Post Job Free
Sign in

Mechanical Engineer

Location:
3170 mapleleaf dr apt 213, KY, 40509
Posted:
July 30, 2009

Contact this candidate

Resume:

SUMMARY

* years Experience in *D Solid modeling using CAD software IDEAS and NX.

• 5 years Experience in New Product Development process and working with interdisciplinary team with excellent organizational and project management skills.

• Experience in doing BOM’s, ECN’s, and worked extensively on PDM/PLM applications.

• Experience in performing failure analysis using IQ-FMEA.

• Working knowledge of Finite element analysis using IDEAS.

• Experience in inspecting and fixing tooling issues on plastic parts.

• Experience working with Asian vendors/customers and supporting manufacturing builds.

EDUCATION

• M.S., Mechanical Engineering, Apr 2006

University of Alabama in Huntsville (UAH), (GPA 3.35/4.0)

• B.S., Mechanical Engineering, Apr 2003

Jawaharlal Nehru Technological University, India (GPA 3.20/4.0)

RELATED COURSEWORK

CAD, Production Planning and Control, Statics, Mechanics of Solids, Mechanics of Composite Materials, Statics & Dynamics, Strength of Materials, Thermodynamics, Instrumentation & Control Systems, Management Science.

WORK EXPERIENCE

Lexmark International, Lexington, KY (04/2006 – Present)

• As the lead mechanical engineer for the High end Multi Function Printers (MFP) group, I am responsible for research, design and development of the new color MFP X738DE.

• Responsibilities include working with marketing and management teams in defining the product specs, designing conceptual models in CAD, following up with building prototypes using SLA or machine cut parts.

• Performing competitive analysis using various printers, scanners, counting machines etc. Analysis includes detailed testing, followed up with tear-up of the whole system to learn the technology.

• Constantly traveled to Asia (China, Taiwan etc) for various manufacturing builds to inspect the plastic parts, looking at Cp/Cpk data, identifying tooling related issues on the plastic parts, supervise the production process and ensure that the product is meeting the specs.

• Once the parts are made and the machines are assembled, testing and analysis of various parts of a scanner is carried out to ensure that they meet the spec requirements. mechanically using CAD software IDEAS and electrically using multimeters and Oscilloscope.

• Knowledge and experience in areas such as thermal, acoustics, drop & impact tests and electro-mechanical components. Following the test, I’ve to make necessary design changes to satisfy all the short comings.

• Responsible for ensuring all the part drawings, BOM’s and any engineering changes are up to the correct revision levels using PLM matrix application, at the same time making sure the suppliers/ vendors are notified of the changes.

• Work with various cross functional teams like materials engineering (to ensure that the right grade of plastics, lubricants, steel are being used in the product), product safety (to ensure that the product is meeting all the UL standards), reliability, service engineering (to ensure that the product is easy to service), packaging (performing drops tests, testing different foam material etc).

• Always looking out for cost effective solutions by performing various tests and analysis at the same time meeting safety, reliability requirements.

• Training service and system engineers so that they understand the system better while taking service calls. Also responsible for training sales engineers to help them understand the pros and cons of the products.

• Addressing customer related problems for announced products any paper feed issues including scanner jams, multi-feeds etc. Investigation includes performing failure analysis, finite element analysis (if needed), to obtain a solution that would exceed the minimum spec requirements.

Siemens VDO Automotive Corp., Huntsville, AL (Jan – Dec’ 2005)

• As a Co-op for the Electronics & Drivetrain group, I worked on various projects conducting Thermal Analysis and Simulation for drivetrain modules such as GMT900 (GMC), UXCU etc. using FLOTHERM.

• Conducted Strain gage analysis on IDM modules to detect the root cause of the burned capacitor on the PCB. The data was collected using Yokogawa DC 100 Data Collector.

• Used the Thermal IR Camera to capture thermal images of the hot components in the 24V ECM and 24V IDM modules. The images were subsequently compared with the use of thermocouples and calibrated meter.

• Used INSTRON (5 KN) to find the PCB releasing force for a Press-fit Connection on a GMT900 module.

• Using SAP, I helped the Mechanical group in creating and modifying the BOM's, changing materials, correcting Trace Codes etc. to name a few.

• Using the Risk Management Tool IQ-FMEA, I modified the function and failure analysis part of 24V IDM.

• Apart from all the above, I was also involved in making corrections to ISTR (Initial Sample Test Reports), helped in preparing the G8D PCM-Cracked Vias report.

UAH Student Assistant (Jun-Jul’ 2005)

Student assistant for the Division of Continuing Education at UAH, where I assisted the department for the “Exploring Space Program” that was conducted at USSRC.

UAH Graduate Teaching Assistant (Jan-Dec’ 2004)

Tutor for the undergraduate students for courses Statics & Dynamics in the Mechanical Engineering Department.

UAH Student Assistant (Aug-Dec’ 2003)

Helped the students in courses Fluid Mechanics, & Thermodynamics in Mechanical Engineering Department, with the Laboratory experiments and graded the above courses.

TRAINING AND PROJECTS

Univ. of Alabama in Huntsville, (2004-2005)

Graduate project title: “Finite Element Modeling of Cemetitious Composite Plates using IDEAS”.

Siemens VDO Automotivé Corp., Huntsville (Sep-Dec’ 2005)

• Undergone training on Geometric Dimensioning & Tolerance (GD & T) ASME Y14.5 version, as part of the Co-op training program.

• Undergone SAP PDM (Product Data Management) training to learn creating, changing, Engineering Change Master, Bill of Materials, etc.

• Also had training for Potential Failure Mode and Effects Analysis using the IQ-FMEA tool.

Univ. of Alabama in Huntsville, (Oct-Dec’ 2004)

Academic project title: "Design & Performance specifications testing of an UAV (Unmanned Aerial Vehicle)".

Caltech Engg. (P) Ltd., India (Jan-Apr’ 2003)

Undergraduate project on the Design and Manufacturing of the Control Valves of Aerospace Systems that modulate the flow of liquid as per system demand.

Central Institute Of Tool Design, India (Aug-Sep’ 2002)

Undergone training on mechanical application computer packages including AutoCAD and Mechanical Desktop.

Computer Skills

CAD: IDEAS, NX, AutoCAD.

Application Software: Lotus Notes, MS-Excel, Outlook, PLM matrix, SAP PDM, FLOTHERM,

IQ FMEA.

MEMBERSHIPS AND AFFILIATIONS

Student Member of Society of Automotive Engineering (SAE)

Student Member of American Society of Mechanical Engineering (ASME)

References available upon request



Contact this candidate