Electrical Engineer High Speed
Resume:
STEVEN CONG
Novi MI *****
********@*****.***
Tel:484-***-****
Experience
Hitachi Astemo (Farmington Hills, MI)
Staff Electrical Engineer 06/2022-O3/2025
-Lead EV Inverter RFQ/RFI review,design evaluation,support sales team quotation creation.
-Lead inverter hardware design include :SiC/IGBT Power module, Gate drive, High speed
analog/digital mixed system,CAN/Ethernet/SPI, DC/DC converter/Power system,function safety.
-LTspice/MathCAD Monte Carlo/Worst Case Analysis, DC/DC converter loop compensation WCA.
-LTspice fault simulation analysis in Transient/AC/DC mode;DFMEA,
-Schematic development,PCB layout,Signal/Power integrity,EMC/magnetic parts design and prototype
build/ lab test.
-Ansys HFSS/Q3D/SIWave/Twinbuilder simulation tool for SiC/IGBT module package analysis.
-Major lab equipment: LCR meter/Oscilloscope/Spectrum/Network analyzer.
BCS (Farmington Hill,MI) 02/2021-06/2022
Principal Electronics Engineer
-Lead EV wireless charger RFQ/RFI review,design evaluation,support for new business quotation...
-Responsible for EV Qi standard cell phone wireless charger R&D, DV, PV and hardware design
include:LLC converter,Gate driver,High speed analog/digital mixed system, CAN/SPI, DC/DC
converter/Power system,function safety..
-LTspice/MathCAD Monte Carlo/Worst Case Analysis, DC/DC converter loop compensation WCA.
-LTspice fault simulation analysis in Transient/AC/DC mode;DFMEA,
-PCB layout,High speed Signal/Power integrity,EMC/ESD/magnetic parts design.prototype/lab test.
-Ansys Maxwell simulation tool for wireless coupling analysis.
-LCR meter/Oscilloscope/Spectrum.
Lear (Southfield MI) 3/2015-02/2021
Senior Electrical Engineer
-Responsible for EV Powertrain power electronics system design,include onboard and Wireless
Charger,DC/DC Converter,Traction Inverter, Battery Management System.
-Design: LCL/ LLC inverter, PFC,,Si/SiC/IGBT gate driver,DC link capacitors, EMC filter
/magnetic parts,High speed analog/digital mixed system, DC/DC converter/power
system,function safety.
-LTspice/MathCAD Monte Carlo/Worst Case Analysis, DC/DC converter loop compensation WCA.
-LTspice fault simulation analysis in Transient/AC/DC mode;DFMEA,
-PCB layout,High speed Signal/Power integrity,EMC/ESD/magnetic parts design.prototype/lab test.
-Ansys Maxwell/HFSS simulation tool for magnetic pad design and antenna design.
-LCR meter/Oscilloscope/Spectrum/Network analyzer/EMC lab.
Technology Center Halliburton Wireline(Houston TX) 2/2012-2/2015
Principle Electrical Engineer
-Responsible for 175-210 degree Deg C Class D power amplifier, High speed analog/digital
mixed system, DC/DC converter/power system development for Oil Wireline Logging Tool
include:Multiple Component Induction Tool (MCI) and Magnetic Resonance Imaging Logging
Tool(LOGIQ).
-LTspice/MathCAD Monte Carlo/Worst Case Analysis, DC/DC converter loop compensation WCA.
-LTspice fault simulation analysis in Transient/AC/DC mode;FMEA,
-PCB layout,High speed Signal/Power integrity,EMC/ESD/magnetic parts design.prototype/lab test.
-LCR meter/Oscilloscope/Spectrum/Network analyzer .MATLAB,Ansys Maxwell/HFSS.
NUMAR Halliburton ( Exton, PA) 9/2006-2/2012
Analog Electrical Engineer
-Responsible for high temperature(175-210 deg C) Class D power amplifier, High speed
analog/digital mixed system, DC/DC converter/power system development for Oil Logging Tool
include:Multiple Component Induction Tool(Wireline) and 4 '' Magnetic Resonance Imaging
Logging Tool(LWD):
-LTspice/MathCAD Monte Carlo/Worst Case Analysis, DC/DC converter loop compensation WCA.
-LTspice fault simulation analysis in Transient/AC/DC mode;FMEA,
-PCB layout,High speed Signal/Power integrity,EMC/ESD/magnetic parts design.prototype/lab test.
-LCR meter/Oscilloscope/Spectrum/Network analyzer,MATLAB,Ansys Maxwell/HFSS.
ARTESYN TECHNOLOGIES( Framingham, MA) 3/2005 – 9/2006
Power Supply Project Engineer
-Responsible for telecommunication systems high frequency AC/DC, Multiphase DC/DC
converter design and development.
-LTspice/MathCAD analysis for closed loop analysis, power loss and thermal analysis, Worst
case analysis/DFMEA. EMI analysis.
-Power supply modeling (control IC, Magnetic parts design, gate driver) and simulation.
Project: 12V/48V MVR. 150W, 12V/52V 1200W
ECTROL, INC.(Toronto Canada) 3/2003 – 3/2005
Power Supply Design Engineer
-Responsible for Telecommunication analogy power supply system (major chip UC3854,
UC3825, UCC3895) and digital control communication circuit design, debug, test, current
sharing, control loop measurement and analysis, PCB layout and manufacture support.
-Magnetic components (Transformer and inductor) design, EMI measurement and debug and
thermal management and component worst case analysis.
-Digital power supply research: digital PFC, AC/DC, DC/DC control algorithm, current share
algorithm development and analysis under the MATLA/MathCAD/LTspice.
TURBO PROMOTE, INC.(Toronto Canada) 8/1999 – 5/2001
Electronics Engineer
-Responsible for DSP algorithm and filter, such as FIR/IIR/LMS/FFT/lead (PD) compensator/lag
(PI) compensator/combined (PID) compensator, design and simulation by MATLAB for control
instrument component products
-Implemented the algorithm, filter and communication protocol by assembly C, C++ in
TMS320C31 VxWorks 68000.
-OrCAD schematic capture and PCB layout.
AUTOMATIC INSTITUTE OF MACHINERY (Qingdao China) 8/1993 – 12/1998
Power Supply Design Engineer
-Developed PD, PI, PID control feedback loop compensation, signal processing algorithm by
power supplies and AC/DC motor based on specification.
Implemented the algorithm and digital filter by real-time in DSP chip TMS320C31 and
microprocessor 68000.
-Forward, Flyback, push-pull Transformer and DC inductor design, core and wire selection.
AC/DC Power supplies, analog amplifier and filter simulation and PCB layout.
QINGDO ELECTRONIC POWER CO., LTD(Qingdao China) 9/1983 – 7/1993
Power Supply Design Engineer
-Development of AC/DC, DC/DC such as Buck, Boost, Flyback, Forward, Push-pull, Half and
Full bridge.
-Designed common-mode EMI filter, output filter, rectifier and parameters determination.
-Designed power switch and driver based on BJT, MOSFET and IGBT.
-Thermal analysis and design: design required heatsink and heat removal consideration.
-PCB layout/EMC/EMI.
Education:
Bachelor: EE/Shandong University
Master:EE/University Of Toronto
Citizenship: US Citizen.
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