Engineer Manager

Agustín Godino Godino

Mail address: Escultores 4, 5º B. Tres Cantos, 28760. Madrid. Spain

Phone: 34-625-**-**-**.

E-mail: *******@*****.***

PROFESSIONAL OBJETIVE

To work in a technical department, like operations, R+D, engineering, in an international company.

PROFESSIONAL PROFILE

My career has been centered in project development and coordination, in a multinational company, belonging to the microelectronics industry. Most of the time, in the production engineering department. Working always by objectives and with very good teamwork and communication skills.

EDUCATION

MBA, Instituto de Empresa (Madrid). 1985.

BS in Organic Chemistry. Universidad Complutense de Madrid. 1982.

Master in Real Estate Analysis and Management. Universidad de Comillas, Madrid. 2001

Specific knowledge

- Statistical process control.

- Design of experiments.

- Experiment data analysis.

- Manufacturing process optimization.

- Statistics for process control.

- Yield and reliability improvement in VLSI devices.

LANGUAGES

Very high level in english.

Six months stay in London (1984).

One year working in the USA and frequent travelling outside Spain.

COMPUTER SKILLS

Windows applications user, like Excel, Word, Outlook, Power Point, Access, etc. and specific Unix based programs.

DETAILED PROFESSIONAL EXPERIENCE

2001-today: General manager.Urbanizadora Delta S.L.

This is my family’s business and I have been managing several projects in land development and housing during the last years. I took the position when my father stepped down, due to his advanced age.

2003-2004: Financing and RRHH manager. Ralia Tech S.L.

The company was founded by two friends of mine, since they had not experience in starting a new business, they call me up to join them.

• Company start up from scratch.

• Financing management.

• Safety health and prevention policies set up at the job site.

• Strategic and Annual planning.

• Human Resources management and hiring.

Lucent Technologies (when I started was part of AT&T Microelectronics), was a leader in the design and manufacturing of integrated circuits and optoelectronics components for communications. In the company I occupied the following positions:

1998-2001: Senior Yield Improvement Engineer

• Wafer yield follow up and yield improvement responsible.

• Early detection of potential quality problems in the line product.

• Follow up and solving customer claims.

• Yield improvement groups coordination.

• Developed computer tools for yield improvement and analysis.

• Control and follow up of the fabrication processes changes for quality and yield increase.

• Definition and implementation of Yield improvement strategies.

Yield improvement yearly average was, during this period, 10%, which made the Tres Cantos fab Best in class in a world basis, according to a study performed by Sematech (Association which included the main Microelectronics companies in the world).

1993-1998: Senior Process and Technology Development Engineer.

• Developed new processes, jointly with Bell Labs in Orlando, Florida, to introduce new technologies.

• Represented Madrid fab in the intercenters Plasma Etch Subcommittee, to specify and select new production equipment types.

• Transferred new processes and technologies to Madrid fab.

• Generated specifications and controls needed for new technologies and processes.

• Responsible for new engineers and technicians formation.

• Coordinate the plasma area scratch reduction group.

During this period of time, we developed and transferred to production 0.35 and 0.3 um, reaching objectives in a record time. We also expanded capacity by about 40%, with an investment in new equipment, within my area of responsibility of 12 million $.

1987-1993: Process engineer and Senior process eng.

• Installed and started up the equipment in the Plasma etch area.

• Defined the standards for equipment selection in Plasma etch.

• Implemented fabrication processes in the area.

• Generated documentation for equipment use and maintenance.

• Trained operators, maintenance technicians and new engineers.

• Set up the Statistical Process Control for Plasma Etch and corrective actions derived from its use.

• Optimized processes in Plasma etch area.

• Reduced costs.

During 1987 I worked in the fab the company had in Orlando, USA, to be trained for the installation and start up of the new fab in Madrid. During the period 87-95, we qualified 5 edge technologies and increased production up to 3000 wafers per week.

I was responsible for CFCs abatement in the fabrication processes. We were the first fab in the company to accomplish that task.

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