Uppiliappan (Uppili) Sridharan
Westerville, OH - 43081
Phone: 614-***-****
email:***********.*@*****.***
PROFILE
Highly motivated hands-on individual with five years of experience in superabrasive [Diamond & Cubic Boron Nitride (CBN)] grinding and cutting tool engineering [Polycrystalline CBN & Diamond (PCD & PCBN)]. Experienced in application and product development support to customers and end users with a scientific approach to problem solving
• Intimate understanding and expertise in single layer [electroplated & brazed], vitrified, resin and metal bond, grinding and honing tools
• Hands on experience in operation of the following:
CNC grinding machines
Semi-automatic honing machine
Lapping machine
Surface polisher
Abrasive grit blasting machine
Handheld XRF
Optical, SEM microscopy
Barkhausen Noise Analysis (BNA)
Surface profilometers
• Proficient in technical presentations at conferences, customer/end user sites
PROFESSIONAL EXPERIENCE
Grinding Applications Development Engineer
Diamond Innovations, OH
Sep 2007 - Aug 2012
Identify, develop and implement new grinding technologies & applications with customers & end-users. Provide superabrasive grinding expertise by leading field tests and laboratory experiments. Help customers understand the benefits of proper grinding methods and product selection. Develop test methods and measurement systems to quantitatively assess product performance and competitive benchmarking. Translate customer & end-user feedback to development team to aid development of more customized product solutions. Deliver technical presentations for new product introductions (NPI) at customers & end-user sites to motivate testing
Key accomplishments:
• Consistently delivered over $250,000 of revenue to the business through new application development for past 4 years.
• Designed and implemented a DOE on metal bond honing tools for a key CBN customer in aid of their foray into a new application space
> Developed a process model for tool life, surface finish and cutting rates based on operating parameters
• Scoped application opportunity and defined key product attributes for profile gear grinding application
> Guided product development team in development of new electroplated CBN by designing a lab scale gear grinding simulation test method
• Responsible for acquisition and implementing the use of non destructive micro structural, BNA technique to detect grinding induced thermal damage
• Led multiple field tests at aerospace, automotive and transmission end user sites for troubleshooting and optimization of grinding processes
> Delivered economical value to end users by implementing good grinding practices with optimal product selection
• Led process improvement efforts for internal operations team in centerless grinding of PCBN and PCD tools
• Developed a novel image analysis technique for analysis of used metal bond and resin bond tools to quantify abrasive retention in tools for better understanding the performance difference of cutting tools
• Represented Diamond Innovations’ in multiple technical conference and tradeshows like IMTS, Gear Expo & Intertech by publishing and presenting technical papers in CBN grinding
Graduate Research Assistant, Grinding & Machining Research Laboratory
University of Massachusetts, Amherst
Sep 2005 - Aug 2007
Research investigating the application of Minimum Quantity Lubrication (MQL) in Grinding using fluids with nano-particle suspensions. Developed a two dimensional, transient thermo-structural finite element model, to simulate thermal distortion in surface grinding under MQL conditions.
Project Intern
Hyundai Motor India Limited, Chennai, India
Jan - Feb 2005
Assigned a project titled ‘Vehicle Pulling and Steering Vibration in Passenger Cars’. Analyzed assembly line processes to determine cause for vehicle pulling and steering vibrations during controlled road testing after vehicle assembly by use of design of experiments (DOE), cause-effect and statistical analyses and recommended corrective measures
Manufacturing Intern
Globe Components Private Limited, Chennai, India.
Sep - Oct 2002
Worked for a third tier automotive component supplier and conducted cycle time analysis for a component called quill shaft. Carried out process monitoring for centerless grinding and cold drawing in bright bar processing.
EDUCATION
University of Massachusetts, Amherst, MA
M.S., Mechanical Engineering
Aug 2007
GPA - 3.35
Thesis - Effects of Minimum Quantity Lubrication (MQL) with Nanofluids on Grinding Behavior and Thermal Distortion
Advisor: Dr. Stephen Malkin
Anna University, Chennai, India
B.E., Mechanical Engineering
May 2005
GPA Equivalent - 3.35
Panimalar Polytechnic College, Chennai, India
Diploma in Mechanical Engineering
April 2002
GPA Equivalent - 3.86
SKILL SET
Solid Modeling: AutoCAD
FEA: ANSYS 10.0
Statistical: Minitab 15, MS-Excel
CNC Programming: GSimple, CNC Simulator, EZ CAM
PUBLICATIONS
Sridharan, U., Ji, S., Kompella, S., Fiecoat, J., ”A Novel Electroplatable CBN for Hardened Steel Gears”, In progress, AGMA Fall Technical Meeting 2012, Oct-Nov 2012
Sridharan, U., Kompella, S., Fiecoat, J., ”Superalloy Grinding with Electroplated CBN Wheels and Influence of Manufacturing Quality on Performance”, Proceedings of Intertech 2011
Sridharan, U., Malkin, S., “Effect of Minimum Quantity Lubrication (MQL) with Nanofluids on Grinding Behavior and Thermal Distortion”, Transactions of NAMRI, Volume 37, 2009, PP: 629-636
REFERENCES
Provided on Request.