Engineer Process

PU YE

**** ****** **.,#*

San Jose, CA *****

408-***-****

*******@*****.***

PROFESSIONAL SKILLS

 Multi years of in-depth industry experiences in semiconductor industry

o Strong background on semiconductor material science and device physics

o Profound understanding of semiconductor device and process issues that are critical to product yield, performance, and reliability

 Comprehensive understanding of semiconductor wafer fabrication processing:

o Enhanced knowledge on silicon deep trench & shallow trench (STI) etch process development

o Enhanced knowledge on ECP and barrier/seed process development

o Enhanced knowledge on defects and thin film analysis

o Fundamental understanding of integration issues among semiconductor processing steps

 Operation of most semiconductor film characterization and metrology inspection tools:

o FEI 1265, DI SPM-7000, Hitachi SEM-4500, SEM-4700, Opal 7830I CD SEM,

o Micrion SIM-9000, Prometrix UV-1250, UV-1050, KLA-Tencor defect & particle scanners, ellipsometer, Veeco D-5000 SPM, etc.

WORK EXPERIENCE

Applied Materials Inc., Santa Clara, CA 2000 – 2008

Senior Process Engineer, MTCG

 Metrology analysis for different PBGs for process development and demo for customers

 Provide analytical work for both internal and external customers. utilizing SEM/EDX, FIB and AFM analysis techniques.

 Working on most wafer inspection and thin film evaluation techniques involved with process development characterization

 Perform materials and physical characterization of development using various materials characterization techniques and interpret results as it impacts processes and materials development

 Cu barrier seed process optimization for 65nm, 45nm, and 32nm Node.

 Expert in operating Dual beam FIB/SEM and AFM

 Develop TEM sample preparation applications and techniques utilizing ion beam based tools

Applied Materials Inc., Santa Clara, CA 1998 – 2000

Etch Process Support Engineer (Contractor)

 Etch process development on Shallow Trench Isolation (STI) and Deep Trench (DT) using Applied Materials Decoupled Plasma Source (DPS)TM DT etcher and Narrow Gap Trench etcher

 Full operational knowledge of Applied Materials Precision 5000 and Centura platform

 Process Development of DPS self-clean in-situ STI

 Expert in operating SEM(scanning electron microscope) for wafer inspection

FIB Lab Inc., Milpitas, CA 1997

Application Engineer

 Using Micrion 9000, a highly sophisticated focused ion beam system to perform delicate circuit edit and cross-section, failure analysis, etc.

KOKUA Program, University of Hawaii 1994 – 1996

Teaching Assistant for Physics

Department of Physics and Astronomy, University of Hawaii 1991 – 1994

Graduate Assistant

 Different superconducting materials research, properties measurement NMR research, signal analysis, electrical diagnostics, metal thin film depositions and thickness matching, vacuum system application and testing, Physics lab instructor, teaching and tutoring, equipment setting up, etc.

Shanghai Municipal Tape-recorder and Radio Equipment Factory, China 1986 – 1989

Process Engineer

 Thin film deposition and thickness matching, thermal evaporation, magnetic head design and testing

EDUCATION

 MS in Physics, Specialize in Experimental Solid State Physics, University of Hawaii, 1993

 BS in Applied Physics, Shanghai University of Science and Technology, 1986

MISCELLANEOUS

 Languages: Fluent in written and spoken English & Chinese (Mandarin)

 Computer applications: MS Office, Acrobat Editor, Image Processing, PC &Macintosh

REFERENCES

 Available upon request

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