bond and resin bond tools to quantify abrasive retention in tools for better understanding the performance difference of cutting tools

• Represented Diamond Innovations’ in multiple technical conference and tradeshows like IMTS, Gear Expo & Intertech by publishing and presenting technical papers in CBN grinding

Graduate Research Assistant, Grinding & Machining Research Laboratory

University of Massachusetts, Amherst

Sep 2005 - Aug 2007

Research investigating the application of Minimum Quantity Lubrication (MQL) in Grinding using fluids with nano-particle suspensions. Developed a two dimensional, transient thermo-structural finite element model, to simulate thermal distortion in surface grinding under MQL conditions.

Project Intern

Hyundai Motor India Limited, Chennai, India

Jan - Feb 2005

Assigned a project titled ‘Vehicle Pulling and Steering Vibration in Passenger Cars’. Analyzed assembly line processes to determine cause for vehicle pulling and steering vibrations during controlled road testing after vehicle assembly by use of design of experiments (DOE), cause-effect and statistical analyses and recommended corrective measures

Manufacturing Intern

Globe Components Private Limited, Chennai, India.

Sep - Oct 2002

Worked for a third tier automotive component supplier and conducted cycle time analysis for a component called quill shaft. Carried out process monitoring for centerless grinding and cold drawing in bright bar processing.

EDUCATION

University of Massachusetts, Amherst, MA

M.S., Mechanical Engineering

Aug 2007

GPA - 3.35

Thesis - Effects of Minimum Quantity Lubrication (MQL) with Nanofluids on Grinding Behavior and Thermal Distortion

Advisor: Dr. Stephen Malkin

Anna University, Chennai, India

B.E., Mechanical Engineering

May 2005

GPA Equivalent - 3.35

Panimalar Polytechnic College, Chennai, India

Diploma in Mechanical Engineering

April 2002

GPA Equivalent - 3.86

SKILL SET

Solid Modeling: AutoCAD

FEA: ANSYS 10.0

Statistical: Minitab 15, MS-Excel

CNC Programming: GSimple, CNC Simulator, EZ CAM

PUBLICATIONS

Sridharan, U., Ji, S., Kompella, S., Fiecoat, J., ”A Novel Electroplatable CBN for Hardened Steel Gears”, In progress, AGMA Fall Technical Meeting 2012, Oct-Nov 2012

Sridharan, U., Kompella, S., Fiecoat, J., ”Superalloy Grinding with Electroplated CBN Wheels and Influence of Manufacturing Quality on Performance”, Proceedings of Intertech 2011

Sridharan, U., Malkin, S., “Effect of Minimum Quantity Lubrication (MQL) with Nanofluids on Grinding Behavior and Thermal Distortion”, Transactions of NAMRI, Volume 37, 2009, PP: 629-636

REFERENCES

Provided on Request.



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