Signal Integrity/RF engineer

Philip Cheung, Ph. D.

***** ****** ******,

Burnsville, MN 5506.

Phone: 952-***-**** Home, 651-***-**** Mobile.

email: ******.********@*****.***

Relevant Professional Summary.

• Innovative and experience engineer with more than 15 years of expertise in

- high speed multi-Gigabit and RF, microwave pcb design and analysis,

- signal and power integrity analysis.

• Highly competent with

- high speed (multi-Gigabit) testing (jitter, eye diagrams, cross-talk) at the device, circuit and board level from MHz to 6 GHz,

- high frequency measurement and characterization of passive and active elements at the die and board level,

- antenna characterization, anechoic chamber antenna measurement support.

• Highly proficient with

- time domain analysis software – signal and power integrity, timing verification,

- frequency domain analysis software -RF and microwave circuit design, board impedance analysis,

- full wave electromagnetic (HFSS) analysis of passive components and packaging, parasitic and equivalent circuit extraction,

- EMI mitigation and analysis,

- signal analysis (MatLab, C++) and thermal package analysis (Icepack, FLUENT).

• Current and past projects include:

- ASIC high speed >10Gigabite SERDES signal, timing and power integrity analysis,

- system integration of RF communication hardware on unmanned airborne

- enclosure and board level design for RF emission compliance and testing to national security qualification (TEMPEST).

• Project management experience on budgetary, scheduling and resources allocation.

• Experienced in the processing, fabrication, assembly and packaging (LTCC) of high speed/RF frequency semiconductor circuits (PA, LNA, Osc, Mixers) and devices.

• Undergone training in the principal and practice of quality control and vendor qualification.

Education

Ph.D. in Electrical Engineering

The University of Texas at Austin December 1990

Master of Science in Electrical Engineering

The University of Texas at Austin December 1987

Bachelor of Science in Electrical Engineering

The University of Texas at Austin May 1984

Professional Experience

Vieir Systems January 2012 – present

• Consultant - Senior RF Engineer - Responsibilities:

- RF ASIC product development base on 65nm CMOS and pHEMT technology;

- RF Product development base on ZigBee radios with microcontroller interface;

- High speed signal integrity pcb development.

General Dynamics Advance Information System October 2004 – December 2011

Lead Hardware Engineer - Signal Integrity Group

Responsibilities:

- Resolve high speed broadband signal integrity issues i.e. jitter, timing, crosstalk;

- power integrity and impedance on die (CMOS technology) and on the board;

- timing simulation on clock path, SERDESand transmission;

- analyze packaging using a finite element full wave electromagnetic simulation (HFSS), circuit simulator (Ansoft Designer and SIWave) coupled with hardware measurements;

- develop methodology for the analysis of signal and power integrity at the asic (CMOS digital) level and pcb board level;

- lead, plan and allocate hardware and software computing resources requirements for execution.

Senior Principal Engineer - Responsibilities:

- developed proposals/technical solutions to compete for funding from Office of Naval Research, Defense Advanced Research Projects Agency and Air force Research Laboratories research programs,

- served as technical lead on all antenna, RF, microwave and signal integrity aspect of projects,

- presented technical briefing, progress and reports to the customers,

- served as subject matter expert on underwater RF signaling to the National Naval Responsibility Technical Panel,

- management responsibilities on projects for risk assessment, reports, budgetary and scheduling.

Achievements

• Principal Investigator for a DARPA funded Advanced Electronic Cooling Technology project.

- proposed and won project for using flow boiling techniques for cooling high heat flux electronic components in 3-D packaging using advance thermal interface material.

- targeted to achieve a heat flux removal of 1kWatt/cm3,

- designed experimental measurements to demonstrate proof of concept,

- correlate measured date to develop an improved empirical model of high void fraction turbulent flow,

- successful validation of this approach will result in a Phase II stage funding for the development of a prototype,

- integration of this technology onto the current generation of airborne platforms will have a watershed operational capability enhancement.

• Principal Investigator for an Underwater RF signaling project.

- proposed and won project to investigate fundamental concepts for improving range and depth of underwater to underwater and underwater into air RF signaling utilizing composite structures for near field enhancements,

- demonstrated a 10x improvement in performance compared to standard loop antennas by modification of the near field properties using a combination of dielectric and slotted cylindrical metallic structure,

- successful integration of new antenna onto unmanned underwater vehicles will result in significant enhancements to operational capabilities.

• Technical Lead on the following projects:

Wireless sensor networking at the hardware level for unattended ground sensors.

- designed a RF board with circular polarized PCB antenna to validated the customer’s hardware,

- measured board and antenna performance parameters,

- modeled system performance (system noise, receiver sensitivity, dynamic range), with several equivalent radio architecture using analog (AM, FM) and digital modulation (FSK, QPSK and OFDM).

Modular RF system Proposal for Air force Research Laboratories.

- developed white paper for abstracting legacy, current and next generation air force RF systems into a modular RF system,

- received favorable review for the approach in abstracting diversified and complex system into modules.

Enclosure and board level design for compliance and testing to national security standards.

- analyzed customer’s enclosure, board layout and architecture for unintended signal emissions (radiating) using signal integrity methodology (HFSS and Designer),

- simulated design changes for reducing unintended signal emissions and demonstrated improvements to customer,

- timely and accurate modeling of the sources of emission with design change improvements enabled the customer to meet emission testing dead line.

Full wave analysis of antennas on naval platform for spectrum management.

modeled the electromagnetic (near field) profile of various antennas on topside for frequency spectrum allocation (full wave analysis using FEKO and Vector Fields),

completed calculations in a timely manner using a hybrid approach to account for metallic structures and the reflections from the sea,

established methodology for analysis of similar platforms.

Integration of a push to talk radio modular payload onto an Unmanned Airborne Vehicle for a network radio with compliance to Military Standards 461.

completed integration with a redesigned of the connector interface to meet signal integrity and Mil-Std 461 compliance,

mitigated a high risk impact to the schedule by taking an accelerated course to program the radios.

Boston Scientific January 2004 - October 2004

Cardiac pace maker company

Principal Electronic Engineer - Supplier Development and Component Group - Responsibilities:

applied good engineering practice to approve or reject non-compliance of a assigned set of RF, asic components and boards used in the manufacture of implanted cardiac pace maker,

conducted root cause analysis of component failure or non-compliance,

visited vendor to qualify manufacturing process of components according to FDA requirements,

conducted accelerated lifetime testing and monthly statistical assessment of component compliance,

initiated, performed and validated corrective action for non-compliance material escape into the manufacturing process.

resolved a technically challenging FDA non-compliance parameter of a RF component without impacting the manufacturing process.

Bermai, Inc. April 2001 - January 2004

802.11a CMOS radio start-up

Senior Design Engineer

Worked with a team of analog and digital IC designers to develop amongst the first 802.11a CMOS radio on the market.

Package Level

- developed and designed a single ceramic package for RF radio and digital base band chip,

- analyzed bond wire inductance, bonding pad capacitance, BGA and package structure to ensure parasitic are compliant to high frequency/signal integrity requirements,

- designed an embedded high frequency balun to transition from differential to single ended line,

- analyzed analog and digital ground planes for power integrity compliance,

- laid out high frequency lines and RF shielding for on ceramic package.

Achievements

awarded patent for the embedded high frequency balun design,

LTCC package design can tolerate manufacturing variation up to 15% on line width, spacing, via size variation without impact on performance,

accomplished compliance to performance requirements in rapid time through a combination of first • Principal calculation, intuitive modeling of complex geometries and careful selection of design parameters for analysis using a full wave simulation software (HFSS),

validated performance of package and models by incorporating test structures and coupons on package.

Board Level

- guided test board layout for initial test of the radio;

- worked on prototype board for package assemble and fabrication;

- guided layout of transmission lines on prototype and test board;

- made RF measurement of high frequency lines and PCB dipole antenna on prototype board;

- calculated impedance matching distributed and lumped components values.

Achievement

first pass success of board design starting from conceptual development to implementation on an aggressive schedule.

Chip Level

- model and measured inductor structure on die,

- guided layout for high frequency interconnects,

- integration and validation of BSIM3 models for UMS RF CMOS process,

- integration and validation of Curtice models for InP HBT power amplifier,

- impedance matching between different components.

Achievement

provided fast and accurate estimate of impedance matching to achieve first pass success,

measured and validated PA design and performance on an aggressive schedule.

System Level

- modeled noise contribution due to insertion loss on board and antenna;

- modeled noise contribution base on an equivalent architecture for the radio.

Achievement

achieve first pass success of radio.

Wavecrest Corporation October 2000 - April 2001

Principal Research Engineer - Technical member of Advance Hardware Group - Responsibilities:

- conducted research, analysis and perform testing on the 10Gbit front end of Wavecrest's Digital Time Series Instrumentation, SIA 3000,

- resolved signal integrity, jitter and high frequency design issues on the 10Gbit front end.

- Contributed to the successful launch of the product at SemiCon 2000.

TLC Precision Wafer Technology, Inc. July 1997 - September 2000

Product Research and Development Manager - Responsibilities:

- developed and built a V and W band GaAs/AlGaAs pHEMT transmit receive module,

- managed the processing and fabrication of TLC’s Varactor Diode Reflection Based Linear Phase Shifter at Ka-Band,

- worked on E-Beam T-gate fabrication,

- measured TLC’s suit of monolithic microwave and millimeter wave integrated circuits for applications in modules and sub-systems. These measurements include voltage controlled oscillators (VCOs), frequency multiplication and harmonic and sub-harmonic mixing, IP3 and load pull measurements,

- technical and sales presentation of TLC’s monolithic microwave and millimeter wave products and technical capabilities to U.S. and overseas customers,

- supervised and mentored a team of technicians, junior (B. Sc) and newly graduated (Ph. D) engineers.

Department of ECE, University of Minnesota, Duluth, Minnesota

September.1990- June 1997

Assistant Professor

- published and presented more than 20 papers in referred journals and conferences in the area of microwave, millimeter wave and lightwave technology.

- reviewer for Journal of Lightwave Technology, Photonic Technology Letters and Journal of Infrared and Millimeter Waves (1995-1997),

- supervised 10 undergraduates in their Undergraduate Research Opportunities Projects, 3 University of Minnesota Supercomputer Institute undergraduate summer Interns and co-advised 2 Ph. D. students at the Twin Cities Campus,

- awarded 3M Non-tenured faculty award (1995) and associate fellow of University of Minnesota Supercomputer Institute (1995-1997),

- taught courses in Digital Logic Design, Analog Electronic Circuits (I & II), Electromagnetic Fields, and Semiconductor Devices Physics,

- organizer and chair session on Computational Methods in Lightwave Technology at the Progress in Electromagnetic Research Symposium in 1995, Seattle, WA and 1997, Hong Kong.

References, list of presentations and publications are available on request.

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