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Quality Control Training

Location:
Stockton, CA, 95206
Salary:
20.00 per hr
Posted:
February 27, 2012

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Resume:

Sunita Reddy

Stockton, CA

209-***-**** *********@*****.***

OBJECTIVE

Seeking an opportunity in Manufacturing Industry with an organization seeking strong problem-solving skills, excellent time management and process improvement abilities along with exceptional team building talent.

Skills and Training:

100% proficiency learning course (QUEST) Quality Enhancement Skills Training.

Certified ISO 9000- 2000 internal auditor.

Basic ISO Training for process owners

SPC Software Classes.

IPQC

Team Leader Training

Clean Room

WORK EXPERIENCE

BRIDGELUX April 2011 to Nov 2011

Livermore.

Process Technician: Die Attach

• Set Up, Troubleshoot and Operate automated Die Attach machine.

• Change Epoxy and perform necessary trouble shoot.

• Change configuration requirements per Engineers.

• Work on most of the engineering and R&D products.

• Visual Inspection after Die Attach.

• SPC tests – Die Shear

• Use “MES” and Oracle to control inventory and separate the defective parts according to their defect code.

ISE LABS, Inc. Nov 2010 to April 2011

IC Testing House.

IPQC – Inline Production Quality Control- Inspect all incoming and outgoing quality.

• Do Visual Mechanical Inspections on all incoming components before releasing on line for processing.

• Make sure that all customers instructions, Batch Records, Lot Numbers and Traveler instructions are correct and corresponds to each other.

• Inline quality audits to make sure production is following the specification standards.

• Outgoing inspection and Plant Clearance.

• Issue QCAR ‘s when non conformance occurs.

New United Motor Manufacturing Inc, (NUMMI) 2004-2010

Manufacturer of Toyota and GM vehicles for the domestic market.

Manufacturing Team Member: ( Truck Assembly – Trim 3)

• Assemble over 350 vehicles per day using TPS system.

• Participate in shop wide Jishuken to eliminate defects, increase productivity and reduce cost.

• Lowered scrap costs significantly by facilitating problem solving circles, which identified and resolved production line problems.

• production methods Successfully implemented standardized work process for truck assembly in order to meet company quality standards.

• Decreased vehicle damage through continuous improvement (Kaizen) practices and continual efforts to provide scratch-free.

Intergrated Packaging and Assembly Corporation , ( IPAC ) 1996-2004

(Semiconductor)

Quality Control: In process quality inspection at different stages from Incoming to Fnal inspection. Reworked parts whenever necessary

• Quality inspection at all quality gates using high and low power microscopes, x-ray machines and ic scanners, optical gauges, dial indicators and micrometers.

• Check the Traveler and the BOM to matches all the in process and row material parts..

• SPC test on bonded components- for ball shear, bond pull and cratering test and record the data.

• Perform Internal audits based on ISO 9000-2000 procedures.

• Train , Re-train and cross train all employees whenever necessary.

• Conduct environmental and safety audits in timely manner.

• Help Engineering with failure analysis whenever needed.

Receiving Inspection: Inspect all the row materials conforming specification standards before issuing it to production line using various measuring tools.

• First Article Inspection on new materials for visual, mechanical and dimensions per specification standards and GD&T.

• Interface with supervisors, managers and engineers when needed regarding ITR’s, MRB’s .

• Record all the data.

• Work with Engineers to rework or solve the MRB’s whenever discrepancies occur.

Manufacturing Assembly: Front Line: ( Clean Room )

• Die Attach- using die attach machines or manual die attach.

• WireBond- Operate up to 15 wirebond machines at one time.

• SPC test on bonded components- for ball shear, bond pull and cratering test.

• Third Optical Inspection- Check the bonded components for quality and conformance with the diagram before its sent to next station.

End Line:

• Ball Attach- BGA components. Inspect and rework all the ball attached components before running the pats through reflow machines.

• Molding- Run the automated encapsulated machines and monitor the encap for defects.

• Trim and Form

EDUCATION:

Xavier College



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