Process Engineer Front End
Resume:
Resume:
Stewart Fong
Torrance, CA 90505
***********@*****.***
GOAL
To utilize analytical and processing skills in a company for the fabrication of semiconductor devices, production of microelectronics modules and printed wiring board assembly. To produce and analyze advanced optical devices for space and naval systems. To fabricate and assemble systems for navigation guidance and control.
EXPERIENCE
Integra Technologies 2013- present
Senior Research Process Engineer
Responsible for process development in fabricating GaN and LDMOS devices for radar, communication, air traffic control and other markets. Process developments include low compressive stress silicon nitride, plating Au and Au/Sn for die mount chips and laser, Sonoscan bond integrity, e beam and sputter deposition,ultralow Ohm-mm2 Ohmic metal with RTA, low leakage, anneal methodologies and all other aspects of front end and back end work.
Volunteer tutor for students at El Camino College, Harbor College, Torrance high schools, San Pedro high schools on Algebra II, Calculus, Advanced Calculus, AP Physics 2011-2013
Northrop Grumman Navigation Systems Division August 2008 –December 2010
Senior Optical Engineer
Produce advanced multipurpose integrated optics chip for fiber optic gyroscope integration. Conduct process improvement and diagnostics for optical chip production. Conduct analysis of vendor process for producing IOCs. Troubleshoot vendor failure process mechanisms, initiate and develop improved process for marked yield improvement. Conduct process audit for space level microelectronic chip and assembly for process inadequacies and introduce improved process.
Expertise in principle of Inertial Navigation System, hardware fabrication and integration including all aspects of fiber splicing in optical stream with SLD, laser, photodetector, Integrated Optics Chip for Fiber Optics Gyroscope (FOG). Familiar with Ring Laser Gyroscope, Hemispherical Resonator Gyroscope principle and MEMs type gyro accelerometer devices and fabrication.
Familiar with Global Position Systems(GPS) navigation, guidance and control principles and device fabrication.
Familiar with flexPDE and Physical Optics Propagation in Zemax software and proficient in Beam Propagation (Beam Prop) software for complex optical systems analysis.
Thoroughly proficient in advanced electrodynamics in analytical analysis. Proficient in probability and statistics, stochastic processes in physics and chemistry, Markov chains, renewal theory, maximum likelihood analysis and calculation of FIT for failure analysis.
Boeing Satellite Systems May 2007- July 2008
Component engineering expert in analysis of integrity of processing and fabrication for space level integrated circuits for MMICs, FETs, transistors and diodes for use in satellites. Analysis includes construction analysis, destructive physical analysis, SEM, STEM, x-ray, acousto microscopy ( Sonoscan) analysis for substrate cracking on devices without opening lid. Analysed steps include passivation( silicon nitride, silicon dioxide) metallization( Ti/Pt/Au, Ti*W/Au, plating, cleaning steps necessary for good adhesion and other fabrication steps to ensure mission life of parts. Provide expertise to problem resolution board on failed devices to determine course of action and revision of processing steps for improved products. Discovery of failure source from review of processing steps to identify “deadly sin” steps and re-invent improved processing step for vendors for providing improved parts.Resolve and eliminate chemical mutually deleterious steps in processing for viable products.
ICR Co Mar – May 2007
Senior process engineer, resident incoming director of foundry start up for microelectronics fabrication, technology analyst for future products for radiology. Adoption of high energy physics principles on particle detection for health related scanning methodologies.
HRL Laboratories (formerly Hughes Research Laboratories) Nov. 1998-Nov. 2006
Member of Technical Staff
Expertise in Si MEMs processing.
Fabrication and processing of linearized optical modulators and Y-fed directional coupler in Lithium Niobate (LiNbO3) involving Ti diffusion waveguide definition, velocity matched SiO2 ultra low stress deposition PECVD and sputtering, ion milling, membrane metal deposition, electrode plating, optical polish cutting, RF testing in thru and cross modulation, two tone and linearity measurements.
Fabricated Optical Analog Pulse Position Modulator with Distributed Feedback Reflector in Lithium Niobate (first such working device).
Optical waveguide fabrication in InP by RIE and wet etch, ultra low stress Si3N4 PECVD methodologies applicable to III-V semiconductor processing, InP, GaAs, GaN.
Si waveguide deposition and delineation, simultaneous fabrication of corner reflectors in Si waveguides, expertise in waveguide fabrication and RIE techniques in SOI substrates.
Dicing and sawing expertise for MMIC processing including GaAs, GaN and SiC, sawing polish techniques and expertise for optical waveguide signal launching and optical packaging.
Projection operator techniques, complete and orthogonal mathematical mapping techniques for process optimization methodology generation. SPC techniques leading to consistent 97.5 to 100% high yield in every step front end and back end processes.
Hughes Microelectronics Nov. 1994-Nov. 1998
Gallium Arsenide Operations
Staff Engineer
Direct responsibility and expertise in all aspects of front end and back end processes for MMIC fabrication and production, including ultra low stress nitride passivation and capacitor element deposition, BCl3 via etch, back metal sputtering, 100% clean TaN resistor liftoff process by sputtering, via Ti sputtering processes, SiO2 ultralow stress passivation and etching processes for MR sensor fabrication, RIE etch processes, PECVD processes involving both SiH4 in nitrogen and He processes for tailor made stress management processes, utilization of FTIR and Auger analysis techniques leading to100% yield bridge plating processes using both cyanide and sulfide plating chemistries, bump plating for flip chip processes, sawing and dicing expertise, SPC methodologies and other mathematically sound optimization techniques for process improvement.
Hughes Aircraft Company Mar. 1979-Nov. 1994
Electro-Optical and Data System Group
Space and Communication Group
Radar System Group
Staff Engineer and Manager II
Developed patent worthy gap welding methodologies for microwave module fabrication using TMM10 and Duroid microwave substrates, developed environmental friendly cleaning methodologies for electronic production.
Dramatically improved wire bonding adhesion strength by using Auger analysis of hardened gold on GaAs MMIC chips resulting in high yield MMIC module boards.
Developed perimeter sealing schedule for ceramic packages, expertise in die shear testing for chip components.
Principal investigator for Air Force program for High Density Multilayer Interconnect (HDMI) using PBCB and copper metalization with expertise in planarization techniques involving spin coating and bias sputtering, thin film fabrication comprising sputter, electron beam, and thermal evaporation deposition, plasma and sputter etching and all aspects of negative and positive photoresist processes.
Manager for flight hardware electronic module production, including wire bonding, potting, marking, soldering, plating, high voltage encapsulation, conformal coating, PWB fabrication.
Developed wire bonding integrity analysis techniques for superior bonding strength.
Developed hermetic sealing methodologies to combat hydrogen related problem in gate sinking, threshold drifting problem in MMIC devices.
Invented techniques for minimized undercut in wet etching control through control of viscosity of etchant.
Cofounder of Hughes MCM (multichip module) program with expertise in all aspects of polyimide processing, planarization techniques, chip integration through patent worthy laser activated processes for metallization interconnection of chips on motherboard for propagation delay minimization.
Developed patent worthy methodology for hermetic sealing of entire wafer scale integrated wafer for electronic packaging.
Surface Mounted Device Techniques - developed IR flip chip bonding methodology for high density multilayer connect of devices and GaAs chips on microwave substrates.
Acousto-Optic Spectrum Analyzer - expertise in fabrication techniques including computer generation of geodesic lens profile and diamond turning of lens in LiNbO3 substrate.
Amorphous semiconductors - investigated As2S3 and other chalcogenide glasses for resist and waveguiding properties.
GaAs semicondutor Processing - developed chlorine and bromine based plasma etching processes for gallium arsenide MMIC.
Developed oxide planarization techniques for VHSIC program wafer fabrication.
Performed wafer fabrication diagnostic techniques using the acoustic microscope, knowledgeable on the laser scanned acoustic microscope for failure analysis methodologies.
Developed ultralight weight solar cell fabrication techniques through crystallographically aligned etching.
Proficiency in fabricating high ohm per square thin film resistor circuit elements through CrSiO sputter deposition. Expertise in stoichiometric deposition of Ta2N resistor elements through precise control of sputter deposition gas composition chemistry.
Rockwell International Jan.1978-Feb. 1979
Senior Engineer
Fiber Optics - design and fabrication of high-speed optical links intended for interoffice communication.
Exploration of new alternative laser printing technology using acousto-optic modulators and deflectors.
Research on newspaper counting techniques using optical edge counting and detection.
Teletype Corporation Jan. 1977-Jan. 1978
Senior Engineer
MOS diagnostics - expertise in characterization of MOS devices using C-V measurements, carrier lifetime and ion contamination measurement. Designed and fabricated special instrumentation for measuring total ion contamination of MOS oxides.
Zenith Radio Corp Sept. 1973-Jan. 1977
Research Engineer
Senior Design Specialist
IC Fabrication - responsible for consumer electronics application integrated circuit fabrication, performed design layout, testing, oxidation, diffusion, photolithography and etching steps in fabrication process.
Special Techniques for Component Fabrication - formulated new fabrication technique for TV picture tube shadow mask manufacture using acousto-optic modulator and deflector configured integrated raster scanned He-Cd laser for pattern generator.
World’s first semiconductor laser video disk player - as the youngest staff member, led a team of engineers in building the world’s first injection laser video disk playback system.
Fabricated the world’s first IC driven remote control for TV channel selection.
Video Disk Research- responsible for photodetection and laser section in video disk research group.
PATENTS
Three U.S. patents awarded, others filed and pending.
EDUCATION
Doctoral work University of Southern California 1980-1983
Department of Material Science and Physics
Doctoral work University of Illinois at Chicago 1973-1978
in Theoretical Solid State Physics PhD
many body theory, condensed matter physics
MS, Physics University of Illinois at Chicago 1973
MSEE University of Wisconsin-Madison 1970
BSEE University of California at Berkeley 1968
REFERENCES
References in addition to the following most recent coworkers/supervisors are available upon request:
Cyrus Yamin 818-***-**** *****.*****@***.***
Monica Minden 310-***-****, 317-5349 ********@***.***
Willie Ng 310-***-**** ****@***.***
Metin Mangir 310-***-**** *******@***.***
Other Activities
All church related
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