Senior Mechanical Engineer - NPD, Lead, Semiconductor/Medical Devices

Devendra Karodkar

203-***-****, *******@*****.***

EDUCATION BS – Mechanical Engineering - JNEC, Aurangabad, India, GPA 3.83 (1995-1998)

MS – Mechanical Engineering - UNC Charlotte, Charlotte, NC, GPA 3.9 (2001-2006)

SUMMARY Over 20 years of experience in mechanical/electromechanical engineering across semiconductor, medical devices, and automation industries, including:

•New product development (NPD) from concept to manufacturing for semiconductor capital equipment and medical device platforms.

•Engineering team leadership: managed cross-functional teams of 7+ engineers for design release, configuration management, and PLM/PDM systems (Teamcenter, Windchill, SAP, SolidWorks PDM).

EXPERIENCE Veeco Instruments Feb 2021 – Present

Lead Engineer

•Managed NPD of GaN MOCVD tool, with a new vacuum reactor chamber design, contributing to $55M revenue for 2025-26, by leading cross-functional teams and engineering teams.

•Managed team of mechanical engineers, to develop innovative designs using additive manufacturing process for a gas delivery shower head using simulation package Ansys for thermal and CFD modeling.

•Managed engineering team of 7 engineers, to align with release of 500 plus engineering drawings.

•New product development IP is filed for 300 mm wafer deposition tool

•Alignment and corrective actions for interference free cad models for large assemblies.

•Created BKMs for engineering release of standard and non-standard components through dedicated procedures via ECTR to SAP.

•Engineered wet station solutions using Halar, PolyPro Chambers for ETO tools to support record revenue of wafer etch wet processing tools with multiple wafer sizes and multiple stations configurations.

Infinera Mar 2020 – Dec 2020

Principal HW Engineer/Manager

•Responsible for delivering next generation optical data transfer modules test platforms to support extreme temperatures, shocks, vibration testing conditions.

•Mentor team of engineers for best known methods in reliability testing, FMEA, DOE and CAE tools.

•Provided architecture support for optical modules development and testing and managed a team of engineers for configuration and control management in Windchill PDM.

Kulicke and Soffa Mar 2018 – Mar 2020

System Integration Lead

•Managed integration of next-gen ball bonder machines using precision engineering, enhancing serviceability, reliability, and dynamic performance, contributing to $50M revenue.

•Delivered solutions for vibration reduction and noise control, providing $200K cost benefits in semiconductor fabs, analyzed modal data through Matlab

•Trained engineers in FMEA, DOE, and CAPA quality actions resolutions for critical design failures, saving $50K per machine in field service costs.

PHILIPS Jan 2017 – Feb 2018

Engineering Lead

•Responsible for leading the integration of capnography sensors into OEM ventilators for companies like GE and Siemens, enhancing respiratory care and patient monitoring systems, resulting in improved patient outcome.

•Managed technical risk in new product development through DFMEA and DFX methods for robust component and design selection, addressing quality issues through CAPA, and improving legacy products via IQ, OQ, and PQ processes, reducing defect rates.

•Developed electromechanical systems from concept to commercialization using advanced CAD/CAE tools, managing Solidworks PDM configuration and control, implemented reduction in BOM errors release through BOM comparison tools in Excel.

SIEMENS Sep 2014 – Dec 2016

Staff Engineer/Manager

•Directed the design and development of electromechanical systems for IVD instruments, focusing on innovative solutions in vacuum, thermal, and mechatronics systems using CAD/CAE tools, achieving significant cost savings per iteration.

•Mentored and supervised design engineers, ensuring high-quality technical solutions, and trained team on team center release best practices, along with configuration management of top-down assembly.

•Mentored teams of mechanical engineers coordinate system-based design process for top-down builds.

•Presented KPI to ELT on a weekly basis to align with engineering release schedules.

ASML Jan 2007 – Sep 2014

Team Lead

•Responsible to deliver EUV Reticle chuck and reticle handler submodule and assemblies

•Managed the development and design of precision tooling and optical assemblies for EUV lithography machines, achieving 80% machine utilization and saving $500K per shift by resolving field issues swiftly.

•Improved engineering release process for multi-site CAD and Teamcenter BOM release rules to enable 24 hrs. design cycles for EUV activities.

•Managed team of engineers for new product development, including EUV reticle chuck, optical assemblies, precision tooling, IP development, cost reduction, and process improvements, increasing storage capacity.

KEY SKILLS Siemens NX • SolidWorks • PLM/PDM (Teamcenter, Windchill, SAP) • Configuration Management • ECO/Change Control • DFMEA • DFX • DOE • CAPA • New Product Development (NPD) • Precision Mechanical Design • Additive Manufacturing • Resource/Team Management• Ansys• Matlab • Minitab

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