Mechanical Engineering

Vikrant More

**** ***** **** ****, ***# ****, Phone: 334-***-**** Bowie, MD, 20716 **************@*****.***

Objective:

Seeking full-time position which will utilize my technical, organizational, communication and problem-solving skills.

Education:

Master of Science in Mechanical Engineering, Dec 2010

Auburn University, Auburn, AL (GPA: 3.88/4.00)

Thesis: “Prognostics and Health Management of Lead free electronics subjected to Single Steady-State and Multiple Cycling Thermal Environments”.

Advisor: Dr. Pradeep Lall

Bachelor of Engineering in Mechanical Engineering; July 2006

University of Mumbai, Mumbai, MH, India (79%, 1st class with Distinction)

Work Experience:

Graduate Intern, (April 2010- Present)

Material Science and Technology Division, Oak Ridge National laboratory, Oak Ridge, TN

• Analysed dispersion of nano particles in molten steel using Finite Element analysis (Used Solid Works to design the system and Ansys Fluent for the Finite Element Analysis).

• Fatigue testing of Nickel based superalloys for Homogeneous Charge Compression Ignition (HCCI) engines.

Graduate Research Assistant, (August 2007-March 2010)

Centre for Advanced Vehicle Extreme Environment Electronics, Auburn University

Prognostication and Health Management of Lead free electronics subjected to Single and Multiple Thermo-Mechanical Environments (NASA)

• Developed a process for assessment of product damage prior to appearance of any macro-indicators like cracks and de-lamination.

• Prognosticated prior damage in an Electronic system based on a numerical technique called non linear least square method (Levenberg-Marquardt Algorithm).

• Conducted accelerated thermal cycling tests, thermal aging tests and collected reliability data for various BGA architectures. Analyzed the statistical data using two parameter Weibull reliability model.

• Developed finite element-based 3-D creep and plasticity models (ANSYS) to determine solder joint reliability of BGA and SOIC electronic packages.

• Fabricated PBGA and CABGA packages on PCB (Solder paste Printing, Pick and Place and reflow operations) further conducted cross sectioning, X-ray and Scanning Electron Microscopy (SEM), Optical Microscopy, EDX Elemental Analysis of packages to investigate indicators of failure.

Explicit Finite element modeling and Digital Image Correlation Life-Prediction of Lead free Electronics under Shock-Impact

• Experimented exhaustively with drop and shock testing of electronic boards as defined by JEDEC standard as well as in other orientations.

• Performed 3-D nonlinear finite element analysis to predict failure using techniques such as smear properties and Timo-shenko beam models for Drop/Shock conditions in ABAQUS.

• Researched an optical method; Digital image correlation in conjunction with ultra high speed cameras to study full field strain of electrical components.

Graduate Engineering Trainee, Quality in Supplies Department (Dec 2006 – July 2007)

FIAT INDIA PVT LTD, Ranjangaon, Pune, INDIA,

• Conducted Supply-Inspection of various Automobile components and checked for any anomalies based on norms provided by FIAT AUTO SPA, ITALY.

• Established communication with vendor’s in case of such anomalies and took corrective action.

• Coordinated communication between purchase dept, logistics dept, production dept and vendor.

• Hands on Experience on BAAN (Enterprise resource planning software), further used various measuring instrument like Co-ordinate measuring machines (CMM), Robotic arm etc to check for any non-conformity.

Software Skills:

• Modeling and Simulation: AUTOCAD, IDEAS, SOLID WORKS, HYPERMESH, ANSYS, ABAQUS.

• Math Packages: MATLAB, MATHEMATICA, MAPLE.

• Languages: C/C++.

• Sigma Plot, Coral-draw, IMAQ Image vision builder, Image Pro, Microsoft Office.

Selected Technical Publications:

Journal Publication

• Lall, P., Hande, M., Bhat, C., More, V., Vaidya, R., "Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads," Microelectronics Reliability Vol. 49(), pp. 825-838, 2009.

• Lall, P., More, V., Vaidya, R., Goebel, K., Suhling, J.C., “ Assessment of Accrued Thermo-Mechanical Damage in Lead free parts during Field-exposure to Multiple Environments”, Journal of SMT Vol. 23, Issue 2, pp.11-24. 2010.

Conference Publication

• Lall, P., Hande, M., Bhat, C., More, V., Vaidya, R., Suhling, J.C., “Prognostication of System-State in Lead-Free Electronics Equipment under Cyclic and Steady-State Thermo-Mechanical Loads”, 2008 Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2008, Freiburg, Germany.

• Lall, P., More, V., Vaidya, R.,., Suhling, J.C., “Remaining Useful-Life based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal Environments”. 2009 Interpack, SF, California.

• Lall, P., More, V., Vaidya, R., Goebel, K., Suhling, J.C., “ Assessment of Residual Damage in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling”. 2010 ECTC, Las Vegas, NV.

• Lall, P., More, V., Vaidya, R., Goebel, K., Suhling, J.C., “Interrogation of Damage-State in Lead-Free Electronics Under Sequential Exposure to Thermal Aging and Thermal Cycling”. 2010 SMTAI conference, Orlando, FL.

Relevant Coursework:

Mechanics of electronic packaging, Introduction to Finite Element Analysis, Experimental Mechanics, Advanced Mechanics of material, Inelastic Stress Analysis, Mechanics of Composite materials, Digital Signal processing, Continuum Mechanics.

Achievements:

• Won the best of conference proceedings paper award at SMTAI 2010 conference, Orlando, FL.

• Outstanding Poster (Second Place) in Best Poster competition at IMECE 2009 Conference, Orlando, FL

• Graduate Fellowship, Auburn University, Aug`07- Present.

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