Program Manager

Steven M. Czapski

Cell-512-***-**** http://www.linkedin.com/in/steveczapski ********@*********.***

PROFESSIONAL SUMMARY

Experienced Leader in Semiconductor Global Operations and New Product Development; offering a solid background in new product introduction, corporate quality and high volume manufacturing in the High Tech and Start-up Environments. Able to develop and execute business strategies for new products working with global cross functional teams. Experienced working with customers, manufactures and vendors to solve problems through the product life cycle; core competencies include:

Subcontractor Cost Negotiations Supply Chain Development Global Multi Site Management

Cost Reduction Strategies Productivity Improvement Program Management

Product Management Customer Relations Product Reliability

Six Sigma Quality Lean Deployment Risk Analysis & Avoidance

Organizational Management New Product Introduction Design Enablement

Manufacturing Engineering Global Product Regulation ISO Management

EMPLOYMENT HISTORY

GLOBALFOUNDRIES – Austin, Texas

2013 - Present

Sr. Member Technical Staff Program Management

Manage multi-product programs encompassing several different customer content with varying process requirements to release new products into consumer and commercial markets.

Manage Programs of new product releases in 14 nanometer technology, manage new designs release process to insure customer designs meet manufacturing requirements for successful product release.

Managed Customer design waivers requests for new designs to allow customer the best performance while reducing manufacturing risks in 14 nm technologies and below

Establish World Wide design waiver review process to control design manuals and manufacturing processes for all manufacturing technologies

Create strategies for the Advanced Assembly Site to perform manufacturing process development to take current and next generation silicon technologies into high volume manufacturing

Generate joint agreements for new manufacturing process/equipment development with vendors and out sourced manufacturers to enhance GLOBALFOUNDRIES silicon offerings for customers and assist out sourced assembly sites for product development

ADVANCED MICRO DEVICES (AMD) – Austin, Texas

2012 - 2013

Sr. Program Manager Corporate Quality

Develop business processes and procedures for constant improvement to quality, cost and execution of new product development and market introduction, working with customers for product requirements and specification to design products that meet market expectations

Developed new product Initial Production sign-off policy to insure quality metrics are met per customer requirements

Managed Customer Critical Situation for driver software issue to keep customer manufacturing line up and running

Approved Richland Product Laptop reliability testing to meet customer commits by updating end product usage model for the required FIT rate

BAYCO PRODUCTS INC. – Wylie, Texas

2010 - 2012

Director Global Operations, Corporate Quality & Product Development

Directed manufacturing, corporate quality, USA and China operations, marketing research, product development, design and engineering for commercial and consumer lighting products.

Launched 8 new products into newly assigned factories hitting a 9 months product development cycle

Performed in-depth market analysis to baseline Intrinsically Safe, Public Safety, Industrial and Consumer LED lighting product lines

Contracted 5 new manufacturing sites for the development and production of new LED line of products

Converted LED products to RoHS compliance for European sales expanding sales regions

Passed QAN/QAR site audit to maintain ATEX and IECEx Intrinsically Safe certification for LED products at US assembly site

Initiated and improved factory quality procedures to eliminate 100% incoming inspection at US distribution center

Achieved IECEx and ATEX certifications on four Intrinsically Safe LED products expanding sales to Europe and Australia

Set up Burn-In activities and factory outgoing 100% inspection allowing for shipping direct ship F.O.B. China factories

Moved all UL and FM listings to ETL for cost savings of 120K dollars per year centralizing compliance certifications

FREESCALE SEMICONDUCTOR – Austin, Texas

2005 - 2010

Design and Development Manager – 2009 to 2010

Managed a multi-functional global organization of engineers responsible for semiconductor package design and assembly for the introduction of new products into Medical, Automotive, Industrial, and Consumer markets; responsible for technology development, hardware design, electrical and thermal modeling, manufacturing, business unit and customer support

Extended BPGA design capability to off shore China design house to free up U.S. resources for complicated co-designs

Delivered 241 designs with better than 98% on time delivery and 0% error rate

Established common electrical modeling tools across all business groups, reduced cost, standardized analysis and training

Designed 77 Gig millimeter wave package antenna for automotive collision avoidance technology

Electrically simulated and adjusted 100% of NPI High Performance substrate designs to meet electrical constraints

Exercised Lean Fundamentals to achieve 20% designer time savings from 2009 baseline resulting in a decreased backlog of Document Action Request and eliminating the need for more resources

Initiated Lean fundamentals; Document Action Request rework rate down from 280% to 25%

Global Manufacturing Engineering and Design Manager – 2007 to 2009

Managed a multi-functional global organization of engineers responsible for semiconductor package design and assembly, new product introduction and manufacturing support delivering products into Medical, Automotive, Industrial and consumer markets; responsible for technology introduction into manufacturing, business unit and customer product support

Transferred all CMOS 90 Flip Chip NPI’s from KLM to ASEKH assembly site to establish external manufacturing site

Managed process modification to medical sensor device at Amkor Philippines assembly site to meet customer qualification requirements

Drove root cause analysis for sensor failures at ASE Korea developing stable process for die attach process to meet customer sample date

Completed introduction of BOT, DAF and.4mm sphere projects in TJN China assembly site for technology expansion

Completed RCP development and initial commercial qualification of 3 NPI’s, RCP Tempe pilot line to qualify new packaging technology for reduced cost and increased design complexity

Established Product Transfer Methodology with Zero Defect & Safe Launch concept into RCP, LGA Sensors and low-K high performance substrate devices for successful product launch and cost reduction

Product Engineering Manager – 2005 to 2007

Led the Industrial Networking Product Line working with global teams for new product introduction and legacy product support, responsibilities included P&L management, sales and customer support

CONSULTING – Austin, Texas

2001 - 2005

CMOS Semiconductor Technology, Engineering, Global Operations and Quality

Worked for start-ups and privately held semiconductor design companies to establish supply chains with global contract manufacturers for the purpose of product development and introduction into high volume manufacturing

Established base line costs for product manufacturing including engineering and production builds, test development and product qualification

Qualified Asian subcontractor factories for high volume manufacturing

Obtained intellectual property, technology information and negotiated contract agreements for cost and product delivery with subcontractors and suppliers

Analyzed design requirements for best product development, overall cost and manufacturing fit

D2AUDIO CORPORATION – Austin, Texas

Manager: Global Operations, Product Development, Engineering and Corporate Quality – 2002 to 2004

Oversaw new product introductions from concept through design and into high volume manufacturing

Selected Foundry, Assembly, Test and Analytical facilities to establish business relationships for engineering and production of D2Audio’s Marco Audio DSP Device reducing overall initial costs by 25%

Worked with Test Spectrum, UTAC and D2Audio Internal Design Team to increase final test yield by 30%.

Developed a modified device qualification plan using factory provided data to reduce costs and time to product launch

Worked with marketing and sales for product collateral needed for customer engagements.

Started the development of the company’s quality system for future ISO certification

Moved Marco test and final development to UTAC, the offshore testing site, reducing test cost by 15%

Engaged with several high voltage foundries for SOI and CMOS technologies capable of producing a high voltage RF device (above 100 volts) for future D2Audio digital amplifier requirements

Worked closely with the mechanical design team to re-design and manufacture the required mechanicals for the X-series Audio Amplifier Modules, reduced NRE and manufacturing costs by over 50%, reduced development time by 3 weeks

CIRRUS LOGIC, INC. – Austin, Texas

1993 - 2001

Director, Foundry Technology Operations and Engineering - 2000 to 2001

Led a global cross functional engineering & business organization responsible for new technology introduction, product development, qualification and new product introduction into high volume manufacturing, working with marketing, sales and product line managers for customer engagement

Negotiated long and medium term supplier contracts for intellectual property, engineering and production lower costs

Conducted supplier audits per ISO specifications for approved vendor list status, participated in QBR’s to review and set strategic and tactical goals for each supplier

Developed worldwide strategies for product development which supported annual revenue of $700 million

Transferred .25 and .35-micron technology product lines from joint venture foundries into pure play foundries (TSMC, UMC, Hynix, and Chartered) developing strategic relationships while realizing an average cost savings of $600.00 per wafer plus an increase in overall yields

Qualified CSMC-HJ, a Chinese Foundry, as strategic partner for lower technology devices; thereby developing multiple sources for several technologies and product lines while lowering wafer costs by $350.00

Established two business groups and one engineering team in Austin, Texas, centralizing corporate functions

Director, Device Physics Operations – 1998 to 2000

Managed Device Physics & Reliability Analysis Laboratories located in Austin, Texas and Fremont, California to provide electrical and physical analysis of sub-micron CMOS integrated circuits for manufacturing, product and customer support.

Provided device analysis and design modification support for a large portfolio of analog and digital devices including current .25 technology and developmental .18 technology

Interfaced with customers, design, product test engineering, foundry and assembly groups to solve Design, Yield and EFR issues, process fallout and customer returns

Communicated on daily bases with a major Japanese customer to solve a 5% field failure rate problem, discovered root cause, and formulated corrective action and final closure

Device Physics/Reliability Laboratory Manager - 1993 to1998

MOTOROLA – Austin, Texas

1989 - 1993

Staff Engineer, Member of the Technical Ladder, Reliability & Quality Department

TEXAS INSTRUMENTS – Lubbock, Texas

1984 - 1989

Reliability & Quality Engineer/Laboratory Supervisor

MILITARY SERVICE

United States Air Force

Sargent - Honorable Discharge

Top Secret Clearance

Precession Measurement Equipment Specialist

EDUCATION/TRAINING

Texas Tech University – Lubbock, Texas

B.S., Electrical Engineering Technology

Community College of the Air Force – Bergstrom AFB, Austin, Texas

Associate Degree in Electronic System Technology

Over 600 hours of Technical and Managerial Development Courses

PATENTS

“Double Shield for Electron and Ion Beam Columns”

Patent Issued Oct 2nd 2001 Patent # 6,297,512

PUBLICATIONS

“Packaging Design for 77 GHz”

Freescale TEM Tempe Poster Secession 2010

“Analog Circuit Modifications using FIB System”

Schlumberger, IDS User Conference 1995

“Methodology for Auger Depth Profile Analysis of a Specific Sub-Micron Contact from the Backside”

MATS 1992

“Disclosure No. 1050-Plasma Etch I.C. Holder”

Motorola’s Technical Developments, March 1991

“Focused Ion Beam Applications for Design and Product Analysis”

Proceedings of the 17th International Symposium for Testing and Failure Analysis

(ISTFA) November 1991

PROFESSIONAL DEVELOPMENT

7 Habits of Highly Effective People Factory Physics

Foundational Foundry Leadership Leading Cross-Functional Teams

Design of Experiments/Taguchi Methods Leading Digital Six Sigma

Lean Logic Lean Value

Lean Value Stream Mapping Six Sigma Black Belt

Accelerated Life Testing/Failure Mechanisms Six Sigma Foundations

Six Sigma DMAIC Reliability Engineering

Statistical Process Control I Strategy Simulation for Managers

Managing Within the Law Sales Methodology Overview for Marketing

Making Great Leaders – Managers Experience Particle Prod. Management Requirements

An Introduction to Project Management PMP Boot Camp and Best Practices

HMM02 - Business Case Development HMM01- Budgeting

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