Technical Program Director

RAVI KUMAR CHAMALA

San Jose, CA 408-***-**** ****************@*****.*** linkedin.com/in/chamalaravikumar U.S Citizen SENIOR TECHNICAL PROGRAM/PRODUCT MANAGER

Strategic and execution-driven technical leader with deep expertise in technical program management, roadmap definition, and strategy development. Successfully led end-to-end hardware-software integration, milestones execution, optimizing systems, and launching complex programs at a global scale. Demonstrated track record leading PC and mobile platform initiatives—from architecture and pre-silicon prototyping through system integration, validation, and mass production. Proven ability to unite cross-functional teams to drive innovation and efficiency, delivering market-leading products in collaboration with top OEMs and ODMs. Eager to leverage expertise to enhance project execution and deliver impactful results. CORE COMPETENCIES

Technical Platforms & Domains

• AI/ML Platforms: Windows Copilot+ integration NPU optimizations for GPT/LLM workloads Windows OS feature enhancements OpenVINO

• SoC Architecture: Intel Core Ultra Series (Lunar/Meteor Lake) silicon & platform validation power-performance optimizations

• Connectivity: WWAN-Cellular modem systems (LTE/4G/5G) Wi-Fi/BT 3GPP, GCF, PTCRB certification Global carrier alignment

• Development Tools: JIRA Power BI Microsoft Project (MPP) GitHub Azure DevOps (Repos, Pipelines)

• Programming Languages: Python C/C++ (Debugging FW optimizations, BIOS/UEFI integrations) PowerShell Program Leadership

• Full lifecycle product development (NPI) Agile, Waterfall, Hybrid Advanced prototyping Cost-optimized component selection (BOM) HW/SW Milestones driven SLA execution

• Exec-level escalations Cross-functional team leadership (50+ engineers) Global OEM/ODM engagement

• Customer co-engineering Risk mitigation Roadmap planning Expert in driving Tiger teams/Co-location camps Operational Excellence

• Factory bring-up (customer map-days/boot camps) Validation/debug tools Global product launches (10M+ devices) CES, MWC Readiness

PROFESSIONAL EXPERIENCE

Intel Corporation, Santa Clara - California ~16 Years Principal Technical Program Manager, April 2018 – Present Spearheaded 7 Intel SoC generations (Lunar, Meteor, Raptor, Alder, and Tiger Lake) for Microsoft Surface AI PCs, leading 50+ cross-functional engineers to enable $3.5B+ Intel revenue (12.4M units). Cemented 62% AI PC market dominance and contributed to $28B market cap growth through AI-hardware leadership. AI & Strategic Leadership

• Launched Industry-First AI PCs: Spearheaded technical co-engineering with Microsoft to launch the first Copilot+ AI PCs (Surface Pro & Laptop) powered by Intel Core Ultra Series 2 (Lunar Lake). Achieved 90+ minutes of real-world battery gains, establishing Microsoft’s leadership in next-gen AI computing.

• Defined AI-Hardware Roadmap: Collaborated with customers to shape SoC intercept strategies, close feature gaps, and direct NPU optimizations for GPT model workloads. Enabled on-device generative AI experiences through OpenVINO integration and Windows Copilot+ enablement across Lunar and Meteor Lake.

• Scaled AI Innovations: Currently leading Panther Lake SoC enablement for 2026 Surface AI PCs, advancing neural processing, cloud-edge offload, and next-gen AI workloads. Technical Program Execution

• Full Lifecycle & NPI Leadership: Drove architecture-to-production for 7 SoC generations, feature scoping, BOM customization resulting in BOM cost savings, pre-silicon emulation, and PoC bring-ups enabling cutting-edge innovations (OLED/LPDDR5x/Wi-Fi7/ WWAN-5G) and Lakefield-based Surface Neo (dual-screen foldable).

• Performance Breakthroughs: Delivered power/performance optimizations across thermal frameworks, BIOS/UEFI and FW optimizations, achieving 90+ minutes of battery gains under real usage models (e.g., Teams 3x3, Procyon workloads).

• Risk Mitigation & Recovery: Acted as a single point of technical escalation, resolving critical factory line-downs in <48 hours, improving issue closure by 75% via tiger teams and executive alignment. Customer & Ecosystem Innovation

• Strategic Partnerships: Co-engineered 5+ generation-defining Surface devices (Laptop Studio 2, Surface Go/Pro), managing joint map-days, factory bring-ups, and boot camps.

• OEM Acceleration: Led cross-functional tiger teams to customize Windows Copilot+ AI features, thermal solutions, and BIOS/UEFI integrations, reducing time-to-market by 30% for Microsoft launches. Technical Program Director, February 2016 – March 2018 Spearheaded Intel’s flagship SDS reference platforms for Core processors, establishing industry benchmarks in power efficiency and premium PC technologies while accelerating partner adoption. Strategic Platform Leadership

• Defined & Launched Next-Gen SDS Solutions: Architected hardware/software stack and roadmap for Intel Core- based reference designs, delivering PoC systems aligned with OEM/ODM/ISV strategies.

• Drove Industry-Wide Standards: Directed development of SDS platforms for Ice Lake/Tiger Lake, achieving $50+ BOM savings per unit and Co-defined Intel EVO industry standards adopted by over 78 OEMs on new technologies introduction, System battery life and performance gains. Ecosystem Acceleration

• Championed Intel Innovation: Showcased emerging SoC tech at CES/MWC (2017–2019) through keynote demos and press briefings, influencing OEM roadmaps and accelerating adoption of Intel innovations.

• Integrated Breakthrough Research: Translated upstream R&D into trade show demos and enablement campaigns, shortening partner time-to-market by >25% for next-gen features. Operational Excellence

• Owned End-to-End System Readiness: Led cross-functional teams to deliver volume production readiness – from silicon validation to thermal/performance tuning.

Engineering Program Manager, September 2011 – January 2016 Drove global commercialization of Intel’s 4G/5G modem platforms (XMM 7160-7360), delivering industry-first innovations for Apple/Microsoft while optimizing power/throughput by 30% and identified several customizations to improve overall call performance (both signaling and data) at low coverage areas. Technical Breakthroughs

• Launched Intel’s first chip-down LTE modem (XMM7260) for Microsoft Surface 3 LTE (Windows MBIM), achieving >30% power efficiency and >20% throughput gains via PCIe IPC stabilization.

• Architected end-to-end eSIM deployment with feature enhancements (In-device Co-Ex/GNSS/DPTF), ensuring USB 3.0/PCIe compliance and Windows 10 MBIM stack alignment (RS1-RS3). Ecosystem & Scale Leadership

• Commercialized 3G+/4G-LTE/5G modem platforms (XMM7360/7260/7160) for smartphones/PCs across AT&T/Verizon/EMEA/APAC carriers.

• Partnered with Apple (iPhone/iPad), Samsung, LG, Panasonic & Microsoft to enable connectivity for millions of devices.

Cross-Functional Impact

• Led North America CTS as primary technical interface for UE vendors, driving call performance optimizations with Ericsson/ALU/Huawei during certification.

Previous Experience: Infineon, Germany Philips (NXP), UbiNetics (CSR), Sasken – India 8 Years Drove 3G/UMTS protocol stack innovation across 4 industry leaders, developing mission-critical cellular software at both UE (Cellular user equipment), Network infrastructure and test systems adopted by Huawei (3G RNC) and Sony Ericsson

(Cellular user equipment) and other global telecom partners. Protocol Stack & Platform Leadership

• Architected 3G Dual-Mode AS Software: Developed protocol stack and test simulation platforms for UMTS access stratum, enabling conformance with 3GPP standards.

• Pioneered Test Infrastructure: Built Node-B network simulators for AS protocol validation and GTP-C core network software (SGSN-GGSN), accelerating certification cycles.

• Resolved High-Impact Defects: Led maintenance/bug-fixing for core 3G software through FT log analysis and test environment optimization.

Cross-Functional Innovation

• Co-developed test environments for 3G AS protocol validation, enabling faster European market entry.

• Enabled Third-Party Integration: Ported/developed adaptation layers for interoperability with partner software stacks.

• Authored Conformance Test Cases: Scripted tests based on 3GPP specifications to validate RNC interface compliance.

EDUCATION

• Bachelor of Engineering (B.E) Electronics & Communication Engineering University of Madras, India.

• Diploma in Engineering (D.E.C.E) Electronics & Communication Engineering SBTET, India.

Contact this candidate