Mechanical Design Engineer

Altair Hypermesh

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VASANTHAN A R

MECHANICAL DESIGN ENGINEER

Dynamic and detail-oriented mechanical engineer with 5 years 4 months of hands-on experience in the Aerospace and Defense industries, specializing in airborne avionics, defense electronics, marine systems and ground support systems. Expertise in mechanical design, part modeling, sheet metal design, and injection molding part design, with a proven ability to create precise part and assembly drawings. Experience in New Product design & development, DFMEA, CAD/CAE, Structural and thermal analysis, Tolerance stack-up, DFM, Material Selection, product benchmarking. Core competency: Thermal analysis, thermodynamics, Strength of material, Structural Analysis & TOM. WORK EXPERIENCE

Sr Project Engineer

Wipro technologies / Cisco & Intel account - Bangalore 04/2024 - Present,

Achievements/Tasks

Involved in activities from concept design based on product requirements, prepares assembly instructions and part drawings, maintains in Teamcenter.

Involved in activities from concept design till First Customer Shipment of product.

Interaction with Contract Manufacturers, Clients and Suppliers to ensure hassle free product build.

Expertise in PLM Windchill, Agile PLM and Teamcenter.

Good knowledge in BOM Attribute tracking (BAT) tool.

Good knowledge in Engineering change orders, Manufacturing change orders, CPN, MPN creation, Providing deviation for build.

Involved in Pro-e cable routing.

Mechanical Design engineer

Data Patterns (India) Ltd. - Chennai

11/2019 - 04/2024,

Achievements/Tasks

Proficient in PCB mechanical design, including defining mounting constraints for both rigid and flexible PCBs through DXF and EMN (IDF) exchanges.

Collaborates extensively with PCB layout and hardware engineers on component placement, considering thermal and structural factors.

Extensive experience in designing airborne and defense products such as military and weather radar systems, while adhering to MIL-STD standards.

Skilled in designing LRU chassis according to ARINC standards (both air- and conduction- cooled), IP-rated enclosures, RF and digital modules (COTS), sheet metal & plastic enclosures, ground support systems, test jigs, and standard 19” racks.

Component in torque calculations for thermal and structural hand calculations, stack-up analysis, selecting heat sinks and cooling fans.

Experienced in selecting shock mounts, thermal pads, and Wedge-Lok components.

Knowledgeable in material selection, finishing processes and manufacturing techniques.

Good knowledge in thermal analysis of products using Flotherm and Icepak software.

Performed FEA simulation of structural analysis using Hyper Mesh, Optistruct software.

Design simulation for structural and thermal analysis using Ansys. Perform Computational flow dynamics (CFD) analysis to optimize heat accumulation inside product.

Experienced in overall PLM of defense avionics systems, including technical discussions, vendor communication, and documentation for preliminary and critical design reviews.

Competency: Tolerance stack-up, GD&T, CAD, CAE, Moldflow analysis, DFMA, DFMEA, Supplier co-ordination, RCA.

EDUCATION

Bachelor of technology, Mechanical Engineering

SASTRA University, Thanjavur

2015 - 2019, 80%

INTERESTS

LANGUAGES

CERTIFICATIONS

Injection molding Part design – Udemy certificate

Siemens NX Unigraphics (UG) fundamental 3D Modelling course – Udemy certificate

Altair Hypermesh: Meshing and linear static analysis – Udemy certificate SKILLS

PROJECTS

Design & Development of Electronic Warfare Systems for Fighter Aircraft

Radar Warning Receiver (RWR) and Airborne Early Warning and Control (AEW&C) system, designed for various fighter platforms including LCA Tejas and Sukhoi-30 as per ARINC ATR standard.

Challenges: fan selection and placement for effective cooling. Utilized forced convection with two 120 CFM airborne fans and ECS chilled air (10ºC at 18 CFM) for managing 600W power dissipation. Brazed fins were added over card guides for improved thermal management. Also focused on shock mount selection for resilience in airborne conditions. Design and Development of 3U,6U VPX/VME Modules,

Customized RF Modules

Designed many RF, power and Digital modules for 3U and 6U VPX form factor based on VITA 48.2 standard.

Learning: Mechanical PCB design considerations (Components placement, Mask opening, heat tower), Proper shielding with Nolato gasket for EMI/EMC compatibility. Design of Maritime Patrol Radar (MPAR)

MPAR is a versatile AESA based maritime surveillance airborne radar system for search and rescue missions for Dornier Aircraft platform.

Learning: The overall electronics dissipates around 1.8kW at heat sink. Heat sink is analyzed for various fin configurations (Straight, Staggered and Elliptical fins) and Fan positions to achieve efficient heat transfer at an ambient of 55 C. Design and development of Sonobuoy Receiver

Sonobuoy receiver is a rugged full ATR system integrated in aircrafts to detect anti submarines by sending signals.

appropriate frequency to ground station unit.

Shock mount selection– Impact of Shock loads during landing/takeoff of aircraft may affect system performance.

Designed as per ARINC 404A Standard.

Design and development of Network switches

Design and developed a 24 Port network switch will be mountable in 19-inch rack and usable as a standalone unit for testing purpose with an operating temperature of -5 to 55 deg Celsius and storage temperature of -40 to 85 deg Celsius.

This product has been designed to meet various ROHS Compliance and CE, CSA along with various standards.

The overall product dissipates heat around at heat sink by using TIM. Calculates Stack up tolerance to match compression ratio.

Design and development of GPU

Design and developed an 8U GPU System will be mountable in 19-inch rack and usable as a standalone unit for testing purpose which consists of 4U for CPU and 4U for GPU.

This GPU has been designed to do thermal testing to qualify Intel Ponte Vecchio chip 1100.

The overall heat dissipated from this unit through liquid cooling process by using quick disconnects along with anti-freezing agent as PG 25 and stamped heat sink.

This whole 8U GPU unit has been designed by referring Open Commute Project standard. Trekking

Tamil English Hindi

Siemens UG NX

Teamcenter

Flotherm

Catia V5

Snap fit design Agile (PLM)

*************@*****.*** 91-984******* Bengaluru, India https://www.linkedin.com/in/vasanthan-regu-43a116168/

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