Engineer Design

Xin Wang

**** ********* ** 469-***-**** (cell)

Frisco, Texas 75034 *******-****@*******.***

Objective:

Seeking a challenging, full-time position in a semiconductor company as a process / product / design engineer to apply my engineering skills for designing or manufacturing leading edge electronic products

Strengths:

Ability to learn quickly, positive attitude, willing to accept challenges to make a difference at work place through hard work and professional skills.

• RF design of the regional cellular network – proficient in design and testing, excellent in troubleshooting, familiar with drive test equipment TEMS and Agilent

• Materials characterization and development – extensive research experience in material engineering using innovative ideas

• Silicon IC fabrication and wafer processing – in-depth knowledge on silicon technology and processing

• Analog circuit design and digital signal processing – strong in analog filter design, familiar with Multisim

• Computer programming skill – familiar with Matlab and C++ coding

Working Experience:

RF Test Engineer (Internship), 3S Network.INC, USA May. 2011-Oct. 2011

• Conducted (Wifi, 3G) drive testing for potential sites, new site integration, and system optimization, Analyzed switch statistics.

• Partnered with system performance to improve 3G network performance by fixed multi-hop relay nodes method.

• Planned frequency assignments and identified technical parameters for network growth.

• Tested RF transmission using Grayson, Clarify collector, Agilent, Spectrum Tracker, Invex 3G and UMTS TEMS 11.0.

• Wrote test cases for call functionality, neighbor hand-offs in a loaded UMTS network. Executed the test cases and documented test results.

• Developed test procedures. Trained current and new employees.

• Used RF and Cell site testing tools (HP Analyzers) and drive test equipment such as TEMS and Agilent for analyzing signal strength. Gained extensive knowledge and usage experience with these testing equipments.

• Used FileZella FTP for data throughput testing in Solaris Unix system.

Test Engineer, Intel Corporation, Shanghai, China Nov. 2004-Aug. 2005

• Performed post-silicon validation of power state flows and low-power DFX features for next generation LPIA (Low Power Intel Architecture) microprocessors and SoCs.

• Worked on post-silicon issue debug. Developed focused tests on post silicon validation.

Process Engineer, Sinyang Semiconductor Materials Corporation, China Feb. 2004-Oct. 2004

• Worked on process control improvement and failure trouble-shooting, including control parameter adjustment.

• Worked on photoresist evaluation, process windows setup.

• Worked on high volume production lines, utilized instruments including Overlay (KLA-Tencor), CD-SEM, NSR-S206D DUV Scanner/Stepper (Nikon), etc.

Research Experience:

Research Assistant, University of Texas at Arlington, USA Sep. 2005 - Sep. 2008

• Development of nickel deposited alumina solar selective absorption coating combined with solar cell working together to generate both heat and electricity.

• Realization of ordered bulk hetero-junction organic solar cell using poly (3-hexylthiophene) (P3HT) and phenyl-C61-butyric acid methyl ester (PCBM) through electro-deposition process.

• Performed extensive thin film characterization experiment using X-Ray Diffraction Optical Microscope (XRD), Scanning Electron Microscope (SEM), Energy Dispersive Spectrometer (EDS), UV-VIS Spectrophotometry, Fourier transform infrared spectroscopy (FTIR), Ellipsometry and Profilometry.

• Hands-on experience in standard silicon processing unit operations (wet cleaning, etching, lithography, oxidation etc.) through Nano laboratory at University of Texas at Arlington.

• Familiar with material processing and growth techniques Chemical vapor deposition (CVD), Plasma-enhanced chemical vapor deposition (PECVD), HV (high vacuum)-CVD, reactive ion etching (RIE), and Physical vapor deposition (PVD).

• Develop linear FIR filter and IIR filter with pass-band edge 1.8 kHz, stop-band edge 2.4 kHz, peak pass-band ripple 0.1 dB, minimum stop-band attenuation 35 dB and sampling rate 12 kHz by using Matlab.

• Hands-on experience with PSPICE and HSPICE

Research Assistant, Fudan University, P.R. China Sep. 2000 - Aug. 2004

• Preparation of molybdenum-doped indium oxide thin films using reactive DC magnetron sputtering.

Education:

University of Texas at Arlington, Texas, USA Jan. 2009 - Dec. 2011

Master of Science in Electrical Engineering GPA: 3.95 / 4.00

University of Texas at Arlington, Texas, USA Aug. 2005 - Dec. 2008

Master of Science in Materials Science and Engineering GPA: 3.65 / 4.00

Fudan University, Shanghai, P.R. China Sep. 2000 - Jul. 2004

B.S in Materials Science and Engineering GPA: 3.56 / 4.00

Skills:

Computer Skills:

• Proficient in programming C++, Matlab, Microsoft Office, and Origin Pro 6.0

Language Skills:

• Fluent in Mandarin and English

Honors and Awards:

• Certified as an Engineer-in-training(EIT) in Texas on 12/23/2010

• Recipient - Materials Science scholarship of University of Texas at Arlington, 2007.

• Recipient - People scholarship of Fudan University, China (Top 5%), 2001 and 2000.

• Vice President - Chinese Student Organization, University of Texas at Arlington

Publications:

• “Solar selective optical coating made with oblated nickel nanoparticles for photovoltaic thermal applications”, X. Wang, M. H.-C. Jin, Nano Lett. (in preparation, 2011).

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