Electrical Engineer Software Development

James Hudson

**** ****** **, *******, **. *****

945-***-**** (m)

*****.********@*****.***

PROFILE

Over 15 years of experience in root cause analysis of system failures, PCBs, process engineering, and mixed-signal integrated circuits.

Leveraging data from diverse test sources and collaborating with Applications and Design Engineers to develop and implement bench test setups, including replicating customer setups, to conduct comprehensive root cause analysis.

Proficient in utilizing design tools (Cadence, SolidWorks, Mathcad, etc.) to perform nodal analysis for failure isolation and conduct layer-by-layer deprocess of PCBs and devices to document anomalies.

Experience with analysis tools such as SEM, Probe-Station, parametric analyzer, Oscilloscope, XRF, FTIR, IC, DMA, mechanical polishing/grinding, OBIRCH/Emission Microscopy, TDR, CT 3D X-ray and acid chemical and laser decapsulation of ICs.

EXPERIENCE

Omnion Power, Plano, TX 2018 – present

R/D Engineer failure analysis and reliability

Provide comprehensive root cause analysis support for component failures, spanning all stages of the product lifecycle, including design, customer returns, sustaining engineering, and supplier-related issues. This involves collaborating with cross-functional teams to identify, analyze, and resolve component-related problems.

Leverage the Plano analysis laboratory to conduct in-depth component analysis, providing detailed reports and actionable feedback to engineering and management teams to inform data-driven business decisions regarding corrective actions and future product development.

Develop and implement standardized component testing procedures, strategically utilizing both internal laboratory resources and external specialized laboratories when necessary to ensure comprehensive and reliable testing.

The capabilities of the Plano analysis lab significantly expanded to include advanced techniques such as acid/laser decapitation, integrated circuit voltage/current analysis, PCB/Product IR thermography, 3D X-ray scanning, and microcontroller-based failure testing and control. This expansion enhances the lab's ability to address a wider range of failure mechanisms.

Designed and implemented an in-house curve trace application for precise characterization of component leakage currents and diode breakdown/turn-on regions, providing critical data for component evaluation.

Developed and implemented an in-house fan testing program to rigorously verify supplier fan performance against published datasheets, ensuring component reliability and thermal management effectiveness.

Played a key role in a multi-part technical study that resulted in a corrected manufacturing process and a subsequent record low component failure rate. This contribution included the design and fabrication of a specialized benchtop test setup enabling repeatable testing of samples at varying current levels, directly correlating to observed heat generation in heatsinks and field-effect transistors (FETs).

Proficient in the use of a wide range of analytical tools and equipment, including probe stations, oscilloscopes, test fixtures, function generators, and various software interfaces for the comprehensive evaluation of component failures.

Provide support for component test development, utilizing laboratory equipment such as environmental chambers (ovens), electrical test equipment, tensile testers, 3D printers, 3D X-ray systems, Python scripting, and the Keithley test environment.

Maintain laboratory equipment and tools for other lab engineers, including the development of new tools and techniques to enhance the performance and efficiency of failure analysis processes. This also includes establishing and maintaining robust backup systems for critical tools such as the reflow oven, X-ray system, scanning electron microscope (SEM), and associated computer systems.

Design and implement benchtop evaluation setups to replicate and isolate component failures, facilitating accurate root cause documentation and analysis.

Developed and implemented an automated tool utilization tracking system that captures data from lab tools and displays real-time usage statistics on an internal web page, optimizing resource allocation and lab efficiency.

Provide comprehensive software and hardware support for lab tools and equipment, resolving technical issues and ensuring the smooth operation of the lab environment

Texas Instruments, Dallas, TX 2009 – 2018

Failure Analysis Engineer

Provide root cause analysis for analog/mixed-signal device failure for customer return/reliability devices

oThis involves circuit analysis using Cadence for schematics and layouts along with simulations

Use the Dallas Failure Analysis (DDAO) lab for deprocessing of devices for isolation, and documentation of the failures/design changes needed

Used PSpice, ModelSim, Mat LAB, NI LabVIEW, EAGLE cad, Scilab, NetBeans and other programs to create solutions to any issues for the lab

Use several tools including but not limited to probe stations, oscilloscopes, test fixtures, focused Ion beam, function generators, PEM/OBIRCH isolation and various software interfaces to communicate with devices in evaluation/emulation boards

Use GUI/command line interfaces to communicate with TI devices and evaluation boards to replicate the customer failing condition for root cause failure analysis

Maintain lab equipment and tools for other lab engineers

oDevelop additional lab tools and techniques to improve performance and efficiency of failure analysis

Create EVAL setups to recreate the failure to document root cause for design change

oThese procedures can include creating circuits on bread boards/PCBs to excite the failure internally (inside of the device) for micro probing or isolation

Created and currently maintain the socket/evaluation board information system for the global device analysis organization (DAS) stored on a Windows server that was set up and custom configured for this purpose

oThis includes modifying code for bug fixes and any improvements to the system

Providing software/hardware support for DAS for issues that come up from the tools that any of the engineers use

Researched and deployed the 3D printing initiative in TI Quality utilizing open-source hardware and software

Created an automated ventilation system for the fume extraction system for the 3D printer

Work with micro-controller-based hardware to create new systems and tools for custom solutions

Use Solid works and AutoCAD to design and then 3D print socket/evaluation/emulation solutions for failure analysis and applications and design engineering

Work with product teams on best practices for socket/evaluation/emulation solutions for failure analysis and when needed use Altium to create custom circuit boards for bench solutions

Created and maintained the DAS and the Quality Lab Services websites on a custom windows 8 server installation that utilizes Apache web service, PHP, Python, PERL, JavaScript

oThis server has many functions for LABs and hosts the Audit data for all DAS labs

Created custom software/hardware for the replication of fail modes for failing devices submitted for failure analysis. Then used custom solutions for root cause analysis

Trained several NCG and New experienced hires in the process of root cause analysis and 3D printing design

Was the recipient of the DAS Quality Improvement Award and the DAS symposium Best new failure analysis Technique Award for using the 3D printer to cut outside TI fabrication costs by more than $250K

Deployed 3D printer in the Tucson failure analysis and reliability lab for the use of custom 3D printed failure analysis solutions

Use standard tools such as GitHub for version control and bug tracking of projects.

This involved setup, upgrade of software and hardware, instruction on use and 3D model creation training in AutoCAD and SolidWorks

Expert in hardware and software including microcontrollers, servers, Linux, Windows, MySQL, C++, Java, JavaScript, Pascal, Raspberry pi, Arduino, SolidWorks, Hardware/software Design, AutoCAD, Embedded systems used in test applications, customer designs, and personal projects

Radisys Corp., Hillsboro, OR 06/08 – 08/08

Service Tech (Summer)

Proved board level failure rework, including flashing firmware and replacing components for customer hardware

Used test fixtures to determine the failing device and replace using a rework station

Performed board level analysis to determine the root cause of the failure and re-tested after failure swap of failing devices

EDUCATION

BSEE, Prairie View A&M, Prairie View, TX, 2009

oFocused on electronics

oSenior Design project was to design a bi-directional buffer in Cadence with extraction and simulation

oProjects of note: Switch mode power supply, regulated power supply, Xilinx FPGA programming, and MatLab simulation

Contact this candidate