Process Engineer Wafer Level FOA/RDL Specialist

*

NUR AINA MARIA BT MOHD FAROUK

*-*-** ***** ******, JELUTONG,

***** **********,

PULAU PINANG

PHONE (HP) : 018-*******

E-MAIL : *****************@*****.***

Age: 37 Years

Marital Status: Single

Working is my passion, and I am ready to show full commitment on every given responsibility. I am prepared, mentally and physically to complete a given task. I believe in team work, highly adaptable and tolerable, especially during conflict resolution and negotiation. I emphasis on responsible worker and always maintain great relationship between superiors & colleagues.

• Able to work under pressure, ad-hoc condition and over time work when required.

• Able to work under stressful and fast adapt with new environment.

• Flexible and adaptive to any kind of situations and work for extra hours.

• Punctuality is the main aspect during at workplace.

• Calmly responding to accidents and emergency situations.

• Able to work under minimum supervision.

CAREER OBJECTIVE

PERSONAL STRENGTH

2

PROCESS ENGINEER at TF-AMD (M) SDN BHD

Manage Process engineering in Wafer Level Fan Out Advanced Packaging process specifically in RDL (Re-Distribution Layer) process.

Understand and able to hands on basic operation, alarm triggering, process control, process buy off, defect control, recipe management, tool buy off machine like;

• Photo Resist Stripping Machine (UFO-GPTC300s)

• Etching Machine (UFO-GPTC300s)

• Wafer Clean Machine (UFO-GPTC300s)

• Reflow machine (PSK Semigear 300)

• Oven (Koyo)

Have good knowledge on Sputtering PVD process, Descum, Coating, Exposure, and developing (Yellow light processes).

Understand on all Fan Out process including Die Prep Stage, Reconstitution (Chip to wafer, molding), RDL (Re-distribution Layer; process owner) and Back End process.

Manage to create new recipe for Stripping, Etching, Wafer clean, Reflow and Oven machine for RDL white light chemical processes.

Undergone training on Technology Transfer from TFME (Sutong) for 6months, in China for overall process of fan out wafer level advanced packaging including:

• Overall Fan out & Bumping process

• Design Rule for Fan Out Wafer level advanced packaging

• MES and SPC Data Collection and Machine Data Backup for Stripping, Etching, reflow, Oven machine.

Handle Capex activity for start up plant for Fan out process like purchasing on Production supporting tools according to first line set up.

Able to hands machine and tabulated the data of machine like Nikon Warpage measurement, Resmap, XYZ Ball Shear strength measurement. WORKING EXPERIENCES

3

PROCESS ENGINEER – AT&S (M) SDN BHD

Understand well on IC substrate overall process especially in Lithophotography process

(wet chemical).

Able to run and Hands-on Dry Film Stripping and Flash Etching Schmid tools, and manage to handle on alarm triggering during tool error.

Prepare all for installation material/tools/equipment, like HIBE & Capex; Chemical, filter, test and dummy panel and supporting material before qual DFS and FET machine.

Get direct training and tools and layout is CE from AT&S CHQ and manage to create recipe and Q-time buy off for Dry Film Stripping & Flash Etch process.

Established Work Inspection, Process Control Plan, PFMEA, Setup Parameter, Qualification criteria, TPPCR, WIP layout for DFS and FET process.

Provide all training to BC, Technician, & Line SV, on overall process flow of DFS and FET process.

Ensure all work in manner, no chemical leaking, and all tools must buy off by vendor, equipment and maintenance team on all its ancillaries, pump, filter, temperature and conveyor movement must be all OK before pass down to operation.

Excursion management and follow up. Excursion free ramp for handover of new product from engineering to HVM.

Follow up in the system with Basic findings (BF's). Make sure, they are closed in time and all required corrective actions are done and evaluated.

Process specific machine availability improvement to maximize productivity with minimum schedule and unscheduled down time. Continuous process specific run rate improvement to meet factory KPI.

Manage in Parameter definition for Machines and Processes and prepare for Hook Up, Bring in, and Installation of new equipment (only applicable for Point of Reference tool).

Report line status, work status and incidents, as well as problems and highlights to Superiors in a timely and accurate report.

4

Sr. QUALITY ENGINEER – PAN INTERNATIONAL ELECTRONIC

Plan, Improve and Implement PQC and OQC checking methods for SMT, Backend and Test.

Prepare 3D/5D/8D with 3Legged 5 Why Analysis (Why2 Analysis) report to customer.

Perform Validation process (IQ, & PQ) for SMT machine, Wave soldering and tester (FCT

& ICT)

Responsible for final PCBA’s quality of Manual Soldering & SMT board (as per IPC-610-E, Class 3 and Customer Specs. C0001) and customer complaint.

Lead and responsible of IPQC & FQC inspection procedure and improvement to prevent non-conformance product release from manual soldering & SMT process.

Prepare Continuous Improvement (CI Tracker), OTD Quality report, RMA report, provide Waiver and COC to customer.

Work with production & engineering department to determine the root cause, corrective & preventive action item of customer PCBA regarding their quality issues and productivity improvement (Prepare CI tracker and Weekly perform to customer).

Actively involved in FA (Failure Analysis of new parts of PCBA): PIC on 3 Parties Buy Off on FA parts to avoid escapee in documentation error and defective boards to customer.

Records on any finding during FA built and highlighted within team (ex: Buy Off Build Aid create by engineering against customer’s BOM and ensure COC, ITP (Inspection Test Plan), PCBA revision, Packaging Material and revision is Correct as per customer BOM)

Responsible for RMA return boards from customer and follow up on the rework completion and ensure parts ready after 5D/8D report closure by customer (exception for urgent parts requested by customer). Complete with RCCA to close 8D.

Conduct daily meeting & daily internal line audit with production and engineering on Continuous Improvement project & daily production process.

Assist IQA on incoming rejects issue and feedback to supplier or vendor on the defect found from internal production and customer finding reject which cause by supplier 5

PROCESS & VALIDATION ENGINEER – STRAITS ORTHOPAEDICS (MFG) SDN BHD

Troubleshoot, test and monitor, performances and problems arise during Surface Treatment processes (Electropolishing, Hard Chroming, Titanium Anodizing, Ultrasonic, Passivation, Hydrohone & Heat Treatment) and ensure the parameter runs within Validated Settings.

Understand well on Sheet metal, stainless steel and assembly process like how sheet metal being processed with CNC machine, bending machine, Auto lathe machine, Laser cut, Welding (Gas and Arc) and Mechanical surface finishing; Bead blast, hydrophone & orbital process.

Able to read and understand to verify the critical points and process in the Engineering drawing.

Check for final Quality product of finish goods by checking the dimension with Caliper and gauge (and ask QA side to check with their CMM) whether Surface treatment final products within the specification.

Complete or assist with completion of continuous process improvement projects related to Surface Finishing processes in collaboration with manufacturing, engineering and quality team.

Perform structured assessments of all Surface Treatment processes to identify and evaluate:

• The effectiveness of current controls method.

• The selection of appropriate control measures to minimize risk and optimize Surface treatment processes and measurement capability indices.

• Actively develop, teach, and utilize process improvement methodologies including but not limited to:

• Work Instruction (WI) and SOP (Standard Operation Procedure)

• Problem Solving and Kaizen on Surface Treatment processes.

• 5S and Visual Management

• Process Evaluation/Risk Assessments (PFMEA and Control Plan)

• Process Data Collection/Statistical Analysis (CpK, Minitab) 6

Prepare validation protocols of Installation Qualification (IQ), Operational Qualification

(OQ) and Performance Qualification (PQ).

Actively responsible preparing on:

Validation Master Plan (VMP)

Hands-on; Execution on IQ, OQ, PQ (protocol and report)

Prepare Sample parts for Validation execution starting from early stage until

Final Validation Submission report to Customer for approval.

Study & analyze tact time for each surface treatment processes and operator’s daily jobs and come out with improvement plan and solutions (Lean Mfg).

Validate process result from validation activity with ISO13485, and ASTM medical standard

7

SKILLS

Prepare/Establish Documentation &other abilities:

• Basic PPAP & APQP knowledge (Attend training)

• PFMEA/Control Plan/Risk Assesment

• Non-conformance report (NC)/CAPA/RCCA

• WI, PI, ORP and Excursion Report.

• Inspection check list (ITP)&All Process, FM, MNT, Vendor & QMS checklist

• 5D/8D Problem Solving

• Minitab, Control Chart, Statistical Process Control (SPC)

• Validation Master Plan (VMP) for Medical Process & machine

• IQ (Installation Qualification – Protocol & Report)

• OQ (Operational Qualification – Protocol &Report)

• PQ (Performance Qualification – Protocol & Report)

• Medical ISO Certification: ISO 10993-, ISO 16469, ISO 13485 & ASTM std.

• Scheduled waste Management System (Department of Environmental)

• Hands on machine like; Stripping, Etching, Surface Finishing (Chromate, Electropolishing, Anodizing, Passivation & Ultrasonic), Reflow, Oven, PVD, Wafer level advanced packaging measuring tools.

• Hands on chemical analysis equipment: HPLC, AAS, ICP-OES, Chemical Titration Methods

COMPUTER LITERACY

• Microsoft Office Word, Excel, Power Point, Outlook

• Minitab

• JMP Software

• DWG Software

• Internet Package

• MES System

SKILLS & STRENGHTS

8

DEGREE EDUCATION

DEGREE TITLE : BACHELOR OF SC. (HONS.) IN APPLIED CHEMISTRY NAME OF UNIVERSITY : UNIVERSITI TEKNOLOGI MARA (UITM), SHAH ALAM FIELD OF STUDY : APPLIED CHEMISTRY (INSTRUMENTATION) DIPLOMA EDUCATION

DIPLOMA TITLE : DIPLOMA IN CHEMICAL ENGINEERING

NAME OF UNIVERSITY : UNIVERSITI TEKNOLOGI MARA (UiTM), PENANG FIELD OF STUDY : ENGINEERING (CHEMICAL)

SCHOOL EDUCATION

SPM / PMR : TUNKU KURSHIAH COLLEGE, SEREMBAN

NEGERI SEMBILAN.

UPSR : SEKOLAH KEBANGSAAN JELUTONG, GEORGETOWN,

PENANG.

MR CS Wong

Surface Treatment Manager

STRAITS ORTHOPAEDICS (MFG) SDN BGD

Kawasan Perindustrian Perai 1,

13600, Perai, Penang.

ACADEMIC QUALIFICATIONS

REFERENCES

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