Senior Mechanical Engineer Electronic Packaging Expert

JAVID MESSIAN

Senior Mechanical Engineer Electronic Packaging & Product Design Specialist

**** ****** ****** ******* ****, CA 91423

Tel: 818-***-**** **********@*****.***

SUMMARY

Innovative Mechanical Engineer and Product Design / Electronic Packaging Expert with over 20 years of experience designing rugged electromechanical hardware, packaging of electronic subsystems, and interconnect systems for space, defense, and commercial applications. Skilled in SolidWorks, ANSYS, and NX, with expertise spanning DFM/DFA, MIL-STD-810, and harsh-environment product design. Strong background in thermal management, root-cause analysis, FAAT/DVT testing, and production support. Proven ability to lead cross-functional teams, solve complex design challenges, and deliver manufacturable, high-reliability solutions. Worked with limited general direction and work effectively within an Integrated Product Team (IPT) environment. mentoring of less Senior Mechanical staff and the ability to delegate tasking to achieve program design objectives. Hands-on experience with hardware integration. Excellent problem-solving skills, attention to detail, and ability to work in a fast-paced environment Core Competencies:

Mechanical & Electronic Packaging Design 3D CAD Modeling DFM/DFA MIL-STD-810 Compliance Rugged/Waterproof Design Thermal/Structural/CFD Analysis BOM / Drawing Development FEA Product Verification Testing Cross-Functional Leadership Material Selection Failure Analysis Design for Harsh Environments Trade Studies Supply Chain Support Design Reviews Qualification Testing Production Support Product Delivery Life cycle Tooling &Test Fixtures Design Basic Understanding of RF Systems, Phase Array Antennas and RF Devices VPX & VME Electronics Packaging Designing thermal solutions for conduction, air and/or liquid cooling PROFESSIONAL EXPERIENCE

CesiumAstro – El Segundo, CA

Senior Principal Mechanical Engineer March 2023 – Present

Lead RF mechanical engineer for design of Ka-Band, S-Band, and L-Band AESA Transmitters/Receivers, Phase Array Antennas & Radio Processing Units, large scale ground station for space, defense, and commercial satellites and antiaircraft communication systems.

Developed 3D CAD models, detailed drawings, and BOMs using SolidWorks.

Create installation drawings and interface control documents

Designed conductive and air-cooled chassis, VPX, VME modules, backplanes, and power systems using DFM/DFA principles.

Familiarity with VITA standards for electronics and mechanical form factors.

Performed thermal and structural analysis in ANSYS; validated designs per MIL-STD-810 and NASA criteria.

Conducted root-cause analysis, implemented design improvements, and led FAAT/DVT plans.

Collaborated across engineering, quality, and manufacturing teams for production readiness and issue resolution.

Epirus Inc. – Torrance, CA

Senior Principal Mechanical / Electronic Packaging Engineer Aug 2021 – Mar 2023

Designed rugged mechanical and RF assemblies for directed-energy counter-electronics and phase-array radar systems.

Modeled liquid and air-cooled high-power modules (up to 8kW) meeting MIL-STD-810G and EMI compliance.

Created 2D/3D drawings, BOMs, and test fixtures in SolidWorks and NX.

Conducted hands-on prototyping, troubleshooting, and failure analysis for electromechanical systems.

Authored test procedures, developed design verification plans, and resolved MRB hardware anomalies.

Northrop Grumman – Woodland Hills, CA

Senior Principal Mechanical / Electronic Packaging Engineer Jul 2018 – Aug 2021

Designed Inertial Navigation Systems (INS) and Gyroscope Assemblies for aircraft and space environments.

Conducted structural and thermal analysis using ANSYS and SolidWorks Simulation.

Transitioned prototype designs into production hardware, integrating DFM/DFA principles. Rockley Photonics – Pasadena, CA

Senior Mechanical Engineer Jun 2015 – Apr 2018

Designed Silicon-Photonics and LiDAR packaging for automotive and data-center applications.

Performed thermal/CFD modeling with ANSYS Workbench and IcePack.

Led prototypes and material selection for rugged optical packaging solutions. Crane Aerospace & Electronics – Burbank, CA

Electronic Packaging Engineer Jan 2013 – Jun 2015

Developed ARINC-600 enclosures, Castings, and PCBA Assemblies for commercial and military aircraft systems.

Created detailed CAD drawings, BOMs, and est plans, supporting manufacturing and qualification testing.

Conducted thermal/structural analysis using SolidWorks Simulation and ANSYS. Moog, Inc. Aerospace & Defense – Torrance, CA

Electronic Packaging Engineer Dec 2006 – Nov 2012

Designed sealed water proof power electronic units and actuator-mounted electronics for Boeing 787 and Airbus A350.

Directed FAAT and DVT per MIL-STD-810; authored mechanical and environmental test procedures.

Developed standards, checklists, and ECO processes for the packaging team. BAE Systems Platform Solutions – Los Angeles, CA

Senior Principal Hardware Design Engineer 1999 – 2006

Designed flight control and navigation systems for military and commercial aircraft.

Created rugged enclosures, PCBAs and interconnect assemblies for high-vibration and temperature environments.

Performed environmental testing and failure analysis under airborne conditions. EDUCATION

Master of Business Administration (MBA) – Rensselaer Polytechnic Institute, Troy, NY Bachelor of Science, Mechanical Engineering – Rensselaer Polytechnic Institute PATENT

Co-Packaging of ASIC and Silicon Photonics – US Patent #10365436, Awarded 07/30/2019 AWARDS

Rockley Photonics Innovation Award (2019)

BAE Systems Chairman’s Bronze Award for Innovation (2001–2006)

Multiple BAE Systems Team Achievement Awards

TECHNICAL SKILLS

SolidWorks NX Creo PDM ANSYS Workbench IcePack MIL-STD-810 RTCA/DO-160G DFM/DFA

GD&T ASME-Y14.5M-2018 Thermal & Structural Analysis BOM Creation Engineering Change Orders

3D Printing Machining Sheet Metal Electrical Harnessing

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