Manufacturing Engineer Process

JOSEPH GEOIA

Process/Manufacturing Engineer

*** *. ****** ****, *** 1, State College, PA 16803

Cell phone: 585-***-****

****-**@*******.***

B.S. in Ceramic Engineering from Rutgers University.

QUALIFICATIONS:

Process Engineer with over 30 years experience in ceramic electronic passive component (and related) manufacturing; (excluding silicon/ I.C. fabrication).

Worked at ceramic capacitor, resistor, & piezo component manufacturing facilities as well as dielectric powder, and vibration/accelerometer manufacturing facilities.

Main Areas of Oversight & Expertise: (all areas involved ISO9000 SOP Process Documentation)

Thin Film (sputtering) component metallization areas: Procured & maintained, precious metal deposition equipment, with process development for optimum metal adhesion & electrical performance on electronic substrates & piezo composites.

Precision Electronic Substrate Machining areas, involving diamond saw singulation and surface back-grinding and polishing on very delicate ceramic substrates. Also involved diamond saw blade & grinding wheel head formulation adjustments for optimum surface quality results. Also Blanchard surface grinding of large ceramic blocks.

Thick Film Termination Process areas: process machine procurement & process development to improve electrical properties & platability on MLCs & ceramic substrates. Worked with Heraeus to adjust termination ink formulations to improve MLC adhesion & electrical performance.

Capacitor/Dielectric Powder Processing: Large & small scale dielectric powder manufacturing involving milling, blending, drying and rotary furnace BaTiO3 creation with real time in-process PSD, XRD, XRF & Surface Area monitoring. At my first & second job I performed R&D of new ceramic capacitor formulations in X7R, NPO & Hi-Q types.

Thick Film Ceramic Resistor fabrication experience involving high precision Screen Printing and controlled atmosphere firing to make high ohmic/voltage/low VCR surface mount resistors.

Hermetic Electronic Feedthrough Connector Processing Area: metal connector: (Inconel, SS, & Ti), machining, pretreatment, glass formulation & firing process improvements & maintenance as it pertains to metal case accelerometer & sensor fabrication. Also conducted cross sectioning metrology to improve robustness of Laser welding of connectors to the outer metal case on sensor modules.

Ultransonic Cleaning Processes Improvements at all the companies I worked. Created better USC fixtures and improved chemicals to reduce rejects at downstream assembly & production process, all on limited budgets. These better cleaning fixtures involved CAD design (w/ GD&T), the outside or internal fabrication.

Surface Mount & Through Hole Circuit Board Fabrication involving resolution of pick & place, wave solder, & reflow oven, potting process problems.

Many Classes & Seminars in Six Sigma, (both green & Black belt) & Lean Manufacturing principles. Participation in 5S & Kaison Continuous Improvement Teams. Daily use of MS Office programs such as Excel, Word, PowerPoint, etc.

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PROFESSIONAL WORK EXPERIENCE:

State of the Art, Inc State College, PA 12/2023- present

Manufacturing Engineer

(fabrication of ceramic High Rel. RESISTORS for military and commercial applications)

TRS Technologies State College, PA 2015 – 9/2023

Process Engineer

(fabrication of piezo wafers & parts, for the medical imaging & vibration sensor industries)

Ferro Corp. Penn Yan, NY 2011 - 2014

Manufacturing Engineer

(large scale capacitor and dielectric powder production)

PCB Piezotronics Depew, NY 2008 - 2011

Manufacturing Engineer

(fabrication of vibration, pressure, & accelerometer sensors for industrial, military, automotive test sectors)

Z-Axis Inc. Phelps, NY 2006 - 2007

Manufacturing Engineer

(small scale contract circuit board manufacturing)

Ohmcraft Inc. Honeoye Falls, NY 2004 - 2006

Senior Process Engineer

(fabrication of high voltage, low VCR ceramic Resistors)

Dielectric Laboratories Inc., Cazenovia, NY 1993 - 2003

Process Engineer

(ceramic MLC chip (& single layer) Capacitor & substrate production)

Republic Electronic Corp., Wilkes-Barre, PA 1988 - 1993

Process Engineer

(small scale ceramic MLC chip Capacitor production)

EDUCATION:

B.S. Ceramic Engineering from Rutgers University (Piscataway, NJ)

References Furnished Upon Request.

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