Resume: Reliability Engineer

Reza Keimasi

Home address: *** ****** ***** *****, *** 334, Austin, TX 78753

Email: *******@*****.***

Home phone: 512-***-****

Goal:

Looking for a full-time engineering position

Job Experiences:

1. Dell, Inc.: January 2007 to March 2009

• Title: Development reliability engineer

• Responsibilities:

Reliability engineer for development of new power supplies and AC adapters:

 Completed Design for Reliability (DfR) activities for about 30 new development projects

 Working on multiple projects simultaneously on a tight schedule

 Teamwork with cross-functional groups (power engineers, project managers, component engineers, quality engineers, validation team, etc.)

 Working with suppliers and ODMs overseas (China, Taiwan, etc.)

 Development and modification of reliability qualification procedures

 Involvement in development of industry standards

 Qualification of new component suppliers

 Worst Case Electronic Parts Tolerance Analysis (WCEPTA)

 Electrical and thermal stress derating for electronic components

 Thermal profile measurements

 Lead-free soldering process qualification and design of experiment (DOE) for assembly process optimization

 Electrolytic capacitors life calculation

 Design Failure Mode and Effect Analysis (DFMEA)

 Mean Time Between Failure (MTBF) calculation

 Highly Accelerated Life Testing (HALT)

 On-going Reliability Testing (ORT)

 Vibration testing

 Stress-life testing

 Failure analysis

Project on free air cooling of servers inside data centers:

 Initiative with significant cost impact on customers by saving energy

 Experiment with large number of servers and storage systems for long term

 Monthly reports to higher level managements up to VP level

 Design of experiment and defining requirements and conditions for experiment

 Working with cross-functional team for making experimental setup and development of software for parametric data collection

 Development of project database

 Failure analysis and designing experiments for finding root causes of failures

 Development of cause and effect diagram or fishbone diagram for failures

 Statistical data analysis using reliability software such as Minitab and Weibull

High density CPU sockets qualification:

 Qualification of new CPU sockets for new server platforms

 Working with cross-functional teams and Intel

 Working with lab technicians for making experimental setup and running experiments

 Calculating acceleration factors and statistical data analysis

 Failure analysis

2. Center for Advanced Life Cycle Engineering (CALCE): January 2002 to December 2006

• Title: Research assistant

• Responsibilities:

 Conducting research projects sponsored by industry companies and reporting and presenting results on a regular basis

 Project on the effects of mechanical and environmental stresses on flexible termination multilayer ceramic capacitors

 Project on robustness of multilayer ceramic capacitors assembled with lead-free and tin-lead solders

 Project on the performance of active and passive electronic components over extended temperature ranges

 Design of experiments and conducting experiments

 Constructional and material analysis using different experimental techniques

 Investigation of failure mechanisms of electronic products and failure analysis

 Finite element analysis

3. Iran-Khodro Power Train Corporation: January 2000 to December 2000

• Title: Development mechanical engineer

• Responsibilities:

 Working on research and development for design of new car engines

 Optimization of flow inside internal combustion engines

 Computational Fluid Dynamic (CFD) simulation

 Modeling by using software such as Fluent, Gambit, and Techplot

Educations:

Ph.D.:

Mechanical and Reliability Engineering, University of Maryland at College Park, January 2002 to December 2006

GPA: 4.0 / 4.0

Title of the Ph.D. Dissertation: Reliability Issues of Multilayer Ceramic Capacitors

Part of the Ph.D. Courses:

 Mechanical fundamentals of electronic systems

 Failure mechanisms and reliability

 Design in electronic products development

 Integrated circuit design and analysis

 Semiconductor devices and technology

 Experimental methods in material science

 Life cycle cost analysis

 Computational fluid dynamics (CFD)

Masters:

Mechanical Engineering, Sharif University of Technology, Tehran, Iran, 1997-1999

GPA: 18.08 / 20

Rank: 1

Bachelor:

Mechanical Engineering, Sharif University of Technology, Tehran, Iran, 1993-1997

GPA: 16.65 / 20

Rank: 2

Certifications:

American Society of Quality (ASQ) Certified Reliability Engineer (CRE): Received October 2008

Skills:

1. Programming: Microsoft Visual Basic, Microsoft Visual Web developer, Fortran, Matlab, Pascal

2. Software: Minitab, Weibull++, Relex Reliability Studio, Labview, ANSYS, Fluent, IcePak, CALCE PWA, Gambit, Techplot, Microsoft Access, Excel, Word, PowerPoint, Outlook

3. Areas of expertise:

 Design for reliability of electronic products

 Design of Experiments (DOE)

 Statistical data analysis

 Thermal analysis of electronic products

 Reliability testing of electronic products

 Familiarity with industry standards such as, JEDEC, IPC, Telcordia, Military standards, etc.

 Destructive and non-destructive failure analysis of electronic products

 Root cause analysis and failure mechanisms of electronic components and assemblies

 Experimental methods for constructional and material analysis

 Development of Labview programs for controlling equipment and in-situ monitoring of parameters

 Finite Element Analysis (FEA)

 Computational Fluid Dynamics (CFD) and heat transfer and writing CFD programs

4. Experience in working with the following equipment:

 Environmental Scanning Electron Microscope (E-SEM)

 Energy Dispersive X-ray Spectroscopy (EDX)

 Two-dimensional and three-dimensional (CT-Scan) X-ray equipment

 X-Ray Fluorescence (XRF) equipment

 Scanning Acoustic Microscope (SAM)

 Optical microscope

 Servo-hydraulic MTS machine

 Solder/die Shear tester

 Thermo-Mechanical Analyzer (TMA)

 Strain indicator

 ThemoStream for local heating and cooling

 Temperature/humidity chambers

 Semiconductor parameter analyzer

 Network analyzer

 RF Impedance/material analyzer

 LCR meter

 High resistance meter

 Data logger/switch units

Publications:

Journal Articles:

1. Keimasi, M., Azarian, M. H., and Pecht, M., “Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Tin-Lead Solders,” IEEE Transactions on Device and Materials Reliability, Vol. 8, No. 1, March 2008.

2. Keimasi, M., Azarian, M. H., and Pecht, M., “Isothermal Aging Effects on Flex Cracking of Multilayer Ceramic Capacitors with Standard and Flexible Terminations,” Microelectronics Reliability, Vol. 47, Issue 12, pp. 2215-2225, December 2007.

3. Keimasi, M., Ganesan, S., and Pecht, M., “Low Temperature Electrical Measurements of Silicon Bipolar Monolithic Microwave Integrated Circuit (MMIC) Amplifier,” Microelectronics Reliability, Vol. 46/2-4, pp. 326-334, 2006.

4. Keimasi, M., and Taeibi-Rahni M., “Numerical Simulation of Jets in a Cross flow Using Different Turbulence Models,” AIAA Journal, Vol. 39, No. 12, pp. 2268-2277, December 2001.

5. Nie, L., Azarian, M. H., Keimasi, M., and Pecht, M., “Prognostics of Ceramic Capacitor Temperature-Humidity-Bias Reliability Using Mahalanobis Distance Analysis,” Circuit World, Vol. 33, No. 3, 2007.

6. Azarian, M. H., Keimasi, M., and Pecht, M., “Moisture Sensitivity Levels for Plastic Encapsulated Surface Mount Capacitors,” Ready for Submission.

7. Keimasi, M., Azarian, M. H., and Pecht, M., “Temperature-Humidity-Bias Testing of Multilayer Ceramic Capacitors with Standard and Flexible Terminations,” Ready for Submission.

Magazine Articles:

1. Mishra, R., Keimasi, M., and Diganta, D., “The Temperature Ratings of Electronic Parts”, Electronics cooling magazine, Vol. 10, No. 1, pp. 20-29, February 2004.

2. Keimasi, M., Azarian, M. H., and Pecht, M., “How to Choose a Reliable Multilayer Ceramic Capacitor,” Ready to submit to a magazine.

Conference Articles:

1. Keimasi, M., Azarian, M. H., and Pecht, M., “Comparison of Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Eutectic Tin-Lead Solders,” Capacitor and Resistor Technology Symposium, Orlando, Florida, USA, pp. 15-25, April 3-6, 2006.

2. Keimasi, M., Azarian, M. H., and Pecht, M., “Non-Destructive Techniques for Detection of Defects in Multilayer Ceramic Capacitors,” Components for Military & Space Electronics Conference, Los Angeles, California, USA, pp. 125-130, February 6-9, 2006.

3. Keimasi, M., Azarian, M. H., and Pecht, M., “Effects of Lead-Free Solder on Flex Cracking of Multilayer Ceramic Capacitors with Flexible and Standard Terminations,” Components for Military & Space Electronics Conference, Los Angeles, California, USA, pp. 244-251, February 6-9, 2006.

4. Keimasi, M., and Taeibi-Rahni M., “Film Cooling of a Flat Plate in a Turbulent Flow - Numerical Simulation”, CFD2k Conference, Montreal, Quebec, Canada, pp. 889-896, June 2000.

5. Keimasi, M., and Taeibi-Rahni M., “Numerical Simulation of Jets in a Cross flow Using Different Turbulence Models”, CFD2k Conference, Montreal, Quebec, Canada, pp. 361-368, June 2000.

6. Javadi A., Javadi K., Taeibi-Rahni M., and Keimasi M., “Reynolds Stress Turbulence Models for Prediction of Shear Stress Terms in Cross Flow Film Cooling – Numerical Simulation”, 4th International ASME/JSME/KSME Symposium on Computational Technologies for Fluid/Thermal/Chemical/Stress Systems with Industrial Applications, Vancouver, British Columbia, Canada, August 2002.

Honors and Awards:

1. Awarded merit-based fellowship: Graduate school, University of Maryland, College Park, Spring 2002 – Fall 2003 (2 years).

2. Awarded membership in The Honor Society of Phi Kappa Phi based on exceptional scholastic achievement at the University of Maryland.

3. Ranked first at masters level in Mechanical Engineering Department, Sharif University of Technology, Tehran, Iran and awarded by Iran’s vice president at graduation ceremony.

4. Ranked second at bachelor level in Mechanical Engineering Department, Thermo-Fluid, Sharif University of Technology, Tehran, Iran.

Memberships:

1. Member of American Society of Quality engineers (ASQ)

2. Honored member of The Honor Society of Phi Kappa Phi

3. Student member of Institute of Electrical and Electronics Engineers (IEEE)

References:

References will be available upon request.

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