Process Technician Engineering

ROSALINA L. MANERA

**** ******** *** ******** ** 95035

**********@*****.***

CELL 408-***-**** HOME 408-***-****

Summary : Dedicated manufacturing Process Technician and Research & Development Technician in Semiconductor and Battery Industry, with over 20years of experience leading and driving results in a fast faced manufacturing environment with exceptional skills in organizing tasks efficiently, manage time, quickly undertake new tasks, learn effectively, and have the ability to easily collaborate. Determined and pro active by supporting company leaders. History of thriving in a fast-paced, dynamic environment, strong interpersonal and organizational skills and experience working with team members and overcome technical challenges

July 2018-Dec 2024 QUANTUMSCAPE CORP

Engineering Technician 4

Work closely with the Engineers in development of battery prototypes

Press Machine – making component part by pressing powder press for setter

Lapper - (polish machine) Polish, mix the correct amount of ratio for polish spray

Helped PA Team – running Analytical tools ICP,XRD and help submit request for PA testing.

Trained in glovebox

VR – measures thickness of the setter after press

Single to Double to Triple stacking films into setter

RHK1 & RHK 2 – annealing films and setters

Film Processes – after sintering – scrapping, LPXL, LC, Tierring, stacking

TTF –furnace to bake setters

KILN – sintering tool

Cathode – punching films, measures thickness, offset, IMA800, DFI, Edge Burr, Trimming, AOTG (automation thickness gauge

Trained in Cell Assembly Process – Start to finish. Prepping sub-assy prior to cell built, using metrology to detect defect from films, experience in building 11mm pouch cell,

Trained in building 18650, wound cell, custom size pouch cell battery also multilayer stack pouch cell

30x30 pouch cell and A size pouch cells, follow SOP and instructions on Radis prior to cell build. Run jump script to doubt check accuracy of finished build.

Fixture and DE fixture cells, Helped Test Team for loading and unloading cells

FIO – Film Improvement Optimization

HIRANO (comma coater): automated casting using slurry casting roll films on foil, Doctor Blade,

KEKO – manual and small casting machine for Eng’r experiment use, Draw Down casting

Roll – Roll

MIE – electrical testing

EVAP –film PECVD deposition

Binder mixing, Flaktec (slurry mixer)

DAGE –scan void and from foil of a films

GVAC – short process

Metrology Certified: VR, SCANNER, VCB, DFI, VK, VHX, SEM(CD) Hitachi, Zeiss, roughness measurement, viscosity, filtration - Knowledge in Excel and Word, PowerPoint

May 2016- June 2018 SUNPOWER CORP

R&D Tech

Work with Engr's, process wafer for Solar with the process instructions of the Engr's.

Etch, MRL, SierraTherm, Print (Shmids), PECVD, CVD, Trion and all metrology, wafer probe

Certified and familiar on chemical handling

FIB/TEM/SEM, cleaving, coating, mounting and demounting

Nov 02,2015- March 2016 ALTA DEVICES

Manufacturing Tech

PECVD, PVD, Front and Backend Processes

Wafer Metrology, wafer probe, measure wafer after process, solar Cells Metrology using Ellipsometer

Jan 14,2015- Oct 2016 I INFINERA

Wet Tech

Pour Acid, and mix acids/chemicals Process Apt 1 and 2 etching wafers

Clean and strip wafers using chemicals such as HF, H2O2, HCL, HBR, H2SO4 etc. and some wafer metrology.

March 2014-Sept 2,2014 JDSU.

Manufacturing Tech (Photo)

•Certified in Photo Process - Coating, Photo Masking, Develop Inspect, Aligning,

Posbake,, SEM Measurement( Nikon), Gamma-Develop.

•Certified in Wet Etch using HF, Ti,Ni, Cu, Ga, Si, Cl, W, H2SO4

•Also, cross trained in Die Fab Process

June 2013-Jan 2014. ENOVIX

Manufacturing Tech

Plating, Etching Cu, Cathode, Nickel, Ion Lithium •. Mixing solutions/Chemicals

Inspection, measuring thickness, Coating • Resist Apply, Expose Develop

Oct 2008-July 25 2012 FUJIFILM DIMATIX

Process Tech 3

Manage in manufacturing micro electromechanical processes of piezoelectricity actuated inkjet print head products. Responsibility includes wafer processing in photo, bonding, sputtering and thermal furnaces in clean room environment. Performed various tasks within manufacturing include carrying out instruction for lot disposition, inspection, metrology measurement and quality of the product. Creative capacity to develop new ways to do things better, cheaper, products development. Strong ability to work and communicate effectively within a team

and person manufacturing and engineering organization

Electromechanical Assembly, wafer probe, know to read Blueprints, work and Inspect

product development. Strong ability to work and communicate effectively within a team and person manufacturing and engineering organization

Electromechanical Assembly, knowledge in Blueprint

Use of Auto and Manual tools Certified in Bonding process include Raw Coupon, and production (Silicon)

Wafers, Triple Stack Bond, Flip, and cleaning wafers, work in the High Powered

Microscope, inspect wafer and measure alignment using Karl Seuss Align

•FIB/TEM/SEM, cleaving, coating, mounting and demounting

Certified in running tools like: Gamma, Filmetrics, Metroline(asher), TelTrack for coating wafers, Karl Seuss Aligner, Wyk Tamar

Certified in Sputter using Oerlikon – NiCr, Au, TiW Metal

Certified in Wet Etch: NiCr Strip, NiCr Spray, Strip Gold (Au Etch)

EPI Deposition – Gemini, AMAT, LPE, 7600, 7800, 7820, 7700.

Calibrate and Measure Equipment

Trained in Diffusion using VDF – process Anneal, Oxide Screen Ox

Collect and gather data using MES, Computer literate

Nov 2006-Apr2008 DIELECTRIC SOLUTION INC.

SR. Process Technician

Certified in Moat Etch, Strasbough Grinder, worked and inspect wafers and small parts using high powered Microscope. Wafer Probe

Certified in Operating Reactor for EPI Deposition and Growing Poly, Mechanical Inspection and Final Inspection. Read and understand Manufacturing Drawing,

Cross Trained to Plating.

Engineering Assistant, Assist in Research and Development

Certified in all Wafer Metrology.

Collect and gather Data, Computer Literate using MS

May 2005-Nov 2006 VISHAY CORPORATION

Fab Technician Specialists

Coating, Photo Masking, Develop Inspect, Aligning, DUV, Posbake

Masking Etch using Chemicals, Exposed in some Chemicals for Etch . Wafer Metrology Equipments: Ellipsometer(Alloy), Nano,CDE, FSI, Thermawave, Surfscan, ADE, Inspex (for particles use)

FIB/TEM/SEM, cleaving, coating, mounting and demounting

Certified in Wet and Dry Etch: HF, Nitride, Contacts, Pad, Via and Metals. Dry Etch: Gasonic, AMAT, PEP, FSN, Plasma Alliance.

Collect and Process data using Promis.

Jan 2002-Oct 2006 ANALOG DEVICES

Fab Specialists

Etch, Via Nitride Etch, Aqua Regia(Platinum Etch), EKC Etch, Descum and Final Inspection to High Powered Microscope.

Certified in Dry Etching: AMAT, Fussion, Gasonic, PEP, FSN, Plasma Alliance,

Certified to run EPI Reactors such as Gemini and LPE.

EPI – Gemini, AMAT, 7600, 7700, 7800, 7820 machines

Certified in Photo Masking: Coating Aligning, Develop Inspect, KLA, CD Sem, DUV Posbake.

Collect and Gather Data using Promis.

July 1998-Dec 2000 ROHM DEVICES

Fab Operator

Certified in Photo Masking: Develop Inspect, DUV, Posbake and Align · Certified in Coating using Solitec and Strasbaugh for Back and Final Polish, Wafer Measurements to measure Particles and Thickness of Wafers, ADE Cross trained in assembly inspection small part and finish product.

Certified in General Diffusion. Also, Trained in Test Area.

Nov 1997-May 1998 NOEL TECHNOLOGY

Fab Operator

•Clean and Etch All Wafers using HF1:1, Sulfuric for Cleaning Resist of the Wafers, Ultra Clean, Slopes, BOE, Oxide Etch, Resist. Measure wafer before and after Etch – Gold Etch

•Moat Etch, Platimum Etch TiWn * General Diffusion, EPI, Thin Film and Final Inspection.

Sept 1996-Nov 1997 KULICKE AND SOFFA

Fab Operator

Job Includes Photoresists Application, mask align, Develop Inspect, Final Wet Etch, Sulfuric and resist strip clean, Certified in Diffusion Operations as well as profiling tubes/Furnaces.

Certified in all wafer measurements Equipment's. wafer probe

Certified in AMAT, Metal Etch, Gasonic, Asher, FSN, PEP, FSI, Poly Nitride, Inspection

Final Inspection, Develop Inspect, Collect/gather data using Promis

May 1993-Feb 1994 KOMAG CORP.

Lube Machine Operator

Lube machine Disk Processor, Coating, Plating and Sputter, also operate Clean Wipe Machine, in process and final Inspector certified

SKILLS AND ABILITIES:

Work in a Clean room and Dry Room environment for over 20years, work well independently and reliably, organized, capable of handling responsibilities in confident manner as part of the team. Able to assess and priority work related tasks. Strong organizational skills, including the ability to multitask and prioritized my workload detailed and I'm driven to achieved results.

Work collaboratively with other Technicians, Research Associate and Engineers

Familiar with manufacturing Process Instruction and MSDS, SDS

Trained ERT Member

Computer literate Excel and MS, Outlook, Word, PowerPoint, Zoom, QuickBase

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