JEYALAKSHMI KANNIAH
Hardware Design Engineer
Phone:479-***-**** Email: ***********@*****.***
Summary :
Dynamic and goal-driven professional with 11+yrs of experience spanning a full range of Hardware board design, development, testing, EOL support & system level testing support across multiple platforms and environments
Professional Experience
Technical Lead
HCL America Solutions Inc - January 2023 to September 2023 Key Deliverables:
• Perform regular reviews on the BOM and do the scrubbing using the Silicon Expert tool
• Manage the BOM Portfolio
• Searching for new or replacement parts for High Risk Components (if part is EOL or Non-ROHS or Long Lead time or any other issues), technical information, second sources, etc. using industry standard and internal tools.
• Prepared the Like to Like Analysis and Provide the solutions for High Risk components
• Analysis of PCN's from manufacturers for impact to current fielded designs and Provide formal reports.
• Supported the supply chain costing analysis and share the formal reports. Technical Lead
HCL Technologies - October 2011 to April 2017
Key Deliverables:
• Performed design, and documentation of PCIe Gen1&2 FPGA based boards
• Compiled, analyzed and defined requirements.
• Identified required components and Defining initial cost
• Prepared the Power calculation and power section design
• Prepared the needed analysis like thermal, IO compatibility, SI analysis
• Developed Schematics and entry in Allegro Concept HDL.
• BOM generation and risk analysis and mitigation.
• Generating Netlist and coordinating with CAD engineer for Layout and review
• Performed board bring-up, DVT and system level integration.
• Identified and resolved key design issues to ensure full functionality and compliance with product requirements.
• Performed the EOL support
Hardware Engineer
Sanmina-Sci Pvt Ltd - April 2011 to September 2011 Key Deliverables:
• Creating the part number for new component and new modules
• EOL Support activities
Hardware Engineer
Nicheken Technologies Pvt Ltd - April-2007 to April 2011 Key Deliverables:
• Understanding the product requirement
• component selection and defining initial cost.
• Calculated overall power budget.
• Prepared the various type of analysis like power, thermal, IO compatibility
• Developed Schematics
• Symbol creation and Schematics entry in ORCAD.
• BOM generation and risk analysis
• Generating Netlist and completed the layout using the ORCAD tool
• Performed board bring up and supports system level integration testing Tools Used :
Schematic Entry Tool : ORCAD Capture and Concept HDL Layout Tool : Strong knowledge in Orcad, Basic knowledge in Allegro and Mentor expedition
Analysis Tool : FPGA Power Analysis,LTSpice, LTpowerCAD, Hyperlynx-SI & PI, Hspice BOM Scrubbing Tool : Silicon Expert tool and IHS
Educational Qualification:
* Bachelor of Engineering in Electronics & Instrumentation - (Anna University) April 2006