Manufacturing Engineer Project Management
Resume:
Michael Greeson
*** *. **** *. ******, IN *****
765-***-**** ************@***.***
Manufacturing Engineer/ Component Engineer
Lean Implementation Broad Engineering Leadership Continuous Improvement
Results-driven engineer with a notable tenure leading production and engineering operations in dynamic manufacturing environments. Strong leader adept in strategic planning, production planning, capital project management and process improvement to drive production, quality, and cost reduction goals. Innovative technical designer and patented inventor with a history of identifying and resolving critical operational and process issues. Experienced Coach and Center of Expertise for Component Engineering and Quality Engineering competencies. Internationally traveled with a BS in Electrical Engineering Technology and Agronomy. Core Competencies:
Budget/Finance
Corrective Action Planning
Technical Presentations
Die Sort Operations
Technical Training
Change Management
Failure Analysis
CE / AQE / SQE
Global Responsibility
Cost Containment/Reduction
Problem Solving
Equipment Design
Manufacturing Engineer
Statistical Process Control
Customer/Supplier Relations
Purchasing/Procurement
Document Control
Quality Training
Professional Experience
BorgWarner – Kokomo, IN 2023 – 2025
Automotive Connection System Engineer – Deliver connection systems solutions to current issues including products in design and in production. Also working with the Solution Center to develop bids using pre-approved parts. Working with suppliers to find best value parts and create custom connectors. Products include EV inverters and on-board chargers.
Failure Analysis Lead – Creation of test plans and interpretation of analysis results for the various program teams.
New Component Validation – Creation of test fixture and PCB design, test set-up and results analysis.
SCHNEIDER ELECTRIC – Rockford, IL 2008 – 2023
Global presence in building automation.
Nov. 2021 update:
R&D Team Lead for product development - Responsibilities include team creation, prototype planning, part creation and documentation to PDM, team coordination and direction through regular meetings and impromptu communications.
-Today’s project management tool is Microsoft TEAMS.
Component Risk Supplier Management Lead - Coordinating purchasing, engineering, quality and manufacturing to create a risk dashboard and address each component of a BOM
Eco-Referent – Responsibility includes verifying each part and BOM to REACh and RoHS requirements and identifying Substances of Very High Concern that exceed the market limit.
North American training resource for the Component Supplier Management portion of PDM and Eco-Referent role.
Continuous Engineer – This is a support role for our released products. I am the R&D contact for any factory, Schneider Electric or contract, for any production issue. If I can’t resolve the problem swiftly, then I open a project and garner the necessary resources. Our factories are in EU, China and NA. As CE I accommodate meetings at all hours and travel as required.
North American Engineering Leader for Buildings division
Lead regional CEs in EU, NA and AP. Oversee all component issues including EOL. Coordinate TAC global transition to Schneider Electric Component Data base. Developed reporting structure for NA R&D and am BU deployment leader for project Risk Management. Business Unit Leader of Electronic Component Selection and Qualification.
Program management of redesigns for cost improvements and end-of-life component driven changes. PEP and PMP change process used with Stage Gate milestones. Start up production planning for new designs.
Trainer of corporate practices / processes to Business Units on site and remotely.
Business Unit Deployment Leader of Standardization effort, effectively reducing supplier count and part proliferation while still meeting design requirements.
Environmental Compliance Engineer
Evaluate compliance of new products to REACh and RoHS each annex. Prepare End-of-Life and Product Environmental Profile documents.
DELPHI Kokomo, IN 1984-2008
Multinational world leader in mobile electronics and transportation components and systems technology.
Center of Expertise, Electronics and Safety (2004 – 2008)
Connection System Technical Lead for Entertainment & Communications, Body Security, HVAC and Clusters Business Units. The role involves managing purchasing, Component Engineering, Quality Engineering, Manufacturing Engineering and supplier base for the needs of a product development. Support mechanical, physical and electrical aspects of connection system, including Failure Analysis.
Saved $1.9M over three years utilizing proper technology and sourcing
Will realize $1.5M savings per year with implementation of whisker resistant tin plated FFC (replacing gold plate)
Mentor all new Connection System Component Engineers
Maintain Delphi Design Standards for Connection Systems Best Practices
Green Belt Training
Component Engineer, Electronics and Safety (2001 - 2004)
Prepare Delphi Corporate Drawings, Prepare Qualification Plans, Disposition PPAP, Manage Supplier Base, and audit supplier lab sites for all business units of E&S.
Creation and management of Commodity Team
Creation of Preferred Supplier Base
Manage Supplier Change, including lead free qualification plans
Understanding of GD&T, FMEA, Root Cause Analysis, Design for Six Sigma
Dicing Process Engineer, Delphi Corp/IC Delco (1998-2001)
Specified, purchased and qualified new wafer dicing equipment. Provided support to manufacturing operations and area maintenance for shipment of 134+ part numbers to 14 customer sites in a union environment. Developed dicing applications, implemented new processes and procedures and coordinated continuous improvement on production processes. Training unionized production operators on the use of production equipment. Created training documentation and implemented an operator certification program on the wafer dicing equipment.
Assisted in development of industry’s first production auto mounting equipment with a start up vendor in Hong Kong.
Assisted in the development and patent of a new wafer dicing additive. Implemented new wafer dicing equipment from Disco Corporation in Japan. Set-up production sawing processes on new type of manufacturing equipment.
Performed technical writing of work specification for new processes and equipment.
Eliminated $480,000 annually in labor costs and $225,000 in scrap by implementing industry’s first automatic wafer mounting system and patenting a new wafer dicing additive.
Reduced critical labor costs related to semiconductor manufacturing by enabling competition with low-cost overseas sites by researching and purchasing automatic equipment
Implementation of Lean Principles, Kaizen activities
Use of FMEA, 5Y and other root cause analysis techniques
Generation of 8D reports
Implementation of Quality Management System For ISO/TS
Visual Process Engineer, Delphi Automotive/IC Delco (1998-2001)
Specified, purchased and qualified new automated vision inspection equipment. Provided process and equipment support to improve visual yield and drive continuous improvement. Implemented automated inspection equipment for defect detection. Developed and presented new processes and equipment designs. Instituted quality standards backed by statistical process control. Interacted with operations, engineering and equipment vendors. Documented new processes and procedures. Wrote QS9000 documentation and trained operators.
Saved $500,000 annually in operator costs and by converting from manual to automated inspection process.
Improved visual losses 10% by implementing automated visual equipment and instituting new quality standards.
Die Sort / Tape and Reel Process Engineer, General Motors/Delco Electronics (1989-1998)
Specified, purchased and qualified new Die Sorting pick and place equipment. Provided manufacturing support to back-end die sort operations for semiconductor business. Provided technical support for all three production shifts. Supervised area technicians and trained new operators. Developed and implemented new lean manufacturing processes. Designed and patented new sorting equipment and improved existing equipment. Tracked and monitored production output and quality. Resolved and reported quality issues. Maintained documentation, organized records and created performance reports and presented daily metrics in production meetings.
Saved $2.1+ million over a two-year period by designing and patenting new carrier tape design and vacuum expansion at sort to eliminate multiple critical customer issues.
Increased throughput 40% by implementing electronic wafer mapping; developed and patented new expansion rings and carrier tapes to decrease process cycle time.
Significantly reduced labeling spills to customer sites by designing custom software to error proof sort, implementing lean cells at all sort processes and instituting a factory automation system.
Implemented automated equipment output inspection to meet critical customer requirements for components.
Resolved critical issues by utilizing a structured PFMEA approach to processes, designing new tooling and teaming with operators to identify undetected problems effecting quality and operational effectiveness.
Reduced critical labor costs related to semiconductor manufacturing by implementing automatic product handling and in-line vision inspection.
Die Bond / Wire Bond, General Motors/Delco Electronics (1984-1989)
Provided Manufacturing support to back-end semiconductor process, both epoxy and eutectic die bond, die bond to lead frame and ceramic substrate and flip chip, gold ball bonding and aluminum wedge bonding. Also supported oven bake process. Lead QC trainer, created and implemented Workmanship Standards.
Creation and implementation of die bond and wire bond process specifications
Monitoring of power transmission and implementation of Power Conditioners to eliminate pattern recognition errors.
Meter Department of Kokomo Water Company (1982 – 1984)
USDA Plymouth, IN 1982
Designed erosion control structures, Presented new cropping methods to farmers, surveying, Coordination of Field Days that brought together chemical and machinery manufacturers, media, and farmers. Hydroponic greenhouse experience on family farm.
** ** **
Education and Professional Development
BS in Electrical Engineering Technology Purdue University – West Lafayette, IN (1992)
BS in Agronomy Purdue University – West Lafayette, IN (1982)
Patent Awards 5,343,363 and 6,472,728
Technical Proficiencies: Microsoft Office, PDM systems
Reference List
Jason Shonk (Home Depot)
Jason *****@*****.***
Travis Wells (Molex)
******.*****@*****.***
Curtis Balka (former manager at Schneider Electric)
*******@*****.***
Todd Wyant (Texas Instruments)
*-*****@**.***
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