Sunita Reddy
Stockton, CA
209-***-**** *********@*****.***
OBJECTIVE
Seeking an opportunity in Manufacturing Industry with an organization seeking strong problem-solving skills, excellent time management and process improvement abilities along with exceptional team building talent.
Skills and Training:
100% proficiency learning course (QUEST) Quality Enhancement Skills Training.
Certified ISO 9000- 2000 internal auditor.
Basic ISO Training for process owners
SPC Software Classes.
IPQC
Team Leader Training
Clean Room
WORK EXPERIENCE
BRIDGELUX April 2011 to Nov 2011
Livermore.
Process Technician: Die Attach
• Set Up, Troubleshoot and Operate automated Die Attach machine.
• Change Epoxy and perform necessary trouble shoot.
• Change configuration requirements per Engineers.
• Work on most of the engineering and R&D products.
• Visual Inspection after Die Attach.
• SPC tests – Die Shear
• Use “MES” and Oracle to control inventory and separate the defective parts according to their defect code.
ISE LABS, Inc. Nov 2010 to April 2011
IC Testing House.
IPQC – Inline Production Quality Control- Inspect all incoming and outgoing quality.
• Do Visual Mechanical Inspections on all incoming components before releasing on line for processing.
• Make sure that all customers instructions, Batch Records, Lot Numbers and Traveler instructions are correct and corresponds to each other.
• Inline quality audits to make sure production is following the specification standards.
• Outgoing inspection and Plant Clearance.
• Issue QCAR ‘s when non conformance occurs.
New United Motor Manufacturing Inc, (NUMMI) 2004-2010
Manufacturer of Toyota and GM vehicles for the domestic market.
Manufacturing Team Member: ( Truck Assembly – Trim 3)
• Assemble over 350 vehicles per day using TPS system.
• Participate in shop wide Jishuken to eliminate defects, increase productivity and reduce cost.
• Lowered scrap costs significantly by facilitating problem solving circles, which identified and resolved production line problems.
• production methods Successfully implemented standardized work process for truck assembly in order to meet company quality standards.
• Decreased vehicle damage through continuous improvement (Kaizen) practices and continual efforts to provide scratch-free.
Intergrated Packaging and Assembly Corporation , ( IPAC ) 1996-2004
(Semiconductor)
Quality Control: In process quality inspection at different stages from Incoming to Fnal inspection. Reworked parts whenever necessary
• Quality inspection at all quality gates using high and low power microscopes, x-ray machines and ic scanners, optical gauges, dial indicators and micrometers.
• Check the Traveler and the BOM to matches all the in process and row material parts..
• SPC test on bonded components- for ball shear, bond pull and cratering test and record the data.
• Perform Internal audits based on ISO 9000-2000 procedures.
• Train , Re-train and cross train all employees whenever necessary.
• Conduct environmental and safety audits in timely manner.
• Help Engineering with failure analysis whenever needed.
Receiving Inspection: Inspect all the row materials conforming specification standards before issuing it to production line using various measuring tools.
• First Article Inspection on new materials for visual, mechanical and dimensions per specification standards and GD&T.
• Interface with supervisors, managers and engineers when needed regarding ITR’s, MRB’s .
• Record all the data.
• Work with Engineers to rework or solve the MRB’s whenever discrepancies occur.
Manufacturing Assembly: Front Line: ( Clean Room )
• Die Attach- using die attach machines or manual die attach.
• WireBond- Operate up to 15 wirebond machines at one time.
• SPC test on bonded components- for ball shear, bond pull and cratering test.
• Third Optical Inspection- Check the bonded components for quality and conformance with the diagram before its sent to next station.
End Line:
• Ball Attach- BGA components. Inspect and rework all the ball attached components before running the pats through reflow machines.
• Molding- Run the automated encapsulated machines and monitor the encap for defects.
• Trim and Form
EDUCATION:
Xavier College