Business Development Process

SHAFI ISLAM s Plano, TX s 469-***-**** Cell s ********@*****.*** s US citizen

Global “Process Re-Engineering” Acumen

Served world-class semiconductor manufacturing plants in Singapore, Japan, Malaysia, Philippines, Indonesia, South Korea, Taiwan, Europe & US in driving marketing initiatives for radical business process re-engineering and turnaround of ailing operations. Expertise in complex engineering, developing manufacturing automation and achieving step-function cost reductions by applying Lean and Six Sigma methodologies. Exemplary collaboration with Supply-Chain teams to enable seamless End-User acceptance within justifiable resources. Recruits, builds, motivates and institutes technical teams with ownership to deliver companywide continuous improvements for competitive edge.

Selected Highlights

Led turnaround of US/Indonesian factory by establishing 352 people 24/7 maintenance with 7X capacity increase while reducing costs by 33% [Advanced Interconnect Technologies - AIT]

Guided factory equipment/processes/materials overhaul saving millions towards $1 billion annual revenues [AMKOR /ANAM]

Increased plant capacity 4 fold to 120 million packages per month without adding people or space [Texas Instruments Malaysia]

Partnered with vital equipment/materials suppliers to reduce capital requirements by 35% and $120K/year savings [AIT]

Increased 24/7 factory equipment uptime over 97% by instituting “quick-change” replacement of critical sub-assemblies, while boosting technician skills through offline repair of faults [Advanced Interconnect Technologies]

Analyzed 700+ semiconductor assembly/packaging patents to identify manufacturing space without infringing industry claims and defended 30+ Patent Trade Office citations for coverage in 8 nations [Advanced Interconnect Technologies]

Areas of Expertise

Quality & Reliability Assurance Customer Interaction Cost Control & LEAN alignment

Business Development initiatives Complex Engineering Turnaround/Start-up Leadership

Equipment Automation Development Workforce Development Efficient/Effective Presentation

PROFESSIONAL SUMMARY

National Aquaculture Group, Al Leith, Makkah Region, Saudi Arabia – Head of Information Technology 2016 – Now

As Business Process Re-Engineering & Head of IT, is boosting and empowering information technology advancements in automation, simplification, security and major growth initiatives.

PARSEC Technologies Inc., Plano, Texas – Offshore Assembly/Packaging Consultant 2014 – 2015

Assessing, identifying & engaging Southeast Asian OSAT to establish first semiconductor IC manufacturing for aggressive cost cutting >5 times against US manufacturing base. Discontinued due to OSAT lagging to support RF test requirements.

ZARLINK Semiconductors Inc., Austin, TX - Individual contributor for new business development 2011 – 2011

Business Development of new generations of multi-chip packages with Technical Documentation, Qualification exercises and mitigating Customer End-Users. Business development support with quantifiable ranking of packaging capabilities against emerging market demands and established 3-year roadmaps for COMMUNICATION & MEDICAL Electronics

STATS ChipPAC Pte. Ltd., Singapore – Deputy Director of Research & Development 2008 to 2009

Business development of aggressive NPI for new business/revenue by late 2009.Developed next generation miniaturized packaging solutions by partnering with key SUPPLY-CHAIN teams to develop, source and implement capital equipment/processes/materials towards fault-free production introduction in Singapore, Malaysia & Thailand plants

Marketing Development of NPI (new product introduction) methodologies with early Factory & Customer engagements during R&D characterization phase.

Enabling major cost reduction initiative by replacing Au-wire with Cu-wire bond in supporting cost competitive markets

Directed SUPPLY-CHAIN process overhaul at material suppliers to re-engineer high density array Build-up substrates at 60% below cost

UNISEM/(AIT)/ASTRA, Sunnyvale, CA & Batam, Indonesia 1996 to 2008

Technology Consultant for Business & Manufacturing Developments– 2005 to 2008

Marketing Analysis of 700+ industry patents to establish infringement free manufacturing space; Defended 30+ Patent Trade Office citations on patents filed in 8 countries and Managed IP Portfolio and Supply-Chain technology developments

Contributed at Electronics Supply-Chain Association’s Executive Roundtable Conference with 32 top US corporations

Supported factory alignment on packaging advances; GREEN conversion and technical/white papers on industry trends

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SHAFI ISLAM s Plano, TX s 469-***-**** Cell s ********@*****.*** s US citizen

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Vice President of Engineering for Marketing & Business Development as– Sunnyvale, CA 2004 to 2005

Marketing & Business Developments of Robust & Emerging solutions with Customers pursuing 30-40% cost reduction using Build-up CSP/Flip-Chip:- Freescale, ON-Semi, Medtronics, Allegro, Delphi, Anadigics, SiRF, PhaseLink, Si-Core

Directed High performance Design of complex substrates; Technical Marketing; Awarded AP 2005 “Best Noble Package”.

Managed intellectual properties portfolio while analyzing and defending Patent Trade Office citations in 8 nations

Aligned with industry standards; participated in conferences; published technical paper and presented in MEPTEC

Negotiated Supply-Chain Partnerships with key suppliers to establish procurement edge for new equipment & materials

Director of Automation & R&D for Business Development (Batam, Indonesia) (TS16949 & ISO 9000 certified plant) 2001 to 2004

Established R&D Division for Business Development of QFN/CSP with Wire-Bonded, Flip-Chip & Cu-Pillar BUMPING

Supplier Development to successfully customize integrated AUTO-Lines for flexible QFN/CSP manufacturing advantage

Key inventor of 10 advanced CSP patents filed in 8 countries. Awarded 2002 AP “Best Special Package”.

Business Development & Marketing presentations at strategic European customers on new and enhance solutions.

Due-Diligence experience in evaluating potential acquisition of US factories in Malyasia, Philippines and Mexico

Equipment & Maintenance Manager (Batam, Indonesia - ISO 9000 certified) 1996 to 2000

Ccompany Turnaround by recruiting, training and developing 352 engineers/technicians/managers and implementing high density MATRIX assembly with integrated equipment automatio increasing factory capacity by 5-7 fold at cost reduction over 33%

AMKOR Electronics, Inc. Irving, TX – Director of Strategic Developments 1989 to 1992

Business Development through major factory overhaul to support rapid corporate sales growth from 300~400 million to exceed a $1 billion in revenues

Developed/implemented turnaround of strategic equipment, processes, materials & manufacturing technologies in Korean and Philippine plants including PQFP capacity scale-up from 500K to 10 millions per month

Seeded 10-year industry leadership by achieving major gains through MATRIX leadframe assembly, Low-stress multiplunger auto-molding, Low-stress multi-stage trim/form, Die-Mount/wire-bond upgrades, etc.

MICROSUN, Inc., Dallas, TX 1992 – 1996

Chief Operating Officer

Support services on manufacturing equipment design for lean manufacturing including design through prototyping, modifications & manufacture and providing temporary technical staffing to clients with pre- screened skilled hires

Provided capital equipment concepts, design, re-engineering and proto-typing to clients for 25-50% cost reductions

Developed sub-contracting of technical skills and talents for services at customers, limited in engineering resources

TEXAS INSTRUMENTS Incorporated Worldwide Locations - Progressive roles 1975 to 1989

Development Operations Manager– ASPC, TI, Dallas, TX (1985 – 1989)

Engineered, structured and installed Au-BUMPING facility and Flip-Chip interconnects for TAB packaging

Collaborated with Equipment makers/suppliers in Europe, Asia & US to create ASPC (Application Specific Packaging Center) in response to emerging very High-Lead count ASIC packaging demands

Met with 100+ Semiconductor Users, Makers, Assemblers, & Suppliers in Europe, Asia & USA to exchange emerging packaging techniques and trends and established a 10-year TI Assembly/Packaging/Test Roadmap

Assembly Operations Manager – Flexible Assembly Manufacturing System, Sherman, TX (1984 – 1985)

Developed, engineered, and launched operator-less “Made in USA” factory with integrated equipment technologies to compete against Japanese Semiconductor uprise; where mobile robots guided by grid of overhead cameras conducted material load/unload into equipment with software driven line scheduling, procurement for JIT delivery

Enhanced worldwide capacity and reduced costs through MATRIX High-density lead-frame & assembly development

Worldwide Lead-finishing Manager & Engineering Manager in Malaysia (1981– 1984)

Expanded Malaysia capacity four-fold to 120 million IC’s per month with no additional staff

Achieved 97.1% Assembly/Test yield from 88% chronic drag for more than a decade

Engineering & Cost Reduction Manager, Dallas, TX (1978 – 1981)

Studied TI Japan methodologies/practices to implemented worldwide developments and standardization

Funded internal and external resources to drive the development of emerging technologies for competitive cost edge

New Process Engineering Manager (1977–78); Bipolar Process Control/QRA Manager (1976–77): Quality Control Engineer (1975-77), Singapore

Bangladesh University of Engineering & Technology, Bangladesh Bachelor of Science Electrical Engineering

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