MEMS Engineer

John M. Kriskey

**** ****** **. #****

Austin Texas 78741

******@*****.***

****.****.********@*****.***

Home: 512-***-****

Cell: (469) 337- 8195

SUMMARY OF QUALIFICATIONS

20+ years of troubleshooting electronics to the component level to include experience reading and producing technical drawings & electronic schematics. 16+ years in the electronics industry as a Electronics Engineer including 10+ years in MEMS/Semiconductor Thin Film – Device/Component Assembly/Packaging Technology Industry and 8+ years in the MEMS foundry and design industries. Experienced in most common thin film semiconductor processes. Design simple to advance circuitry to further the functionality of the original circuits. Knowledge of lean manufacturing and Six Sigma techniques.

EDUCATION

BSEET – Bachelors of Science Majoring in Electronics Engineering Technology, Tampa, Florida 1990-1994

PROFESSIONAL EXPERIENCE

Applied Materials (Contractor thru Adecco) Austin Texas

Sr. Final Test Technician – AMAT FEP Manufacturing test technician working on the RTP (Vantage), EPI & NEON product groups – from facilitation & power up to calibration & analyzation to troubleshooting software, vacuum & electronic components

End to End MEMS / Semiconductor Consulting LLC – Dallas / Austin Texas / Asia Pacific 2005~Present

Consultant - Asia Pacific Regional Semiconductor MEMS Thin Films Processing and Packaging Industries

Advise to numerous and diverse MEMS / Semiconductor manufacturing foundries, equipment makers and material vendors many different diverse methods of processing specific devices, particularly those that require wet electro-etching and electroplating processing – SiP “System in Package” & SoC “System on a Chip” technology's

Consult packaging foundry engineers on new materials, package designs and the needed apparatus and methods in applying them, how to use them to their best benefit, showing them how such new materials such as organic and/or inorganic materials are more beneficial than synthetics

Samsung – Austin, TX 2007 ~ 2008

Sr. Technician / Installation / Equipment Engineer

Troubleshoot & Operate Diffusion Furnaces (Kokusai/TEL/Mattson/Applied Material/Asyst equipment) used in production of semiconductor wafers, and test processed wafers to evaluate performance of machines and equipment. Work with sub-contractors to install new high voltage electrical service feeds, vacuum, process gas, facility water & air Inspects and measures test wafer, using electronic measuring equipment and microscope, to determine that machines and equipment are processing wafers according to specifications. Record test results in logbooks. Discuss production problems with co-workers. Analyze test results, using engineering specifications and calculator or proprietary specific software, and write reports on equipment repairs or re-calibration recommendations and on operator procedure violations Assist in technical writing of semiconductor processing specifications

Lay out, build, test, troubleshoots analog/digital circuitry (Relay Logic ladder diagrams/PLC's), repair and modify developmental and production electronic components, parts, equipment, and systems, such as computer equipment, electron tubes (high vacuum), test equipment, and machine tool numerical controls, applied principles and theories of electronics, electrical circuitry, engineering mathematics, electronic and electrical testing, and physics: Discusses layout and assembly procedures and problems with fellow equipment engineers/technicians and draw sketches/prepare presentations to clarify design details and functional criteria of electronic units. Assemble experimental circuitry (breadboard) and/or complete prototype model according to engineering instructions (DOE), technical manuals, and knowledge of electronic systems and components. Recommend changes in circuitry or installation specifications to simplify assembly and maintenance. Set up standard test apparatus or devise test equipment and circuitry to conduct functional, operational, environmental, and life tests to evaluate performance and reliability of prototype or production model. Analyze and interpret test data.

3S-Phoenix Inc. - Hsin Feng Shiang, Taiwan 2003 ~ 2005

R&D Product Engineering Manager / Process Engineer & International Sales - Applications Manager

Review all current industry package designs, assembly processes, and packaging material positive and negative balancing factors.

R&D in-house responsibilities included re-create (from published patents, technical thesis’s, and prototype’s developed at the local university level) packages, materials, and assembly process specification and technical drawings.

Transfer developed proven 3S Silicon Tech., Inc. equipment processes to mock cycle production, manage cost restraints, install new equipment at customer site, setup alignment of optics for mass production to establish critical component/device to pad/substrate Geometric Tolerance Dimensioning

Chipsense Corp. – Huko, Taiwan 2002 ~ 2003

R&D Project Manager / Process Engineer & International Sales - Applications Manager

Developed new MEMS (Micro Electro Mechanical Systems) device design, fabrication techniques, packaging and testing (including active electronic components [Schottky diode], inkjet nozzles and assembly packaging of numerous devices.

Direct Methanol Fuel Cell Development, prototype, and manufacturing of individual components, such as fuel / water pumps, wrote proposals based upon patents / technical papers.

Developing each component by each sub-component by the necessary selected thin films / substrates per their unique qualities.

Developed systems design platform for haptic technology (as in relation to human sensory & MEMS).

Novellus Systems Taiwan – Hsinchu, Taiwan 1999 ~ 2002

Greater China Technical Support Engineer (150 to 300mm)

Process Engineering Support and Software Support and with technical expertise and knowledge to evaluate, assist and instruct on the operation of and perform analytical troubleshooting on the 3 main aspects of the semiconductor manufacturing equipment including factory automation - SECS / GEM and processes

Region Technical Support to include Taiwan, China, Singapore and Malaysia equipment responsible for: SABRE - Copper Electrofill System; VECTOR / SEQUEL - PECVD Deposition System semiconductor thin films produced on these tools are SiN, SiON, SiO2, FSG, BSG, PSG, SiC, Low K materials; ALTUS - Tungsten WCVD Deposition System featuring plug fill / interconnect processes; INOVA - PVD metal deposition System; SPEED - High Density (HDP) CVD Deposition System used in such process applications as IMD (inner-metal dielectric) & STI (shallow trench isolation)

CVC Products – Fremont, California – Austin, Texas 1996 ~ 1998

Asia Regional Customer Support Engineer

Maintain, install and qualify Physical Vapor Deposition (PVD) and GMR (Gigantic Magneto Resistive) thin metal film semiconductor processing equipment throughout the Asia Pacific / European region.

Fabricate tools within manufacturing, customizing the mechanical properties to accommodate each customers processing needs

Multitude of thin and thick metal films: gold, silver, platinum, tantalum, titanium, nickel, aluminum, also included are Gallium Arsenide for applications in the communication industry and specialized films for making capacitor / resistor networks, artificial crystal growing and read-write heads for computer disk drives.

Applied Materials – San Jose, California – Austin, Texas 1994 ~ 1996

Manufacturing Technologist / Engineer

P5000 & Centura PVD / CVD / Etch process product lines (150mm to 200mm)

Specialized components and CES's (Customer Engineering Specials) including PLIS (Precision Liquid Injection Systems), TEOS and facility equipment (pumps, RF generators and Neslab water coolant systems).

Siyanco Incorporated – Hafar Al Batin, Saudi Arabia 1988 – 1990

Engineering Technician / Instructor

Foreign military depot of engineers supporting guided missile systems for anti tank / aircraft equipment.

Design, modify, troubleshoot and calibrate existing electronic circuitry at the component level to enhance performance to counteract adverse conditions (extreme temperatures and harsh environmental atmospheres).

Systems included radioactive components, infrared optics, cryogenic devices and night vision electronics.

US ARMY – USA – Europe – Korea 1984 ~ 1988

Engineering Technician, Honorably discharged at the grade of E-4

Surface to Surface, Air to Surface Missile Systems (TOW and Dragon)

ENTREPRENEUR

Stain Glass Scripture Productions – Austin, Texas 1998 ~ 1999

Owner and operator of custom stained / painted glass art primarily emphasizing interior church décor and children's television characters.

Languages: English, German and Mandarin Chinese, and some Arabic.

Software/Utilities: ANSYS, MEMSCAP, MEMSPro, EM3DS , ACES (3-D etch simulator), Solid Works, FLOW-3D (surface modeling), ABAQUS Explicit (Finite Element / Structural Analysis) CAD (original) and ORCAD. SPC (Statistical Process Control) Software (InfinityQS, Avance and Business Process Improvement SPC for MS Excel) MS Power Point, MS Word, MS Excel, and MS Access / Project. Programming languages: C+, basic, assembly, FORTRAN, Pascal, and OS9, Labview, etc.

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